JPWO2024004783A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2024004783A5 JPWO2024004783A5 JP2024530735A JP2024530735A JPWO2024004783A5 JP WO2024004783 A5 JPWO2024004783 A5 JP WO2024004783A5 JP 2024530735 A JP2024530735 A JP 2024530735A JP 2024530735 A JP2024530735 A JP 2024530735A JP WO2024004783 A5 JPWO2024004783 A5 JP WO2024004783A5
- Authority
- JP
- Japan
- Prior art keywords
- stretchable
- elastic
- wire
- wiring
- extension direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000012815 thermoplastic material Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022106362 | 2022-06-30 | ||
| JP2022106362 | 2022-06-30 | ||
| PCT/JP2023/022959 WO2024004783A1 (ja) | 2022-06-30 | 2023-06-21 | 伸縮デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004783A1 JPWO2024004783A1 (https=) | 2024-01-04 |
| JPWO2024004783A5 true JPWO2024004783A5 (https=) | 2025-02-28 |
| JP7643644B2 JP7643644B2 (ja) | 2025-03-11 |
Family
ID=89382262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530735A Active JP7643644B2 (ja) | 2022-06-30 | 2023-06-21 | 伸縮デバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250120012A1 (https=) |
| JP (1) | JP7643644B2 (https=) |
| CN (1) | CN119452737A (https=) |
| WO (1) | WO2024004783A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025173538A1 (ja) * | 2024-02-13 | 2025-08-21 | 株式会社村田製作所 | 伸縮性デバイス |
| WO2025249078A1 (ja) * | 2024-05-27 | 2025-12-04 | 株式会社村田製作所 | 伸縮性デバイス |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2234466B1 (en) | 2007-12-26 | 2019-04-10 | Fujikura Ltd. | Mounting board and method of producing the same |
| WO2017065270A1 (ja) * | 2015-10-16 | 2017-04-20 | 国立研究開発法人科学技術振興機構 | 応力緩和基板及びテキスタイル型デバイス |
| JP6982959B2 (ja) * | 2016-02-05 | 2021-12-17 | 日本メクトロン株式会社 | 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法 |
| JP2018186214A (ja) * | 2017-04-27 | 2018-11-22 | セイコーエプソン株式会社 | 伸縮性回路基板およびひずみセンサー |
| JP2019029514A (ja) * | 2017-07-31 | 2019-02-21 | セイコーエプソン株式会社 | 配線デバイスおよびひずみセンサー |
| WO2022070624A1 (ja) | 2020-09-29 | 2022-04-07 | 株式会社村田製作所 | 伸縮性実装基板及び伸縮性実装基板の製造方法 |
-
2023
- 2023-06-21 WO PCT/JP2023/022959 patent/WO2024004783A1/ja not_active Ceased
- 2023-06-21 CN CN202380050370.3A patent/CN119452737A/zh active Pending
- 2023-06-21 JP JP2024530735A patent/JP7643644B2/ja active Active
-
2024
- 2024-12-17 US US18/983,657 patent/US20250120012A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2024004783A5 (https=) | ||
| US6838767B2 (en) | Semiconductor device | |
| KR102677593B1 (ko) | 인터커넥트 구조를 포함한 스택 패키지 | |
| US8129222B2 (en) | High density chip scale leadframe package and method of manufacturing the package | |
| JP2007538412A (ja) | ワイヤーボンドを相互接続するための実装密度2倍化方法 | |
| CN114242694A (zh) | 半导体装置 | |
| JP2004103843A (ja) | 電子素子およびその電子素子を用いた電子装置 | |
| US7872358B2 (en) | Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device | |
| JPWO2023238754A5 (https=) | ||
| US20080157324A1 (en) | Stacked die package with die interconnects | |
| JPWO2023032329A5 (https=) | ||
| CN1961415A (zh) | 灵活的引线框架结构以及形成集成电路封装件的方法 | |
| JPH05152353A (ja) | 半導体素子搭載用基板 | |
| US9905517B2 (en) | Semiconductor device | |
| CN101431067B (zh) | 多芯片堆叠的封装结构 | |
| TWI802590B (zh) | 電感器及其製造方法 | |
| US8344497B2 (en) | Semiconductor package and electronic device having the same | |
| CN118919512A (zh) | 包括联接到迹线图案的辅助导体的半导体封装 | |
| US7091594B1 (en) | Leadframe type semiconductor package having reduced inductance and its manufacturing method | |
| CN101656247A (zh) | 半导体封装结构 | |
| US20070029663A1 (en) | Multilayered circuit substrate and semiconductor package structure using the same | |
| JPWO2021006037A5 (https=) | ||
| CN115767883B (zh) | 线路板连接结构及其制作方法 | |
| JP7443875B2 (ja) | 伸縮性電子部品及び伸縮性電子部品実装基板 | |
| CN119560474A (zh) | 一种封装基板以及芯片封装结构 |