JP7510029B1 - プリント配線板 - Google Patents

プリント配線板 Download PDF

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Publication number
JP7510029B1
JP7510029B1 JP2024523460A JP2024523460A JP7510029B1 JP 7510029 B1 JP7510029 B1 JP 7510029B1 JP 2024523460 A JP2024523460 A JP 2024523460A JP 2024523460 A JP2024523460 A JP 2024523460A JP 7510029 B1 JP7510029 B1 JP 7510029B1
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JP
Japan
Prior art keywords
insulating film
conductive pattern
printed wiring
wiring board
coverlay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024523460A
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English (en)
Japanese (ja)
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JPWO2024202031A1 (https=
JPWO2024202031A5 (https=
Inventor
拓馬 一松
真 山本
航 野口
将希 宮原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Printed Circuits Inc
Priority to JP2024098806A priority Critical patent/JP7754997B2/ja
Application granted granted Critical
Publication of JP7510029B1 publication Critical patent/JP7510029B1/ja
Publication of JPWO2024202031A1 publication Critical patent/JPWO2024202031A1/ja
Publication of JPWO2024202031A5 publication Critical patent/JPWO2024202031A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2024523460A 2023-03-31 2023-03-31 プリント配線板 Active JP7510029B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024098806A JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/013622 WO2024202031A1 (ja) 2023-03-31 2023-03-31 プリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024098806A Division JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Publications (3)

Publication Number Publication Date
JP7510029B1 true JP7510029B1 (ja) 2024-07-02
JPWO2024202031A1 JPWO2024202031A1 (https=) 2024-10-03
JPWO2024202031A5 JPWO2024202031A5 (https=) 2025-03-06

Family

ID=91671324

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024523460A Active JP7510029B1 (ja) 2023-03-31 2023-03-31 プリント配線板
JP2024098806A Active JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024098806A Active JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Country Status (4)

Country Link
JP (2) JP7510029B1 (https=)
CN (1) CN120937508A (https=)
TW (1) TW202444146A (https=)
WO (1) WO2024202031A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024146952A (ja) * 2023-03-31 2024-10-15 住友電工プリントサーキット株式会社 プリント配線板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351676A (ja) * 2005-06-14 2006-12-28 Toray Ind Inc カバーレイフィルムおよびそれを用いた複合配線板
JP2007062175A (ja) * 2005-08-31 2007-03-15 Tokyo Tokushu Shigyo Kk プレス成形用フィルム、プレス成形方法および回路板の製造方法
WO2020009229A1 (ja) * 2018-07-06 2020-01-09 タツタ電線株式会社 プリント配線基板用貼付フィルム
WO2020196497A1 (ja) * 2019-03-28 2020-10-01 三井化学東セロ株式会社 プリント配線基板製造プロセス用離型フィルム、プリント基板の製造方法、プリント基板製造装置、及びプリント基板
WO2021085329A1 (ja) * 2019-10-29 2021-05-06 日鉄ケミカル＆マテリアル株式会社 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341960U (https=) * 1989-09-01 1991-04-22
JP2009238901A (ja) * 2008-03-26 2009-10-15 Toshiba Corp フレキシブルプリント配線板および電子機器
US11083092B2 (en) * 2015-03-13 2021-08-03 Sumitomo Electric Printed Circuits, Inc. Planar coil element and method for producing planar coil element
KR20170084672A (ko) * 2016-01-12 2017-07-20 후지모리 고교 가부시키가이샤 커버레이 필름
JP7509502B2 (ja) * 2017-11-28 2024-07-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板
JP7198190B2 (ja) * 2019-10-04 2022-12-28 住友電気工業株式会社 接着剤組成物、フレキシブルプリント配線板用カバーレイ及びフレキシブルプリント配線板
JP7357582B2 (ja) * 2020-04-20 2023-10-06 住友電気工業株式会社 フレキシブルプリント配線板
JP7287542B2 (ja) * 2020-11-10 2023-06-06 東亞合成株式会社 低誘電性接着剤組成物
WO2022163284A1 (ja) * 2021-01-29 2022-08-04 信越ポリマー株式会社 接着剤組成物
JP7510029B1 (ja) * 2023-03-31 2024-07-02 住友電工プリントサーキット株式会社 プリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351676A (ja) * 2005-06-14 2006-12-28 Toray Ind Inc カバーレイフィルムおよびそれを用いた複合配線板
JP2007062175A (ja) * 2005-08-31 2007-03-15 Tokyo Tokushu Shigyo Kk プレス成形用フィルム、プレス成形方法および回路板の製造方法
WO2020009229A1 (ja) * 2018-07-06 2020-01-09 タツタ電線株式会社 プリント配線基板用貼付フィルム
WO2020196497A1 (ja) * 2019-03-28 2020-10-01 三井化学東セロ株式会社 プリント配線基板製造プロセス用離型フィルム、プリント基板の製造方法、プリント基板製造装置、及びプリント基板
WO2021085329A1 (ja) * 2019-10-29 2021-05-06 日鉄ケミカル＆マテリアル株式会社 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024146952A (ja) * 2023-03-31 2024-10-15 住友電工プリントサーキット株式会社 プリント配線板

Also Published As

Publication number Publication date
JP7754997B2 (ja) 2025-10-15
JPWO2024202031A1 (https=) 2024-10-03
TW202444146A (zh) 2024-11-01
CN120937508A (zh) 2025-11-11
JP2024146952A (ja) 2024-10-15
WO2024202031A1 (ja) 2024-10-03

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