JPWO2024004783A1 - - Google Patents

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Publication number
JPWO2024004783A1
JPWO2024004783A1 JP2024530735A JP2024530735A JPWO2024004783A1 JP WO2024004783 A1 JPWO2024004783 A1 JP WO2024004783A1 JP 2024530735 A JP2024530735 A JP 2024530735A JP 2024530735 A JP2024530735 A JP 2024530735A JP WO2024004783 A1 JPWO2024004783 A1 JP WO2024004783A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024530735A
Other languages
Japanese (ja)
Other versions
JP7643644B2 (ja
JPWO2024004783A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024004783A1 publication Critical patent/JPWO2024004783A1/ja
Publication of JPWO2024004783A5 publication Critical patent/JPWO2024004783A5/ja
Application granted granted Critical
Publication of JP7643644B2 publication Critical patent/JP7643644B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024530735A 2022-06-30 2023-06-21 伸縮デバイス Active JP7643644B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022106362 2022-06-30
JP2022106362 2022-06-30
PCT/JP2023/022959 WO2024004783A1 (ja) 2022-06-30 2023-06-21 伸縮デバイス

Publications (3)

Publication Number Publication Date
JPWO2024004783A1 true JPWO2024004783A1 (https=) 2024-01-04
JPWO2024004783A5 JPWO2024004783A5 (https=) 2025-02-28
JP7643644B2 JP7643644B2 (ja) 2025-03-11

Family

ID=89382262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530735A Active JP7643644B2 (ja) 2022-06-30 2023-06-21 伸縮デバイス

Country Status (4)

Country Link
US (1) US20250120012A1 (https=)
JP (1) JP7643644B2 (https=)
CN (1) CN119452737A (https=)
WO (1) WO2024004783A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025173538A1 (ja) * 2024-02-13 2025-08-21 株式会社村田製作所 伸縮性デバイス
WO2025249078A1 (ja) * 2024-05-27 2025-12-04 株式会社村田製作所 伸縮性デバイス

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009081929A1 (ja) * 2007-12-26 2009-07-02 Fujikura Ltd. 実装基板及びその製造方法
WO2017065270A1 (ja) * 2015-10-16 2017-04-20 国立研究開発法人科学技術振興機構 応力緩和基板及びテキスタイル型デバイス
JP2017143257A (ja) * 2016-02-05 2017-08-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP2018186214A (ja) * 2017-04-27 2018-11-22 セイコーエプソン株式会社 伸縮性回路基板およびひずみセンサー
JP2019029514A (ja) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 配線デバイスおよびひずみセンサー
WO2022070624A1 (ja) * 2020-09-29 2022-04-07 株式会社村田製作所 伸縮性実装基板及び伸縮性実装基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009081929A1 (ja) * 2007-12-26 2009-07-02 Fujikura Ltd. 実装基板及びその製造方法
WO2017065270A1 (ja) * 2015-10-16 2017-04-20 国立研究開発法人科学技術振興機構 応力緩和基板及びテキスタイル型デバイス
JP2017143257A (ja) * 2016-02-05 2017-08-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP2018186214A (ja) * 2017-04-27 2018-11-22 セイコーエプソン株式会社 伸縮性回路基板およびひずみセンサー
JP2019029514A (ja) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 配線デバイスおよびひずみセンサー
WO2022070624A1 (ja) * 2020-09-29 2022-04-07 株式会社村田製作所 伸縮性実装基板及び伸縮性実装基板の製造方法

Also Published As

Publication number Publication date
JP7643644B2 (ja) 2025-03-11
CN119452737A (zh) 2025-02-14
WO2024004783A1 (ja) 2024-01-04
US20250120012A1 (en) 2025-04-10

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