TW202444146A - 印刷配線板 - Google Patents
印刷配線板 Download PDFInfo
- Publication number
- TW202444146A TW202444146A TW113109927A TW113109927A TW202444146A TW 202444146 A TW202444146 A TW 202444146A TW 113109927 A TW113109927 A TW 113109927A TW 113109927 A TW113109927 A TW 113109927A TW 202444146 A TW202444146 A TW 202444146A
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- conductive pattern
- printed wiring
- insulating film
- thickness
- Prior art date
Links
- 239000012790 adhesive layer Substances 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 82
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 102100024359 Exosome complex exonuclease RRP44 Human genes 0.000 description 19
- 101000627103 Homo sapiens Exosome complex exonuclease RRP44 Proteins 0.000 description 19
- 101100109978 Arabidopsis thaliana ARP3 gene Proteins 0.000 description 11
- 101100427547 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ULS1 gene Proteins 0.000 description 11
- 101150117607 dis1 gene Proteins 0.000 description 11
- 239000011247 coating layer Substances 0.000 description 9
- 238000007731 hot pressing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 101100163122 Arabidopsis thaliana ARPC2A gene Proteins 0.000 description 6
- 101100191082 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GLC7 gene Proteins 0.000 description 6
- 101100030351 Schizosaccharomyces pombe (strain 972 / ATCC 24843) dis2 gene Proteins 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/013622 WO2024202031A1 (ja) | 2023-03-31 | 2023-03-31 | プリント配線板 |
| WOPCT/JP2023/013622 | 2023-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202444146A true TW202444146A (zh) | 2024-11-01 |
Family
ID=91671324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113109927A TW202444146A (zh) | 2023-03-31 | 2024-03-18 | 印刷配線板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7510029B1 (https=) |
| CN (1) | CN120937508A (https=) |
| TW (1) | TW202444146A (https=) |
| WO (1) | WO2024202031A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7510029B1 (ja) * | 2023-03-31 | 2024-07-02 | 住友電工プリントサーキット株式会社 | プリント配線板 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341960U (https=) * | 1989-09-01 | 1991-04-22 | ||
| JP2006351676A (ja) * | 2005-06-14 | 2006-12-28 | Toray Ind Inc | カバーレイフィルムおよびそれを用いた複合配線板 |
| JP4541260B2 (ja) * | 2005-08-31 | 2010-09-08 | 東京特種紙業株式会社 | 回路板の製造方法 |
| JP2009238901A (ja) * | 2008-03-26 | 2009-10-15 | Toshiba Corp | フレキシブルプリント配線板および電子機器 |
| US11083092B2 (en) * | 2015-03-13 | 2021-08-03 | Sumitomo Electric Printed Circuits, Inc. | Planar coil element and method for producing planar coil element |
| KR20170084672A (ko) * | 2016-01-12 | 2017-07-20 | 후지모리 고교 가부시키가이샤 | 커버레이 필름 |
| JP7509502B2 (ja) * | 2017-11-28 | 2024-07-02 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板 |
| US11856688B2 (en) * | 2018-07-06 | 2023-12-26 | Tatsuta Electric Wire & Cable Co., Ltd. | Adhesive film for printed wiring board |
| CN113557136B (zh) * | 2019-03-28 | 2024-02-02 | 三井化学东赛璐株式会社 | 印刷线路基板制程用离型膜、印刷基板的制造方法、印刷基板制造装置及印刷基板 |
| JP7198190B2 (ja) * | 2019-10-04 | 2022-12-28 | 住友電気工業株式会社 | 接着剤組成物、フレキシブルプリント配線板用カバーレイ及びフレキシブルプリント配線板 |
| KR102942765B1 (ko) * | 2019-10-29 | 2026-03-23 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 수지조성물, 수지필름, 적층체, 커버레이 필름, 수지 함유 동박, 금속박적층판 및 회로기판 |
| JP7357582B2 (ja) * | 2020-04-20 | 2023-10-06 | 住友電気工業株式会社 | フレキシブルプリント配線板 |
| JP7287542B2 (ja) * | 2020-11-10 | 2023-06-06 | 東亞合成株式会社 | 低誘電性接着剤組成物 |
| WO2022163284A1 (ja) * | 2021-01-29 | 2022-08-04 | 信越ポリマー株式会社 | 接着剤組成物 |
| JP7510029B1 (ja) * | 2023-03-31 | 2024-07-02 | 住友電工プリントサーキット株式会社 | プリント配線板 |
-
2023
- 2023-03-31 JP JP2024523460A patent/JP7510029B1/ja active Active
- 2023-03-31 WO PCT/JP2023/013622 patent/WO2024202031A1/ja not_active Ceased
- 2023-03-31 CN CN202380096422.0A patent/CN120937508A/zh active Pending
-
2024
- 2024-03-18 TW TW113109927A patent/TW202444146A/zh unknown
- 2024-06-19 JP JP2024098806A patent/JP7754997B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7754997B2 (ja) | 2025-10-15 |
| JPWO2024202031A1 (https=) | 2024-10-03 |
| JP7510029B1 (ja) | 2024-07-02 |
| CN120937508A (zh) | 2025-11-11 |
| JP2024146952A (ja) | 2024-10-15 |
| WO2024202031A1 (ja) | 2024-10-03 |
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