JPWO2024202031A1 - - Google Patents

Info

Publication number
JPWO2024202031A1
JPWO2024202031A1 JP2024523460A JP2024523460A JPWO2024202031A1 JP WO2024202031 A1 JPWO2024202031 A1 JP WO2024202031A1 JP 2024523460 A JP2024523460 A JP 2024523460A JP 2024523460 A JP2024523460 A JP 2024523460A JP WO2024202031 A1 JPWO2024202031 A1 JP WO2024202031A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024523460A
Other languages
Japanese (ja)
Other versions
JP7510029B1 (ja
JPWO2024202031A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2024098806A priority Critical patent/JP7754997B2/ja
Application granted granted Critical
Publication of JP7510029B1 publication Critical patent/JP7510029B1/ja
Publication of JPWO2024202031A1 publication Critical patent/JPWO2024202031A1/ja
Publication of JPWO2024202031A5 publication Critical patent/JPWO2024202031A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2024523460A 2023-03-31 2023-03-31 プリント配線板 Active JP7510029B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024098806A JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/013622 WO2024202031A1 (ja) 2023-03-31 2023-03-31 プリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024098806A Division JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Publications (3)

Publication Number Publication Date
JP7510029B1 JP7510029B1 (ja) 2024-07-02
JPWO2024202031A1 true JPWO2024202031A1 (https=) 2024-10-03
JPWO2024202031A5 JPWO2024202031A5 (https=) 2025-03-06

Family

ID=91671324

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024523460A Active JP7510029B1 (ja) 2023-03-31 2023-03-31 プリント配線板
JP2024098806A Active JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024098806A Active JP7754997B2 (ja) 2023-03-31 2024-06-19 プリント配線板

Country Status (4)

Country Link
JP (2) JP7510029B1 (https=)
CN (1) CN120937508A (https=)
TW (1) TW202444146A (https=)
WO (1) WO2024202031A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7510029B1 (ja) * 2023-03-31 2024-07-02 住友電工プリントサーキット株式会社 プリント配線板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341960U (https=) * 1989-09-01 1991-04-22
JP2006351676A (ja) * 2005-06-14 2006-12-28 Toray Ind Inc カバーレイフィルムおよびそれを用いた複合配線板
JP4541260B2 (ja) * 2005-08-31 2010-09-08 東京特種紙業株式会社 回路板の製造方法
JP2009238901A (ja) * 2008-03-26 2009-10-15 Toshiba Corp フレキシブルプリント配線板および電子機器
US11083092B2 (en) * 2015-03-13 2021-08-03 Sumitomo Electric Printed Circuits, Inc. Planar coil element and method for producing planar coil element
KR20170084672A (ko) * 2016-01-12 2017-07-20 후지모리 고교 가부시키가이샤 커버레이 필름
JP7509502B2 (ja) * 2017-11-28 2024-07-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板
US11856688B2 (en) * 2018-07-06 2023-12-26 Tatsuta Electric Wire & Cable Co., Ltd. Adhesive film for printed wiring board
CN113557136B (zh) * 2019-03-28 2024-02-02 三井化学东赛璐株式会社 印刷线路基板制程用离型膜、印刷基板的制造方法、印刷基板制造装置及印刷基板
JP7198190B2 (ja) * 2019-10-04 2022-12-28 住友電気工業株式会社 接着剤組成物、フレキシブルプリント配線板用カバーレイ及びフレキシブルプリント配線板
KR102942765B1 (ko) * 2019-10-29 2026-03-23 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 수지조성물, 수지필름, 적층체, 커버레이 필름, 수지 함유 동박, 금속박적층판 및 회로기판
JP7357582B2 (ja) * 2020-04-20 2023-10-06 住友電気工業株式会社 フレキシブルプリント配線板
JP7287542B2 (ja) * 2020-11-10 2023-06-06 東亞合成株式会社 低誘電性接着剤組成物
WO2022163284A1 (ja) * 2021-01-29 2022-08-04 信越ポリマー株式会社 接着剤組成物
JP7510029B1 (ja) * 2023-03-31 2024-07-02 住友電工プリントサーキット株式会社 プリント配線板

Also Published As

Publication number Publication date
JP7754997B2 (ja) 2025-10-15
JP7510029B1 (ja) 2024-07-02
TW202444146A (zh) 2024-11-01
CN120937508A (zh) 2025-11-11
JP2024146952A (ja) 2024-10-15
WO2024202031A1 (ja) 2024-10-03

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