JP7513587B2 - 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 - Google Patents
樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 Download PDFInfo
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- JP7513587B2 JP7513587B2 JP2021502312A JP2021502312A JP7513587B2 JP 7513587 B2 JP7513587 B2 JP 7513587B2 JP 2021502312 A JP2021502312 A JP 2021502312A JP 2021502312 A JP2021502312 A JP 2021502312A JP 7513587 B2 JP7513587 B2 JP 7513587B2
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Classifications
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- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
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- C08F212/36—Divinylbenzene
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L35/06—Copolymers with vinyl aromatic monomers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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Landscapes
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- Health & Medical Sciences (AREA)
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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| JP7190649B2 (ja) * | 2018-04-27 | 2022-12-16 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| US20230331944A1 (en) * | 2020-09-11 | 2023-10-19 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board |
| CN117836341A (zh) * | 2021-08-25 | 2024-04-05 | 三菱瓦斯化学株式会社 | 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂片、及印刷电路板 |
| WO2023047782A1 (ja) * | 2021-09-27 | 2023-03-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
| WO2023047783A1 (ja) * | 2021-09-27 | 2023-03-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
| TW202317678A (zh) * | 2021-09-30 | 2023-05-01 | 日商三菱瓦斯化學股份有限公司 | 預浸體、積層板、及印刷配線板 |
| TW202348646A (zh) * | 2022-03-11 | 2023-12-16 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置 |
| TW202342605A (zh) * | 2022-03-11 | 2023-11-01 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置 |
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| JP2007262191A (ja) | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | 難燃硬化性樹脂組成物 |
| WO2016072404A1 (ja) | 2014-11-06 | 2016-05-12 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板 |
| US20160148719A1 (en) | 2013-03-18 | 2016-05-26 | Iteq Corporation | Low dielectric materials |
| JP2016190899A (ja) | 2015-03-30 | 2016-11-10 | 新日鉄住金化学株式会社 | 末端変性可溶性多官能ビニル芳香族共重合体及びその製造方法 |
| JP2017115020A (ja) | 2015-12-24 | 2017-06-29 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、銅張積層板及びプリント配線板 |
| JP2019194307A (ja) | 2018-04-27 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
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| EP0390565A3 (en) * | 1989-03-31 | 1992-02-26 | Mitsui Petrochemical Industries, Ltd. | Imide prepolymers, cured products, method for making the same, laminate preparation, and encapsulating compositions |
| JPH036293A (ja) * | 1989-05-31 | 1991-01-11 | Hitachi Chem Co Ltd | 難燃性樹脂組成物及びプリプレグ |
| JP5233710B2 (ja) | 2008-02-12 | 2013-07-10 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグおよび金属箔張り積層板 |
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- 2020-02-26 KR KR1020217028420A patent/KR20210133974A/ko unknown
- 2020-02-26 JP JP2021502312A patent/JP7513587B2/ja active Active
- 2020-02-26 CN CN202080016910.2A patent/CN113490596A/zh active Pending
- 2020-02-26 WO PCT/JP2020/007687 patent/WO2020175538A1/ja active Application Filing
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- 2024-06-27 JP JP2024103476A patent/JP2024129074A/ja active Pending
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| JP2002363232A (ja) | 2001-06-01 | 2002-12-18 | Nof Corp | 硬化性組成物、高分子絶縁材料、製造方法および基板 |
| JP2007262191A (ja) | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | 難燃硬化性樹脂組成物 |
| US20160148719A1 (en) | 2013-03-18 | 2016-05-26 | Iteq Corporation | Low dielectric materials |
| WO2016072404A1 (ja) | 2014-11-06 | 2016-05-12 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板 |
| JP2016190899A (ja) | 2015-03-30 | 2016-11-10 | 新日鉄住金化学株式会社 | 末端変性可溶性多官能ビニル芳香族共重合体及びその製造方法 |
| JP2017115020A (ja) | 2015-12-24 | 2017-06-29 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、銅張積層板及びプリント配線板 |
| JP2019194307A (ja) | 2018-04-27 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
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| Publication number | Publication date |
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| JP2024129074A (ja) | 2024-09-26 |
| CN113490596A (zh) | 2021-10-08 |
| TW202039596A (zh) | 2020-11-01 |
| JPWO2020175538A1 (zh) | 2020-09-03 |
| KR20210133974A (ko) | 2021-11-08 |
| WO2020175538A1 (ja) | 2020-09-03 |
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