JP7639307B2 - 放熱装置 - Google Patents

放熱装置 Download PDF

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Publication number
JP7639307B2
JP7639307B2 JP2020193261A JP2020193261A JP7639307B2 JP 7639307 B2 JP7639307 B2 JP 7639307B2 JP 2020193261 A JP2020193261 A JP 2020193261A JP 2020193261 A JP2020193261 A JP 2020193261A JP 7639307 B2 JP7639307 B2 JP 7639307B2
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Japan
Prior art keywords
heat
hole
heat dissipation
conductive portion
main surface
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JP2020193261A
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Japanese (ja)
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JP2022081986A (ja
JP2022081986A5 (https=
Inventor
貴行 酒井
等 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2020193261A priority Critical patent/JP7639307B2/ja
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Publication of JP2022081986A5 publication Critical patent/JP2022081986A5/ja
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2020193261A 2020-11-20 2020-11-20 放熱装置 Active JP7639307B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020193261A JP7639307B2 (ja) 2020-11-20 2020-11-20 放熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020193261A JP7639307B2 (ja) 2020-11-20 2020-11-20 放熱装置

Publications (3)

Publication Number Publication Date
JP2022081986A JP2022081986A (ja) 2022-06-01
JP2022081986A5 JP2022081986A5 (https=) 2023-09-06
JP7639307B2 true JP7639307B2 (ja) 2025-03-05

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JP2020193261A Active JP7639307B2 (ja) 2020-11-20 2020-11-20 放熱装置

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JP (1) JP7639307B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260033301A (ko) * 2024-09-02 2026-03-10 엘지이노텍 주식회사 회로기판 및 반도체 패키지

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184915A (ja) 2000-12-18 2002-06-28 Hitachi Ltd Ｌｓｉの放熱方式
JP2003332771A (ja) 2002-05-10 2003-11-21 Denso Corp 電子制御装置
JP2015018857A (ja) 2013-07-09 2015-01-29 三菱電機株式会社 高放熱基板、部品の放熱構造
JP2015126100A (ja) 2013-12-26 2015-07-06 株式会社デンソー 電子制御装置、および、これを用いた電動パワーステアリング装置
JP2016076622A (ja) 2014-10-07 2016-05-12 株式会社デンソー 回路基板および電子装置
JP2017063070A (ja) 2015-09-24 2017-03-30 アイシン精機株式会社 配線基板
JP2017212305A (ja) 2016-05-24 2017-11-30 Koa株式会社 配線基板
JP2018101661A (ja) 2016-12-19 2018-06-28 新電元工業株式会社 実装基板及び発熱部品実装モジュール
US10141182B1 (en) 2017-11-13 2018-11-27 Nxp Usa, Inc. Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259321A (ja) * 1992-03-11 1993-10-08 Toshiba Corp マルチチップモジュール

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184915A (ja) 2000-12-18 2002-06-28 Hitachi Ltd Ｌｓｉの放熱方式
JP2003332771A (ja) 2002-05-10 2003-11-21 Denso Corp 電子制御装置
JP2015018857A (ja) 2013-07-09 2015-01-29 三菱電機株式会社 高放熱基板、部品の放熱構造
JP2015126100A (ja) 2013-12-26 2015-07-06 株式会社デンソー 電子制御装置、および、これを用いた電動パワーステアリング装置
JP2016076622A (ja) 2014-10-07 2016-05-12 株式会社デンソー 回路基板および電子装置
JP2017063070A (ja) 2015-09-24 2017-03-30 アイシン精機株式会社 配線基板
JP2017212305A (ja) 2016-05-24 2017-11-30 Koa株式会社 配線基板
JP2018101661A (ja) 2016-12-19 2018-06-28 新電元工業株式会社 実装基板及び発熱部品実装モジュール
US10141182B1 (en) 2017-11-13 2018-11-27 Nxp Usa, Inc. Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

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JP2022081986A (ja) 2022-06-01

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