CN119452737A - 伸缩器件 - Google Patents

伸缩器件 Download PDF

Info

Publication number
CN119452737A
CN119452737A CN202380050370.3A CN202380050370A CN119452737A CN 119452737 A CN119452737 A CN 119452737A CN 202380050370 A CN202380050370 A CN 202380050370A CN 119452737 A CN119452737 A CN 119452737A
Authority
CN
China
Prior art keywords
wiring
expansion
telescopic
stretchable
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380050370.3A
Other languages
English (en)
Chinese (zh)
Inventor
小幡孝义
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN119452737A publication Critical patent/CN119452737A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
CN202380050370.3A 2022-06-30 2023-06-21 伸缩器件 Pending CN119452737A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-106362 2022-06-30
JP2022106362 2022-06-30
PCT/JP2023/022959 WO2024004783A1 (ja) 2022-06-30 2023-06-21 伸縮デバイス

Publications (1)

Publication Number Publication Date
CN119452737A true CN119452737A (zh) 2025-02-14

Family

ID=89382262

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380050370.3A Pending CN119452737A (zh) 2022-06-30 2023-06-21 伸缩器件

Country Status (4)

Country Link
US (1) US20250120012A1 (https=)
JP (1) JP7643644B2 (https=)
CN (1) CN119452737A (https=)
WO (1) WO2024004783A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025173538A1 (ja) * 2024-02-13 2025-08-21 株式会社村田製作所 伸縮性デバイス
WO2025249078A1 (ja) * 2024-05-27 2025-12-04 株式会社村田製作所 伸縮性デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2234466B1 (en) 2007-12-26 2019-04-10 Fujikura Ltd. Mounting board and method of producing the same
WO2017065270A1 (ja) * 2015-10-16 2017-04-20 国立研究開発法人科学技術振興機構 応力緩和基板及びテキスタイル型デバイス
JP6982959B2 (ja) * 2016-02-05 2021-12-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP2018186214A (ja) * 2017-04-27 2018-11-22 セイコーエプソン株式会社 伸縮性回路基板およびひずみセンサー
JP2019029514A (ja) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 配線デバイスおよびひずみセンサー
WO2022070624A1 (ja) 2020-09-29 2022-04-07 株式会社村田製作所 伸縮性実装基板及び伸縮性実装基板の製造方法

Also Published As

Publication number Publication date
JP7643644B2 (ja) 2025-03-11
JPWO2024004783A1 (https=) 2024-01-04
WO2024004783A1 (ja) 2024-01-04
US20250120012A1 (en) 2025-04-10

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