JP7475975B2 - エポキシ樹脂 - Google Patents
エポキシ樹脂 Download PDFInfo
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- JP7475975B2 JP7475975B2 JP2020100719A JP2020100719A JP7475975B2 JP 7475975 B2 JP7475975 B2 JP 7475975B2 JP 2020100719 A JP2020100719 A JP 2020100719A JP 2020100719 A JP2020100719 A JP 2020100719A JP 7475975 B2 JP7475975 B2 JP 7475975B2
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- formula
- epoxy resin
- compound
- curable epoxy
- resin formulation
- Prior art date
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- 229920000647 polyepoxide Polymers 0.000 title claims description 119
- 239000003822 epoxy resin Substances 0.000 title claims description 117
- 150000001875 compounds Chemical class 0.000 claims description 140
- 239000000203 mixture Substances 0.000 claims description 103
- 238000009472 formulation Methods 0.000 claims description 64
- 239000003795 chemical substances by application Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 29
- 239000000835 fiber Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 18
- 239000011159 matrix material Substances 0.000 claims description 11
- 150000004985 diamines Chemical class 0.000 claims description 10
- 239000004848 polyfunctional curative Substances 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 7
- 239000002657 fibrous material Substances 0.000 claims description 7
- 239000004753 textile Substances 0.000 claims description 3
- 125000004427 diamine group Chemical group 0.000 claims 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 72
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 54
- 150000002118 epoxides Chemical class 0.000 description 50
- 239000000047 product Substances 0.000 description 50
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 44
- 230000015572 biosynthetic process Effects 0.000 description 43
- 238000003786 synthesis reaction Methods 0.000 description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 32
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 31
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 30
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 30
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 26
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 24
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 22
- 238000000034 method Methods 0.000 description 22
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- 238000004128 high performance liquid chromatography Methods 0.000 description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 20
- 150000001412 amines Chemical class 0.000 description 19
- 239000002904 solvent Substances 0.000 description 19
- 125000001424 substituent group Chemical group 0.000 description 18
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 15
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 15
- 238000005481 NMR spectroscopy Methods 0.000 description 15
- 238000002360 preparation method Methods 0.000 description 15
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 14
- 229910052739 hydrogen Inorganic materials 0.000 description 13
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 13
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- 239000004593 Epoxy Substances 0.000 description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 12
- 238000001228 spectrum Methods 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 10
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 9
- -1 epoxide compounds Chemical class 0.000 description 9
- 238000004949 mass spectrometry Methods 0.000 description 9
- 239000012071 phase Substances 0.000 description 9
- 239000011734 sodium Substances 0.000 description 9
- 238000004809 thin layer chromatography Methods 0.000 description 9
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 8
- 238000002390 rotary evaporation Methods 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000012265 solid product Substances 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 7
- 239000011541 reaction mixture Substances 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 7
- HURSUNYVRTZMIX-UHFFFAOYSA-N 2-[[4-[4-[4-(oxiran-2-ylmethoxy)phenoxy]phenoxy]phenoxy]methyl]oxirane Chemical compound C(C1CO1)OC1=CC=C(OC2=CC=C(C=C2)OC2=CC=C(C=C2)OCC2CO2)C=C1 HURSUNYVRTZMIX-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 125000006239 protecting group Chemical group 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- TYOMCHWDDNQYHU-UHFFFAOYSA-N 2-[[3-[3-[3-(oxiran-2-ylmethoxy)phenoxy]phenoxy]phenoxy]methyl]oxirane Chemical compound C(C1CO1)OC=1C=C(OC2=CC(=CC=C2)OC2=CC(=CC=C2)OCC2CO2)C=CC=1 TYOMCHWDDNQYHU-UHFFFAOYSA-N 0.000 description 5
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000000113 differential scanning calorimetry Methods 0.000 description 5
- 238000000132 electrospray ionisation Methods 0.000 description 5
- UZCGKGPEKUCDTF-UHFFFAOYSA-N fluazinam Chemical compound [O-][N+](=O)C1=CC(C(F)(F)F)=C(Cl)C([N+]([O-])=O)=C1NC1=NC=C(C(F)(F)F)C=C1Cl UZCGKGPEKUCDTF-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000002787 reinforcement Effects 0.000 description 5
- 235000005074 zinc chloride Nutrition 0.000 description 5
- 239000011592 zinc chloride Substances 0.000 description 5
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 4
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- IVGBGCPUDUTSHT-UHFFFAOYSA-N [3-(3-aminobenzoyl)phenyl]-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(C=CC=2)C(=O)C=2C=C(N)C=CC=2)=C1 IVGBGCPUDUTSHT-UHFFFAOYSA-N 0.000 description 4
- UVXIFYUJZWURAR-UHFFFAOYSA-N [3-(4-aminobenzoyl)phenyl]-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(C(=O)C=2C=CC(N)=CC=2)=C1 UVXIFYUJZWURAR-UHFFFAOYSA-N 0.000 description 4
- DBCMPVCYHLRHND-UHFFFAOYSA-N [4-(4-aminobenzoyl)phenyl]-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(C(=O)C=2C=CC(N)=CC=2)C=C1 DBCMPVCYHLRHND-UHFFFAOYSA-N 0.000 description 4
- 239000004760 aramid Substances 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 238000012512 characterization method Methods 0.000 description 4
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
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- 238000012856 packing Methods 0.000 description 4
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- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- AYLRNSZYYYKPCJ-UHFFFAOYSA-N OC=1C(=C(C(=C(C=1)C)C1=CC=CC=C1)O)C Chemical group OC=1C(=C(C(=C(C=1)C)C1=CC=CC=C1)O)C AYLRNSZYYYKPCJ-UHFFFAOYSA-N 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000000706 filtrate Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 125000004356 hydroxy functional group Chemical class O* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- FYDKNKUEBJQCCN-UHFFFAOYSA-N lanthanum(3+);trinitrate Chemical compound [La+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O FYDKNKUEBJQCCN-UHFFFAOYSA-N 0.000 description 3
- GJKFIJKSBFYMQK-UHFFFAOYSA-N lanthanum(3+);trinitrate;hexahydrate Chemical compound O.O.O.O.O.O.[La+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O GJKFIJKSBFYMQK-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 3
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- HIXFSHWMTVMNID-UHFFFAOYSA-N 1,3-bis(3-methoxyphenoxy)benzene Chemical compound COC1=CC=CC(OC=2C=C(OC=3C=C(OC)C=CC=3)C=CC=2)=C1 HIXFSHWMTVMNID-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 2
- XJJYJJKMQRFGQM-UHFFFAOYSA-N 3-[3-(3-hydroxyphenoxy)phenoxy]phenol Chemical compound OC1=CC=CC(OC=2C=C(OC=3C=C(O)C=CC=3)C=CC=2)=C1 XJJYJJKMQRFGQM-UHFFFAOYSA-N 0.000 description 2
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- RLSMYIFSFZLJQZ-UHFFFAOYSA-N 4-[4-(4-hydroxyphenoxy)phenoxy]phenol Chemical compound C1=CC(O)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(O)C=C1 RLSMYIFSFZLJQZ-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 238000012565 NMR experiment Methods 0.000 description 2
- CTQZSSWIJYMLOG-UHFFFAOYSA-N OC1=CC(=C(C(=C1C)C1=CC=CC=C1)C)O Chemical group OC1=CC(=C(C(=C1C)C1=CC=CC=C1)C)O CTQZSSWIJYMLOG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
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- 125000000217 alkyl group Chemical group 0.000 description 2
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- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- UOOHMWNIDCLHGX-UHFFFAOYSA-N 1,1'-biphenyl;2-(oxiran-2-ylmethoxymethyl)oxirane Chemical group C1OC1COCC1CO1.C1=CC=CC=C1C1=CC=CC=C1 UOOHMWNIDCLHGX-UHFFFAOYSA-N 0.000 description 1
- JSRLURSZEMLAFO-UHFFFAOYSA-N 1,3-dibromobenzene Chemical compound BrC1=CC=CC(Br)=C1 JSRLURSZEMLAFO-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- SFPXVPWDXSCTBK-UHFFFAOYSA-N 1,5-dichloro-2,4-dimethylbenzene Chemical group CC1=CC(C)=C(Cl)C=C1Cl SFPXVPWDXSCTBK-UHFFFAOYSA-N 0.000 description 1
- ZDPAWHACYDRYIW-UHFFFAOYSA-N 1-(4-fluorophenyl)ethanone Chemical compound CC(=O)C1=CC=C(F)C=C1 ZDPAWHACYDRYIW-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical group CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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- UGHIQYNKFXEQPU-UHFFFAOYSA-N 2,3-dichloro-1,4-dimethylbenzene Chemical group CC1=CC=C(C)C(Cl)=C1Cl UGHIQYNKFXEQPU-UHFFFAOYSA-N 0.000 description 1
- OZBAMTFRHADAKN-UHFFFAOYSA-N 2-[2-(2-hydroxyphenyl)-3,6-dimethylphenyl]phenol Chemical group OC1=C(C=CC=C1)C=1C(=C(C=CC=1C)C)C1=C(C=CC=C1)O OZBAMTFRHADAKN-UHFFFAOYSA-N 0.000 description 1
- FIHIZQGYHRJNJU-UHFFFAOYSA-N 2-[[4-[3-[4-(oxiran-2-ylmethoxy)phenoxy]phenoxy]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OC(C=1)=CC=CC=1OC(C=C1)=CC=C1OCC1CO1 FIHIZQGYHRJNJU-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- WMAIZAYXLCODCS-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)-2,2-dimethylpropoxy]aniline Chemical compound C=1C=CC(N)=CC=1OCC(C)(C)COC1=CC=CC(N)=C1 WMAIZAYXLCODCS-UHFFFAOYSA-N 0.000 description 1
- NYRFBMFAUFUULG-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 NYRFBMFAUFUULG-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- XWCHBSPNPRSMFX-UHFFFAOYSA-N 3-[[4-[(4-aminophenyl)methyl]phenyl]methyl]aniline Chemical compound C1=CC(N)=CC=C1CC(C=C1)=CC=C1CC1=CC=CC(N)=C1 XWCHBSPNPRSMFX-UHFFFAOYSA-N 0.000 description 1
- NHQDETIJWKXCTC-UHFFFAOYSA-N 3-chloroperbenzoic acid Chemical compound OOC(=O)C1=CC=CC(Cl)=C1 NHQDETIJWKXCTC-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
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- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
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- Epoxy Compounds (AREA)
Description
本願は、2016年7月25日に出願された米国仮出願番号62/366,443号の優先権、及び2016年10月4日に出願された豪州仮出願番号第2016904019号の優先権を主張するものであり、これらの内容は、参照によってここに組み込まれる。
式中、
X1はそれぞれ同じであり、かつO及びC(O)から選択され、
X2はそれぞれ同じであり、かつC(O)から選択され、
R1がそれぞれ水素であり、かつR2がそれぞれエポキシド基から選択されるか、又はR2がそれぞれ水素であり、かつR1がそれぞれエポキシド基から選択される。
(a)X1がOであるとき、エポキシド基は、
であり、
(b)X1がC(O)であるとき、エポキシド基は、
であり、かつ
(c)X2がC(O)であるとき、
(i)R2がHであり、かつR1が、
若しくは、
であるか、又は
(ii)R1がHであり、かつR2が、
である。
エポキシ樹脂が、式3の化合物:
を含み、
式中、
Xはそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
Rはそれぞれ同じであり、かつエポキシド基であり、かつ
硬化剤は、式4:
のジアミン硬化剤を含み、
式中、Yはそれぞれ同じであり、かつO、CH2及びC(O)から選択される。
a)
(i)ここで規定する硬化性エポキシ樹脂調製物、及び
(ii)繊維材料、
を提供する工程、及び
b)工程(a)の樹脂調製物を、(i)工程(a)の繊維材料と組み合わせ、(ii)材料を硬化可能な高温に供し、含浸された繊維強化材料を形成する工程
を含むものである。
i)式5の化合物を、式6の化合物と一緒に、触媒の存在下で反応させて、式7の化合物を形成する工程、式中、Pは保護基であり、Mは金属であり、LGは脱離基である:
ii)式7の化合物を、酸触媒によりさらに反応させて、式8の化合物を形成する工程:
を含むものである。
本開示について様々な例を利用可能なことが評価されるであろうが、以下では下記の図面を参照して、幾つかの例を説明する。
用語
エポキシド含有化合物
式中、
X1はそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
R1がそれぞれ水素であり、かつR2がそれぞれエポキシド基から選択されるか、又はR2がそれぞれ水素であり、かつR1がそれぞれエポキシド基から選択される。
式中、
X2はそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
R1がそれぞれ水素であり、かつR2がそれぞれエポキシド基から選択されるか、又はR2がそれぞれ水素であり、かつR1がそれぞれエポキシド基から選択される。
式中、
X2はそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
R2はそれぞれ、エポキシド基から選択される。
置換基X1、X2、R1及びR2
エポキシド基
ここでエポキシ樹脂が、式3の化合物:
を含み、
式中、
Xはそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
Rはそれぞれ同じであり、かつエポキシド基である。
ここでエポキシ樹脂が、式3の化合物:
を含み、
式中、
Xはそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
Rはそれぞれ同じであり、かつエポキシド基である。
ここでエポキシ樹脂が、式3の化合物:
を含み、
式中、
Xはそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
Rはそれぞれ同じであり、かつエポキシド基であり、かつ
硬化剤は、式4のジアミン硬化剤:
を含み、
式中、Yはそれぞれ同じであり、かつO、CH2及びC(O)から選択される。
ここでエポキシ樹脂が、式3の化合物:
を含み、
式中、
Xはそれぞれ同じであり、かつO、CH2及びC(O)から選択され、
Rはそれぞれ同じであり、かつエポキシド基であり、かつ
硬化剤は、式4のジアミン硬化剤:
を含み、
式中、Yはそれぞれ同じであり、かつO、CH2及びC(O)から選択される。
置換基R及びX
a)塗膜形成剤、例えばジカルボン酸のエステル(例えばLusolvan FBH、BASF)、及びグリコールエーテル(例えばDowanol、Dow)、並びに
b)表面活性剤、例えば脂肪酸誘導体(例えばBermadol SPS 2543、Akzo)、及び第四級アンモニウム塩
を含むことができる。
複合材
a)
(i)ここで規定する硬化性エポキシ樹脂調製物、及び
(ii)繊維材料、
を提供する工程、及び
b)工程(a)の樹脂調製物を、(i)工程(a)の繊維材料と組み合わせ、(ii)材料を硬化可能な高温に供し、含浸された繊維強化材料を形成する工程
を含むものである。
i)式5の化合物を、式6の化合物と一緒に、触媒の存在下で反応させて、式7の化合物を形成する工程、式中、Pは保護基であり、Mは金属であり、LGは脱離基である:
ii)式7の化合物を、酸触媒によりさらに反応させて、式8の化合物を形成する工程:
を含むものである。
略語
・1,4-ビス(4-アミノフェノキシ)ベンゼン(TPE-Q)5.84g(2.00×10-2モル);
・エピクロロヒドリン(27.75g、3.00×10-1モル)
・ジクロロエタン(50ml)
・硝酸ランタン六水和物(55mg)
・NaOH(4.00g、1.00×10-1モル)、及び
・イソプロパノール(30ml)。
実施例2:N,N,N,N-テトラグリシジル 1,3-ビス-(4-アミノフェノキシ)ベンゼン(134-TGAPB)の合成
・1,3-ビス(4-アミノフェノキシ)ベンゼン(TPE-R)5.84g(2.00×10-2モル);
・エピクロロヒドリン(27.75g、3.00×10-1モル)
・ジクロロエタン(50ml)
・硝酸ランタン六水和物(55mg)
・NaOH(4.0g、1.00×10-1モル)、及び
・イソプロパノール(30ml)。
実施例3:N,N,N,N-テトラグリシジル 1,3-ビス-(3-アミノフェノキシ)ベンゼン(133-TGAPB)の合成
・1,3-ビス(3-アミノフェノキシ)ベンゼン(133-APB)5.84g(2.00×10-2モル);
・エピクロロヒドリン(27.75g、3.00×10-1モル)
・ジクロロエタン(50ml)
・硝酸ランタン六水和物(55mg)
・NaOH(4.0g、1.00×10-1モル)、及び
・イソプロパノール(30ml)。
実施例4:1,3-ビス-(3-グリシジルオキシフェノキシ)ベンゼン(133-BGOPB)の合成
工程1:1,3-ビス-(3-メトキシフェノキシ)ベンゼンの合成
工程2:1,3-ビス-(3-ヒドロキシフェノキシ)ベンゼン(133-BGOPB)の合成
工程3:1,3-ビス-(3-グリシジルオキシフェノキシ)ベンゼン(133-BGOPB)の合成
実施例5:1,4-ビス-(4-グリシジルオキシフェノキシ)ベンゼン(144-BGOPB)の合成
工程1:1,4-ビス-(4-アセトフェノキシ)ベンゼンの合成
工程2:1,4-ビス-(4-アセトキシフェノキシ)ベンゼンの合成
工程3:1,4-ビス-(4-ヒドロキシフェノキシ)ベンゼンの合成
工程4:1,4-ビス-(4-グリシジルオキシフェノキシ)ベンゼン(144-BGOPB)の合成
実施例6:メタ置換されたヒドロキシ前駆体を、エポキシ樹脂にする合成
工程1:ZnCl2/SiO2触媒の製造
工程2:ビス(4-ヒドロキシフェニル)m-キシレン(BHPmX)の実験室スケールでの合成
実施例7:パラ置換されたヒドロキシ前駆体を、エポキシ樹脂にする合成
工程1:ZnCl2/SiO2触媒の製造
工程2:ビス(4-ヒドロキシフェニル)-p-キシレン(BHPpX)の大規模合成
実施例8:ビス-ヒドロキシフェニル-m-キシレン(BHPmX)及びビス-ヒドロキシフェニル-p-キシレン(BHPpX)の異性体組成物
ヒドロキシ及びエポキシ樹脂合成についての概要
BHPmX
1.反応後に触媒を濾別し、DCMを完全に蒸発させる。
2.油っぽい生成物を、水で連続的に洗浄してフェノールを除去する。フェノール除去における洗浄工程を補助するので、このことは利点である。
3.最終的な生成物は、3種の異性体、高分子量のオリゴマーを含む油であり、収率は実験室で約75%である。
BHPpX
1.反応後、触媒を濾別し、生成物が溶液から晶出するまで、DCM体積を減少させる。
2.生成物をろ過して、3種の異性体を有する白色の固体を生成する。しかしながら、第三の異性体、すなわち2,2置換された異性体は、極めて低い濃度でしか存在しない。
3.最終的な生成物は、収率が約50%であり、高分子量のオリゴマーは、極めて僅かしか認められない。
実施例9:ビス(ヒドロキシフェニル)-p-キシレン(BHPpX)合成のスケールアップ
実施例10:カルボニル結合された芳香族アミン、1,3-ビス(3-アミノベンゾイル)ベンゼン(133BABB)、1,3-ビス(4-アミノベンゾイル)ベンゼン(134BABB)、及び1,4-ビス(4-アミノベンゾイル)ベンゼン(144BABB)の硬化、及び同定
樹脂の製造
・ビスフェノールA(BisA)のグリシジルエーテル
・ビスフェノールF(BisF)のグリシジルエーテル、及び
・1,4ビス(4-グリシジルエーテルフェノキシ)ベンゼン(144BGOPB)、
・1,3-ビス(3-アミノベンゾイル)ベンゼン(133BABB)
・1,3-ビス(4-アミノベンゾイル)ベンゼン(134BABB)、及び
・1,4-ビス(4-アミノベンゾイル)ベンゼン(144BABB)。
例11:メチレン結合された芳香族エポキシ樹脂、ビスアミン、1,3-ビス(3-アミノベンゾイル)ベンゼン(133BABB)、1,3-ビス(4-アミノベンゾイル)ベンゼン(134BABB)及び1,4-ビス(4-アミノベンゾイル)ベンゼン(144BABB)の硬化及び同定
樹脂の製造
表5:例11の44DDS及びMDAの硬化された系についてのtanデルタスペクトルから測定された、硬化後のTg値
例12:44ジアミノジフェニルスルホン(44DDS)で硬化された、1,4-ビス(4-グリシジルオキシフェノキシ)ベンゼン(144BGOPB)及び1,3-ビス(3-グリシジルオキシフェノキシ)ベンゼン(133BGOPB)の硬化及び同定と、44ジアミノジフェニルスルホン(44DDS)で硬化された、ビスフェノールA(BisA)のジグリシジルエーテル、及びビスフェノールF(BisF)のジグリシジルエーテルの硬化及び同定の比較
試料製造
同定
Claims (16)
- Y及びXがそれぞれ同じである、請求項2に記載の硬化性エポキシ樹脂調製物。
- さらに1つ又は複数の添加剤を含む、請求項2から12のいずれか一項に記載の硬化性エポキシ樹脂調製物。
- 請求項2から13のいずれか一項に記載の硬化性エポキシ樹脂調製物で含侵された繊維を含む、含浸された繊維強化材料。
- 硬化されたエポキシ樹脂が、請求項2から13のいずれか一項に記載の硬化性エポキシ樹脂調製物から形成されている、硬化されたエポキシ樹脂のマトリックス内に繊維材料を含む複合材。
- 以下の工程:
a)
(i)請求項2から13のいずれか一項に記載の硬化性エポキシ樹脂調製物、及び
(ii)繊維材料、
を提供する工程、及び
b)工程(a)(i)の樹脂調製物を、工程(a)(ii)の繊維材料と組み合わせ、材料を硬化可能な高温に供し、含浸された繊維強化材料を形成する工程
を含む、含浸された繊維強化材料を形成する方法。
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JP5297425B2 (ja) * | 2010-08-26 | 2013-09-25 | パナソニック株式会社 | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
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US9309353B2 (en) * | 2013-08-09 | 2016-04-12 | The Boeing Company | Formulation methodology for distortional thermosets |
JP5983590B2 (ja) * | 2013-12-13 | 2016-08-31 | 株式会社デンソー | 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品 |
US10374166B2 (en) | 2014-02-18 | 2019-08-06 | Kwansei Gakuin Educational Foundation | Polycyclic aromatic compound |
CN104761874B (zh) * | 2015-04-14 | 2017-04-05 | 东华大学 | 一种耐高温碳纤维增强电缆芯用拉挤树脂及其制备方法 |
EP3393286A1 (en) * | 2015-12-23 | 2018-10-31 | O&M Halyard International Unlimited Company | Facemasks with material layers for enhanced bonding process |
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2017
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EP3487904A1 (en) | 2019-05-29 |
JP2019527753A (ja) | 2019-10-03 |
CN115057991A (zh) | 2022-09-16 |
US11059937B2 (en) | 2021-07-13 |
EP4148047A1 (en) | 2023-03-15 |
US20210355269A1 (en) | 2021-11-18 |
CA3231558A1 (en) | 2018-02-01 |
CN109642018A (zh) | 2019-04-16 |
EP3487904A4 (en) | 2020-06-10 |
US20230312812A1 (en) | 2023-10-05 |
JP2020183529A (ja) | 2020-11-12 |
JP2021119221A (ja) | 2021-08-12 |
JP6943945B2 (ja) | 2021-10-06 |
JP2024056737A (ja) | 2024-04-23 |
US20190248953A1 (en) | 2019-08-15 |
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