WO2017065270A1 - 応力緩和基板及びテキスタイル型デバイス - Google Patents
応力緩和基板及びテキスタイル型デバイス Download PDFInfo
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- WO2017065270A1 WO2017065270A1 PCT/JP2016/080527 JP2016080527W WO2017065270A1 WO 2017065270 A1 WO2017065270 A1 WO 2017065270A1 JP 2016080527 W JP2016080527 W JP 2016080527W WO 2017065270 A1 WO2017065270 A1 WO 2017065270A1
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- Prior art keywords
- stress relaxation
- circuit board
- wiring
- substrate
- layer
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Definitions
- the present invention relates to a stress relaxation substrate and a textile type device. This application claims priority on October 16, 2015 based on Japanese Patent Application No. 2015-204499 for which it applied to Japan, and uses the content here.
- Patent Document 1 describes a garment provided with a sensor for tracking and managing the performance of an individual performing athletic activity.
- Patent Document 2 describes a clothing in which a wiring portion is integrally provided on a fabric body. It is described that by providing the wiring portion integrally with the fabric body, it is difficult to disconnect the wiring portion and hinder the wearer's operation.
- Patent Document 3 describes a clothing in which a plurality of motion sensors such as an acceleration sensor are arranged throughout the body.
- Patent Document 4 describes that an electrode attached to a subject and a monitoring device are connected by a connector and output to the outside.
- Patent Document 1 describes that physiological data is transmitted and received to the outside using a transceiver connected to the sensor
- Patent Document 2 describes that information is transmitted to the outside wirelessly using a transmission module connected to the sensor. Sending is described.
- Patent Document 3 describes a system for connecting to communication means via a controller.
- the present invention has been made in view of the above circumstances, and an object of the present invention is to realize a textile device capable of appropriately measuring information even when used in a complicatedly operating portion, washing, or the like. . Another object is to realize a stress relaxation substrate for realizing a textile type device.
- the present inventors have found that the information is not properly transmitted to the external output means due to use in complicated places, washing, etc., due to the disconnection of the wiring.
- the disconnection of the wiring occurs at the connection portion between the circuit board and the cloth rather than the circuit board or the cloth. That is, it has been found that the wiring at the connection portion between the circuit board and the cloth body is disconnected by receiving stress due to the difference in hardness and stretchability between the circuit board and the cloth body. That is, in order to solve the above problems, the present invention employs the following means.
- a stress relaxation substrate is a stress relaxation substrate disposed between a cloth body having wiring and a circuit board, and is harder than the cloth body and softer than the circuit board.
- the bendability of the stress relaxation substrate may be greater than the bendability of the circuit board and the cloth body.
- the adhesive layer may be a thermoplastic resin layer.
- the conductive portion includes a via wiring provided in a through hole that penetrates the stress relaxation layer and the adhesive layer. But you can.
- the conductive portion includes a conductive yarn that penetrates the stress relaxation layer and the adhesive layer and is partially exposed on both surfaces. May be included.
- the circuit board installation region is provided at a central portion in plan view, and the conductive layer extends from the outer periphery toward the circuit board installation region.
- the part may be disposed.
- the wiring density of the conductive portion may increase from the outer periphery toward the circuit board installation region.
- the cloth body has a hardness of 10 N / m or more and 1000 N / m or less, and the hardness of the circuit board. Is 3.0 ⁇ 10 5 N / m or more and 7.5 ⁇ 10 5 N / m or less, the stress relaxation layer has a hardness of 1000 N / m or more and 3.0 ⁇ 10 5 N / m or less.
- the bendability of the cloth body 10 is 1.0 ⁇ 10 ⁇ 10 N ⁇ m or less
- the bendability of the circuit board is 1.0 ⁇ 10 ⁇ 4 N ⁇ m or more and 5.0 ⁇ 10 ⁇ 3 N
- the bendability of the stress relaxation layer may be 5.0 ⁇ 10 ⁇ 3 N ⁇ m or more and 0.5 N ⁇ m or less.
- a stress relaxation substrate is a stress relaxation substrate including a stress relaxation layer, an adhesive layer provided on one surface of the stress relaxation layer, and a conductive part, wherein the conductive part Is disposed over the first surface and the second surface of the stress relaxation substrate, and the stress relaxation layer has a hardness of 1000 N / m or more and 3.0 ⁇ 10 5 N / m or less, and the stress relaxation layer The bendability is 5.0 ⁇ 10 ⁇ 3 N ⁇ m or more and 0.5 N ⁇ m or less.
- a textile device is disposed between a cloth body having stretchable wiring, a circuit board on which circuit wiring is formed, and the cloth body and the circuit board (1).
- the stretchable wiring and the circuit wiring are connected by the conductive portion of the stress relaxation board.
- the wiring density of the conductive portion may increase toward the circuit board in plan view.
- an area of the stress relaxation substrate is larger than an area of the circuit substrate, and the circuit substrate is seen in plan view as the stress relaxation substrate. It may be arranged at a position overlapping with.
- the deformation of the circuit board can be relaxed.
- the textile-type device which concerns on 1 aspect of this invention, use in the part which operate
- FIG. 1 is a schematic cross-sectional view in which a peripheral portion of a circuit board of the textile device according to the first embodiment is enlarged.
- the textile type device 100 includes a cloth body 10, a circuit board 20, and a stress relaxation board 30.
- the cloth body 10 is a soft cloth 11 having stretchability provided with stretchable wirings 12 at predetermined positions.
- the stretchable wiring 12 may be formed on one side of the cloth 11 or may extend over both sides of the cloth 11 as a wiring sewn with a conductive thread.
- the material used for the cloth 11 can be appropriately selected depending on the application, and is not particularly limited. For example, cotton, silk, rayon, polyester, nylon, acrylic, polyurethane and the like can be used.
- the cloth 11 is preferably made of polyurethane. Polyurethane is highly stretchable and highly conformable. Therefore, by using polyurethane for the cloth 11, the contact area with the surface to be measured can be increased, and the measurement sensitivity can be increased.
- the stretchable wiring 12 transmits information from a sensor (not shown) to the circuit board 20.
- the sensor is installed at a predetermined part to be measured.
- the information obtained there is transmitted to external output means (not shown) disposed on the circuit board 20 via the stretchable wiring 12. Therefore, the stretchable wiring 12 has stretchability that can cope with the shape change.
- the stretchable wiring 12 having stretchability means that the conductivity when the shape changes by 10% or more is in the range of 1/10 to 10 times the conductivity before the change.
- the change in conductivity is 1/10 to 10 times when the shape changes by 50%.
- the stretchability is preferably 30% or more, more preferably 50% or more, and particularly preferably 100% or more.
- conductive thread for example, carbon nanotubes mixed with an elastic resin together with an ionic liquid, or silver flakes dispersed in a solution obtained by dissolving a fluororubber material and a surfactant in a solvent can be used.
- the circuit board 20 has a base material 21 and circuit wiring 22.
- An adhesive layer 23 for bonding is provided between the circuit board 20 and the stress relaxation layer 30.
- the base material 21 is harder and less stretchable than the cloth body 10. This is because the circuit wiring 22 needs to be drawn on the base material 21 with high density. Information from each sensor is collected on the circuit board 20. Therefore, the density of the circuit wiring 22 with respect to the whole base material 21 becomes high.
- the base material 21 also functions as a support part for the external output means. Also from this viewpoint, the base material 21 needs to be harder and less stretchable than the cloth body 10.
- the base material 21 is not particularly limited as long as the high-density circuit wiring 22 can be drawn, but a flexible printed board is preferably used.
- the flexible printed circuit board is widely used for electronic parts such as a display, and can draw the circuit wiring 22 with a thin line and has high reliability. Further, the flexible printed circuit board does not have the degree of freedom of deformation as the cloth body 10, but can follow a certain degree of deformation. Therefore, when this flexible printed circuit board is used as the base material 21, it is possible to reduce a sense of incongruity when the textile device 100 is mounted.
- the circuit wiring 22 can be obtained by a known means. As a material used for the circuit wiring 22, copper, silver, gold, aluminum, or the like can be used.
- the wiring pattern of the circuit wiring 22 can be set as necessary. For example, when the number of the stretchable wirings 12 is large, the wiring pattern of the circuit wirings 22 may be set so that input information is subjected to matrix conversion. By setting the wiring pattern in this way, the number of output terminals to the external output means can be reduced.
- the adhesive layer 23 is not particularly limited as long as it can adhere the circuit board 20 and the stress relaxation board 30.
- a thermoplastic adhesive In consideration of washing the textile device 100, it is preferable to use a thermoplastic adhesive.
- the thermoplastic adhesive is melted by heat and welds the circuit board 20 and the stress relaxation board 30. Therefore, adhesive strength is high and water resistance is also high.
- the stress relaxation substrate 30 is disposed between the cloth body 10 and the circuit board 20.
- the stress relaxation substrate 10 includes a stress relaxation layer 31, an adhesive layer 32, and a conductive thread 33.
- the conductive yarn 33 is an aspect of the above-described “conductive portion disposed across the first and second surfaces of the stress relaxation substrate”.
- the stress relaxation layer 31 is harder than the cloth body 10 and softer than the circuit board 20.
- stress concentrates on the connection portion between the cloth body and the circuit board having different hardnesses. Therefore, when a large elongation is applied to the textile-type device, a large distortion occurs in the connecting portion, and the disconnection or breakage of the connecting portion occurs.
- the stress relaxation substrate 100 having the stress relaxation layer 31 having an intermediate hardness between the cloth body 10 and the circuit board 20 is disposed between the cloth body 10 and the circuit board 20, the cloth body 10 and the circuit board 20.
- the stress applied to the connecting portion can be relaxed. As a result, disconnection and breakage of the connecting portion can be avoided.
- the hardness of the stress relaxation layer 31 can be appropriately set according to the hardness of the cloth body 10 and the circuit board 20 to be used.
- the hardness H can be expressed by the following formula (1), where E is the Young's modulus and t is the film thickness.
- the method for measuring the film thickness is not particularly limited, such as micrometer and cross-sectional observation with a microscope, but in the case of a sample that is not a continuous body, a value measured with a micrometer is preferable.
- the stress relaxation layer 31 is preferably more flexible than the cloth body 10 and the circuit board 20. Changes in the shape of the textile-type device 100 include a shape change caused by elongation as described above and a shape change caused by bending. If the bendability of the stress relaxation layer 31 is greater than that of the cloth body 10 and the circuit board 20, deformation of the cloth body 10 and the circuit board 20 can be suppressed even when a force that bends the textile device is applied.
- the bendability of the stress relaxation layer 31 can be appropriately set according to the bendability of the cloth body 10 and the circuit board 20 to be used.
- the bendability D can be expressed by the following formula (2), where Young's modulus is E, Poisson's ratio is ⁇ , and film thickness is t.
- the description of the “stress relaxation layer harder than the cloth body and softer than the circuit board” of the present invention is “the hardness obtained by the formula (1) of the present invention, the hardness of the stress relaxation layer is more than the hardness of the cloth body” It means “larger than the hardness of the circuit board”.
- the specific relationship of the hardness of the cloth body 10, the circuit board 20, and the stress relaxation layer 31 is expressed numerically, it is preferable to satisfy the following relationship.
- the stress relaxation layer 31 is preferably 1000 N / m or more and 3.0 ⁇ 10 5 N / m or less, and more preferably 10,000 N / m or more and 1.5 ⁇ 10 5 N / m or less. If the hardness of the stress relaxation layer 31 with respect to the cloth body 10 and the circuit board 20 is within this range, the stress applied to the connecting portion between the cloth body 10 and the circuit board 20 is changed between the interface between the cloth body 10 and the stress relaxation layer 31.
- the stress relaxation layer 31 can be dispersed at the interface between the circuit board 20 and the stress can be relaxed.
- the bendability of the cloth body 10 is 1.0 ⁇ 10 ⁇ 10 N ⁇ m or less
- the bendability of the circuit board 20 is 1.0 ⁇ 10 ⁇ 4 N ⁇ m or more and 5.0 ⁇ 10 ⁇ 3 N ⁇ m or less.
- the bendability of the stress relaxation layer 31 is preferably 5.0 ⁇ 10 ⁇ 3 N ⁇ m to 0.5 N ⁇ m. If the bendability of the stress relaxation layer 31 with respect to the cloth body 10 and the circuit board 20 is within this range, the bendability of the entire textile device can be improved and the bending of the circuit board 20 can be relaxed.
- Low density polyethylene (LDPE) can be used. If it is this structure, durability of a connection part can be improved significantly.
- the adhesive layer 32 various materials that can adhere the cloth body 10 and the stress relaxation substrate 30 can be used.
- a thermoplastic adhesive is preferable.
- the thermoplastic adhesive is melted by heat and welds the cloth body 10 and the stress relaxation layer 30. Therefore, it is possible to ensure higher adhesion than entanglement with the cloth 11 and the stretchable wiring 12 constituting the cloth body 10.
- Thermoplastic adhesives also have high water resistance. Therefore, by using a thermoplastic adhesive for the adhesive layer 32, high adhesiveness can be maintained even when the textile device 100 is washed.
- the conductive yarn 33 connects the stretchable wiring 12 and the circuit wiring 22.
- the conductive yarn 33 is a conductive yarn.
- the conductive yarn 33 has high durability, and if the sewing method is devised, the follow-up property to the shape change is also high.
- the contact between the elastic wiring 12 and the circuit wiring 22 is made by the conductive yarn 33 exposed from both surfaces of the stress relaxation substrate 30. Since the conductive yarn 33 is sewn so as to penetrate the stress relaxation layer 31 and the adhesive layer 32, a part of the conductive yarn 33 is exposed on both surfaces of the stress relaxation substrate 30.
- the conductive thread 33 can obtain electrical continuity on both surfaces of the stress relaxation substrate 30 only by sewing. Therefore, there is no need to make a through hole (via) or the like that penetrates the stress relaxation substrate 33 in the thickness direction, and conduction between both surfaces of the stress relaxation substrate 30 can be obtained very easily.
- the first end portion 12a of the stretchable wiring 12 and the first end portion 22a of the circuit wiring 22 are arranged at positions overlapping each other in plan view. Therefore, if the conductive yarn 33 is sewn at least once in the vertical direction of the stress relaxation substrate 30, electrical connection between the stretchable wiring 12 and the circuit wiring 22 can be ensured. That is, since the first end portion 12a of the stretchable wiring 12 and the first end portion 22a of the circuit wiring 22 are arranged at a position overlapping in plan view, the amount of sewing the conductive thread 33 can be reduced. As a result, the time and cost related to the production of the stress relaxation substrate 30 can be reduced.
- FIG. 2 is an enlarged schematic cross-sectional view of a peripheral portion of a circuit board according to a modification of the textile device according to the first embodiment.
- the conductive portion that connects the cloth body 10 and the circuit board 20 is not the conductive yarn 33 but the via wiring 34.
- Textile device 110 differs from textile device 100 only in this respect. Other configurations are the same, and the same reference numerals are given.
- the via wiring 34 is an aspect of the above-described “conductive portion disposed across the first and second surfaces of the stress relaxation substrate”.
- a conductive adhesive for the via wiring 34 It is preferable to use a conductive adhesive for the via wiring 34.
- the conductive adhesives it is particularly preferable to use a thermoplastic adhesive having conductivity. Since the conductive adhesive has higher flexibility than metal or the like, it can follow the deformation of the stress relaxation substrate 30. As a result, the adhesion between the stretchable wiring 12 and the circuit wiring 22 and the via wiring 34 can be improved.
- conductive surfaces are formed at both ends of the via wiring 34. Therefore, the elastic conductor 12 and the circuit wiring 22 can be in contact with each other. By making each contact in a surface, the electroconductivity between the cloth body 10 and the circuit board 20 can be improved.
- the via wiring 34 it is necessary to provide a through hole in the stress relaxation substrate 30.
- the through hole can be opened by a known method. By filling the through hole with a conductive adhesive or the like, the via wiring 34 can be obtained.
- the textile type device has the stress relaxation substrate having the intermediate hardness between the circuit board and the cloth body. Therefore, the stress which arises due to the difference in the hardness and stretchability of a circuit board and a cloth body can be relieved. As a result, the electrical connection between the cloth body and the circuit board can be maintained even when a physical force that greatly distorts the textile device is applied.
- FIG. 3 is an enlarged schematic cross-sectional view of the peripheral portion of the circuit board of the textile device according to the second embodiment.
- the textile type device 120 according to the second embodiment is different from the textile type device 100 according to the first embodiment in the shape of the conductive yarn 35.
- Other configurations are the same as those of the textile device 100 according to the first embodiment, and detailed description thereof is omitted.
- the conductive yarn 35 is an aspect of the above-described “conductive portion disposed across the first and second surfaces of the stress relaxation substrate”.
- the first end portion 12a of the stretchable wiring 12 and the first end portion 22a of the circuit wiring 22 are arranged at a position overlapping in plan view. Therefore, the conductive yarn 33 is configured to contribute to the conduction in the thickness direction of the stress relaxation substrate 30.
- the first end portion 12a of the stretchable wiring 12 and the first end portion 22a of the circuit wiring 22 are not arranged at a position overlapping in plan view. Therefore, the conductive yarn 33 is configured to contribute to the conduction in the thickness direction of the stress relaxation substrate 30 and the conduction in the in-plane direction of the stress relaxation substrate 30.
- FIG. 4 is a schematic plan view of the textile type device 120 according to the second embodiment.
- the circuit board 20 is disposed in the circuit board installation region 25 of the stress relaxation board 30 set in advance. By arranging the circuit board 20 in the circuit board installation region 25, the stress relaxation board 30 and the circuit board 20 are arranged at positions where they overlap each other in plan view.
- the area of the stress relaxation substrate 30 is preferably larger than the area of the circuit board 20.
- the stress relaxation board 30 can be disposed so as to include the circuit board 20 in a plan view.
- the textile type device 120 is deformed, it is the cloth body 10 that is deformed first. Then, the strain generated in the cloth body 10 is transmitted to the stress relaxation substrate 30 and the circuit board 20. If the stress relaxation substrate 30 is disposed so as to enclose the circuit board 20 in a plan view, the stress relaxation substrate 30 relaxes the strain generated in the cloth body 10, and thus the circuit board 20 is affected by deformation. Can be suppressed. That is, damage to the textile device 120 due to the hardness of the cloth body 10 and the circuit board 20 can be avoided.
- the wiring width can be adjusted by the stress relaxation substrate 30.
- the circuit board 20 collects information from each sensor. Therefore, the circuit wirings 22 formed on the circuit board 20 have a very high density. Further, as shown in FIG. 4, when the circuit board 20 is also provided with a matrix conversion function in order to reduce the number of connection points to the external output terminals, the circuit wiring 22 of the circuit board 20 becomes more complicated and dense. In order to realize such a high-density and complicated circuit wiring 22 on a circuit board having a small area, the width of the circuit wiring 22 is inevitably narrowed.
- the stretchable wiring 12 is not as dense as the circuit wiring 22 because the cloth 10 has a large area.
- the stretchable wiring 12 is energized from the sensor to the circuit board 20. Therefore, the energization distance of the stretchable wiring 12 is longer than the energization distance of the circuit wiring 22. In order to suppress the influence of the wiring resistance, it is preferable that the width of the stretchable wiring 12 is wide.
- the difference in wiring density and wiring width becomes a problem.
- the stress relaxation substrate 30 is disposed between the cloth body 10 and the circuit board 20
- the difference in wiring density and wiring width between the stretchable wiring 12 and the wiring board 22 can be adjusted by the conductive yarn 35.
- the conductive yarn 35 is preferably disposed from the outer periphery of the stress relaxation substrate 30 toward the circuit substrate 20 disposed in the center of the stress relaxation substrate 30.
- the wiring density and the wiring are increased from the outer peripheral portion of the stress relaxation substrate 30 connected to the stretchable wiring 12 toward the central portion of the stress relaxation substrate 30 connected to the circuit wiring 22.
- the width can be adjusted gradually.
- FIG. 5 is an enlarged schematic cross-sectional view of a peripheral portion of a circuit board according to a modification of the textile device according to the second embodiment.
- the conductive portion that connects the fabric body 10 and the circuit board 20 is not composed of the conductive yarn 35 alone, but is divided into a through portion 36 a and an in-plane extending portion 36 b. Is different from the textile device 120.
- Other configurations are the same, and the same reference numerals are given.
- a combination of the through portion 36a and the in-plane extending portion 36b is one aspect of the above-described “conductive portion disposed across the first and second surfaces of the stress relaxation substrate”.
- the in-plane extending part 36 b enables adjustment of the wiring density between the cloth body 10 and the circuit board 20.
- the through portion 36 a enables energization in the thickness direction of the stress relaxation substrate 30.
- the through portion 36a may be either one using via wiring or one using conductive yarn.
- the material of the in-plane extending portion 36b is not particularly limited, and for example, conductive ink, copper foil, or the like can be used.
- the positional relationship between the penetrating portion 36a and the in-plane extending portion 36b is not limited to the aspect shown in FIG.
- the in-plane extending portion 36b may be on the surface of the stress relaxation substrate 30 on the circuit board 20 side, and the through portion 36a is disposed on the outer peripheral side from the in-plane extending portion 36b. May be.
- the aspect of these combinations may be sufficient.
- FIG. 7 is a photograph of an example of the textile-type device 120 according to the second embodiment.
- Several stretchable wirings 12 are formed on the cloth 11.
- a stress relaxation substrate 30 is provided, and circuit boards 40 and 50 are provided thereon.
- the circuit boards 40 and 50 are detachably coupled using the respective connectors 41 and 51 (FIG. 7 shows a removed state).
- FIG. 7 shows a removed state.
- substrate 30 is provided, when attaching / detaching the connectors 41 and 51, the stress resulting from the difference in the hardness of the circuit board 50 and the cloth
- the textile type device has the stress relaxation substrate having the intermediate hardness between the circuit board and the cloth body. Therefore, the stress which arises due to the difference in the hardness and stretchability of a circuit board and a cloth body can be relieved. As a result, the electrical connection between the cloth body and the circuit board can be maintained even when a physical force that greatly distorts the textile device is applied.
- the textile type device is arranged so that the stress relaxation board includes the circuit board in plan view. Therefore, the stress generated in the cloth body and the circuit board can be further relaxed by the stress relaxation board. Furthermore, the difference in the wiring width between the stretchable wiring of the cloth body and the circuit wiring of the circuit board can be adjusted by the conductive portion of the stress relaxation board.
- the stress relaxation substrate 30 is disposed below the cloth body 10 and / or above the circuit board 20 and used as a reinforcing material, so that a textile is obtained. It may be possible to suppress the influence of physical force applied to the device. When used as a reinforcing material in this way, the hardness of the stress relaxation substrate does not matter so much, so it seems to have an advantage, but in reality, even if the circuit board 20 and the cloth body 10 are reinforced from the outside, the circuit The stress applied to the connection portion between the substrate 20 and the cloth body 10 cannot be sufficiently relaxed, and it is difficult to ensure electrical connection. Therefore, it is important to dispose a stress relaxation substrate 30 that can ensure electrical conduction between the cloth body 10 and the circuit board 20.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Woven Fabrics (AREA)
Abstract
Description
本願は、2015年10月16日に、日本に出願された特願2015-204499号に基づき優先権を主張し、その内容をここに援用する。
しかしながら、このような回路基板が付設された布体を形状が複雑に変化する部分に用いたり、洗濯等を行ったりすると、回路基板上の配線の破断などの機械的な破壊もしくは腐食などの化学的な破壊によって、センサーからの情報が外部出力手段に伝わらなくなることがあるという問題があった。
すなわち、上記課題を解決するため、本発明は以下の手段を採用した。
(8)上記(1)~(7)のいずれか一つに記載の応力緩和基板において、前記布体の硬さが10N/m以上、1000N/m以下でり、かつ前記回路基板の硬さが3.0×105N/m以上、7.5×105N/m以下の場合、前記応力緩和層の硬さは1000N/m以上、3.0×105N/m以下であり;前記布体10の曲げ性が1.0×10-10N・m以下であり、かつ回路基板の曲げ性が1.0×10-4N・m以上、5.0×10-3N・m以下の場合、前記応力緩和層の曲げ性は5.0×10-3N・m以上、0.5N・m以下であってもよい。
(9)本発明のその他の態様に係る応力緩和基板は、応力緩和層と、前記応力緩和層の一面に設けられた接着層と、導電部とを備える応力緩和基板であって、前記導電部が前記応力緩和基板の第1面と第2面に渡って配設され、前記応力緩和層の硬さは1000N/m以上、3.0×105N/m以下であり、前記応力緩和層の曲げ性は5.0×10-3N・m以上、0.5N・m以下である。
本発明の一態様に係るテキスタイル型デバイスによれば、複雑に動作する部分での使用や洗濯等が可能となる。
図1は、第1実施形態に係るテキスタイル型デバイスの回路基板の周縁部を拡大した断面模式図である。テキスタイル型デバイス100は、布体10と、回路基板20と、応力緩和基板30と、を備える。
回路配線22の配線パターンは必要に応じて設定できる。例えば、伸縮性配線12の本数が多い場合は、入力された情報をマトリックス変換するように回路配線22の配線パターンを設定してもよい。このように配線パターンを設定することで、外部出力手段への出力端子数を少なくすることができる。
布体10、回路基板20、応力緩和層31の硬さの具体的な関係を数値で表すと以下のような関係を満たすことが好ましい。布体10の硬さが10N/m以上1000N/m以下で、回路基板20の硬さが3.0×105N/m以上7.5×105N/m以下の場合、応力緩和層31の硬さは1000N/m以上3.0×105N/m以下であることが好ましく、10000N/m以上1.5×105N/m以下であることがより好ましい。布体10及び回路基板20に対する応力緩和層31の硬さがこの範囲内であれば、布体10と回路基板20の接続部に加わる応力を、布体10と応力緩和層31との界面と、応力緩和層31と回路基板20との界面に分散することができ、応力を緩和することができる。
布体10の曲げ性が1.0×10-10N・m以下で、回路基板20の曲げ性が1.0×10-4N・m以上5.0×10-3N・m以下の場合、応力緩和層31の曲げ性は5.0×10-3N・m以上0.5N・m以下であることが好ましい。布体10及び回路基板20に対する応力緩和層31の曲げ性がこの範囲内であれば、テキスタイル型デバイス全体の曲げ性が向上し、回路基板20の曲げを緩和することができる。
伸縮性配線12及び回路配線22との接点は、応力緩和基板30の両面から露出した導電糸33によって行う。導電糸33は、応力緩和層31と接着層32を貫くように縫われているため、応力緩和基板30の両面に一部が露出する。
図2は、第1実施形態に係るテキスタイル型デバイスの変形例の回路基板の周縁部を拡大した断面模式図である。図2に示す変形例のテキスタイル型デバイス110において、布体10と回路基板20とを繋ぐ導電部が、導電糸33ではなくビア配線34からなる。テキスタイル型デバイス110は、この点のみがテキスタイル型デバイス100と異なる。その他の構成は同様であり、同一の符号を付す。ビア配線34は、前述「応力緩和基板第1面と第2面に渡って配設された導電部」の一態様である。
図3は、第2実施形態に係るテキスタイル型デバイスの回路基板の周縁部を拡大した断面模式図である。第2実施形態に係るテキスタイル型デバイス120は、第1実施形態にかかるテキスタイル型デバイス100と比較して、導電糸35の形状が異なる。その他の構成は、第1実施形態に係るテキスタイル型デバイス100と同一であり、詳細な説明は省く。導電糸35は、前述「応力緩和基板第1面と第2面に渡って配設された導電部」の一態様である。
これに対し、第2実施形態に係るテキスタイル型デバイス120では、伸縮性配線12の第1端部12aと、回路配線22の第1端部22aは平面視重なる位置に配置されていない。そのため、導電糸33は応力緩和基板30の厚み方向への導電と、応力緩和基板30の面内方向への導電にも寄与するように構成されている。
回路基板20は、事前に設定された応力緩和基板30の回路基板設置領域25に配設されている。回路基板設置領域25に回路基板20が配設されることで、応力緩和基板30と回路基板20が平面視重なる位置に配設される。
そのため伸縮性配線12の通電距離は、回路配線22の通電距離と比較して長い。配線抵抗の影響を抑えるためには、伸縮性配線12の幅は広い方が好ましい。
図5は、第2実施形態に係るテキスタイル型デバイスの変形例の回路基板の周縁部を拡大した断面模式図である。図5に示す変形例のテキスタイル型デバイス130は、布体10と回路基板20とを繋ぐ導電部が、導電糸35単体からなるのではなく、貫通部36aと面内延在部36bに分かれている点がテキスタイル型デバイス120と異なる。その他の構成は同様であり、同一の符号を付す。貫通部36aと面内延在部36bを合せたものが、前述「応力緩和基板第1面と第2面に渡って配設された導電部」の一態様となる。
貫通部36aは、応力緩和基板30の厚み方向の通電を可能とする。
布11の上に、数本の伸縮性配線12が形成されている。写真中心の位置において、応力緩和基板30が設けられ、その上に、回路基板40と50が設置されている。回路基板40と50は、それぞれのコネクタ41と51を用いて着脱自在で結合されている(図7には、取り外された状態を示す)。
図7に示すように、例えば、洗濯等を行ったりする場合、回路基板40を基板50から外すことができるため、回路基板40の耐久性を高めることができる。また、応力緩和基板30が設けられているため、コネクタ41と51の着脱をする際、回路基板50と布11の硬さ及び伸縮性の違いに起因して生じる応力を緩和することができる。
12…伸縮性配線、 20…回路基板、
21…基材、 22…回路配線、
22a…第1回路配線、 22b…第2回路配線、
23…接着層、 30…応力緩和基板、
31…応力緩和層、 32…接着層、
33,35…導電糸、 34…ビア配線、
36a…貫通部、 36b…面内延在部、
40,50…回路基板 41、51…コネクタ、
100,110,120,130,140…テキスタイル型デバイス
Claims (12)
- 配線を有する布体と回路基板との間に配設される応力緩和基板であって、
前記布体より硬く、前記回路基板より柔らかい応力緩和層と、
前記応力緩和層の一面に設けられた接着層と、
前記応力緩和基板の第1面と第2面に渡って配設された導電部と、を備える応力緩和基板。 - 前記応力緩和基板の曲げ性が前記回路基板及び前記布体の曲げ性より大きい請求項1に記載の応力緩和基板。
- 前記接着層が熱可塑性樹脂層である請求項1または2のいずれかに記載の応力緩和基板。
- 前記導電部が、前記応力緩和層と前記接着層を貫通する貫通孔に設けられたビア配線を含む請求項1~3のいずれか一項に記載の応力緩和基板。
- 前記導電部が、前記応力緩和層と前記接着層を貫き、両面に一部が露出した導電糸を含む請求項1~3のいずれか一項に記載の応力緩和基板。
- 平面視で中央部に回路基板設置領域を有し、外周から前記回路基板設置領域に向かって前記導電部が配設されている請求項1~5のいずれか一項に記載の応力緩和基板。
- 前記導電部の配線密度が、外周から前記回路基板設置領域に向かって高くなっている請求項6に記載の応力緩和基板。
- 前記布体の硬さが10N/m以上、1000N/m以下でり、かつ前記回路基板の硬さが3.0×105N/m以上、7.5×105N/m以下の場合、前記応力緩和層の硬さは1000N/m以上、3.0×105N/m以下であり;
前記布体10の曲げ性が1.0×10-10N・m以下であり、かつ回路基板の曲げ性が1.0×10-4N・m以上、5.0×10-3N・m以下の場合、前記応力緩和層の曲げ性は5.0×10-3N・m以上、0.5N・m以下である請求項1~7のいずれか一項に記載の応力緩和基板。 - 応力緩和層と、
前記応力緩和層の一面に設けられた接着層と、
導電部と、
を備える応力緩和基板であって、
前記導電部が前記応力緩和基板の第1面と第2面に渡って配設され、
前記応力緩和層の硬さは1000N/m以上、3.0×105N/m以下であり、
前記応力緩和層の曲げ性は5.0×10-3N・m以上、0.5N・m以下であることを特徴とする応力緩和基板。 - 伸縮性配線を有する布体と、
回路配線が形成された回路基板と、
前記布体と前記回路基板の間に配設された請求項1~9のいずれか一項に記載の応力緩和基板と、を備え、
前記伸縮性配線と前記回路配線とが、前記応力緩和基板の前記導電部により接続されたテキスタイル型デバイス。 - 平面視で前記導電部の配線密度が、前記回路基板に向かって高くなっている請求項10に記載のテキスタイル型デバイス。
- 前記応力緩和基板の面積が、前記回路基板の面積より大きく、
平面視で前記回路基板が、前記応力緩和基板と重なる位置に配設された請求項10または11のいずれかに記載のテキスタイル型デバイス。
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