JP2022081986A5 - - Google Patents

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Publication number
JP2022081986A5
JP2022081986A5 JP2020193261A JP2020193261A JP2022081986A5 JP 2022081986 A5 JP2022081986 A5 JP 2022081986A5 JP 2020193261 A JP2020193261 A JP 2020193261A JP 2020193261 A JP2020193261 A JP 2020193261A JP 2022081986 A5 JP2022081986 A5 JP 2022081986A5
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JP
Japan
Prior art keywords
heat
main surface
generating component
conducting portion
heat conducting
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Application number
JP2020193261A
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English (en)
Japanese (ja)
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JP2022081986A (ja
JP7639307B2 (ja
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Priority to JP2020193261A priority Critical patent/JP7639307B2/ja
Priority claimed from JP2020193261A external-priority patent/JP7639307B2/ja
Publication of JP2022081986A publication Critical patent/JP2022081986A/ja
Publication of JP2022081986A5 publication Critical patent/JP2022081986A5/ja
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Publication of JP7639307B2 publication Critical patent/JP7639307B2/ja
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JP2020193261A 2020-11-20 2020-11-20 放熱装置 Active JP7639307B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020193261A JP7639307B2 (ja) 2020-11-20 2020-11-20 放熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020193261A JP7639307B2 (ja) 2020-11-20 2020-11-20 放熱装置

Publications (3)

Publication Number Publication Date
JP2022081986A JP2022081986A (ja) 2022-06-01
JP2022081986A5 true JP2022081986A5 (https=) 2023-09-06
JP7639307B2 JP7639307B2 (ja) 2025-03-05

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ID=81801590

Family Applications (1)

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JP2020193261A Active JP7639307B2 (ja) 2020-11-20 2020-11-20 放熱装置

Country Status (1)

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JP (1) JP7639307B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260033301A (ko) * 2024-09-02 2026-03-10 엘지이노텍 주식회사 회로기판 및 반도체 패키지

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259321A (ja) * 1992-03-11 1993-10-08 Toshiba Corp マルチチップモジュール
JP2002184915A (ja) 2000-12-18 2002-06-28 Hitachi Ltd Ｌｓｉの放熱方式
JP2003332771A (ja) 2002-05-10 2003-11-21 Denso Corp 電子制御装置
JP6252000B2 (ja) 2013-07-09 2017-12-27 三菱電機株式会社 基板
JP2015126100A (ja) 2013-12-26 2015-07-06 株式会社デンソー 電子制御装置、および、これを用いた電動パワーステアリング装置
JP2016076622A (ja) 2014-10-07 2016-05-12 株式会社デンソー 回路基板および電子装置
JP2017063070A (ja) 2015-09-24 2017-03-30 アイシン精機株式会社 配線基板
JP6787692B2 (ja) 2016-05-24 2020-11-18 Koa株式会社 配線基板
JP2018101661A (ja) 2016-12-19 2018-06-28 新電元工業株式会社 実装基板及び発熱部品実装モジュール
US10141182B1 (en) 2017-11-13 2018-11-27 Nxp Usa, Inc. Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

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