JP7456504B2 - 樹脂多層基板および樹脂多層基板の製造方法 - Google Patents

樹脂多層基板および樹脂多層基板の製造方法 Download PDF

Info

Publication number
JP7456504B2
JP7456504B2 JP2022537928A JP2022537928A JP7456504B2 JP 7456504 B2 JP7456504 B2 JP 7456504B2 JP 2022537928 A JP2022537928 A JP 2022537928A JP 2022537928 A JP2022537928 A JP 2022537928A JP 7456504 B2 JP7456504 B2 JP 7456504B2
Authority
JP
Japan
Prior art keywords
layer
metal foil
foil layer
resin
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022537928A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022019156A1 (https=
JPWO2022019156A5 (https=
Inventor
麻人 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2022019156A1 publication Critical patent/JPWO2022019156A1/ja
Publication of JPWO2022019156A5 publication Critical patent/JPWO2022019156A5/ja
Application granted granted Critical
Publication of JP7456504B2 publication Critical patent/JP7456504B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022537928A 2020-07-21 2021-07-12 樹脂多層基板および樹脂多層基板の製造方法 Active JP7456504B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020124365 2020-07-21
JP2020124365 2020-07-21
PCT/JP2021/026064 WO2022019156A1 (ja) 2020-07-21 2021-07-12 樹脂多層基板および樹脂多層基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022019156A1 JPWO2022019156A1 (https=) 2022-01-27
JPWO2022019156A5 JPWO2022019156A5 (https=) 2023-03-20
JP7456504B2 true JP7456504B2 (ja) 2024-03-27

Family

ID=79728749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022537928A Active JP7456504B2 (ja) 2020-07-21 2021-07-12 樹脂多層基板および樹脂多層基板の製造方法

Country Status (4)

Country Link
US (1) US12403673B2 (https=)
JP (1) JP7456504B2 (https=)
CN (1) CN219697975U (https=)
WO (1) WO2022019156A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223187A (ja) 2004-02-06 2005-08-18 Toppan Printing Co Ltd 微細加工製品及びその製造方法
WO2011018979A1 (ja) 2009-08-11 2011-02-17 株式会社村田製作所 多層基板
WO2014092153A1 (ja) 2012-12-12 2014-06-19 株式会社村田製作所 フレキシブル基板及び電子機器
WO2019107430A1 (ja) 2017-11-29 2019-06-06 京セラ株式会社 回路基板およびこれを備える発光装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482595A (en) * 1987-09-25 1989-03-28 Meiko Electronics Co Ltd Printed wiring board
JP3069476B2 (ja) 1993-01-26 2000-07-24 イビデン株式会社 多層プリント配線板およびその製造方法
JP2006019321A (ja) * 2004-06-30 2006-01-19 Toray Eng Co Ltd 回路基板及びその製造方法
JP2007317900A (ja) 2006-05-26 2007-12-06 Nitto Denko Corp 配線回路基板およびその製造方法
CN102474978B (zh) * 2009-07-13 2015-08-19 株式会社村田制作所 信号线路及其制造方法
JP2013041858A (ja) * 2011-08-11 2013-02-28 Fujikura Ltd プリント配線板
JP5983523B2 (ja) 2013-05-06 2016-08-31 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法
JP6322492B2 (ja) * 2014-06-16 2018-05-09 日本シイエムケイ株式会社 プリント配線板および、その製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法
DE112018000457T5 (de) 2017-02-23 2019-09-26 Ngk Insulators, Ltd. Isoliertes wärmeableitungssubstrat
JP7424802B2 (ja) * 2019-11-12 2024-01-30 日東電工株式会社 配線回路基板およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223187A (ja) 2004-02-06 2005-08-18 Toppan Printing Co Ltd 微細加工製品及びその製造方法
WO2011018979A1 (ja) 2009-08-11 2011-02-17 株式会社村田製作所 多層基板
WO2014092153A1 (ja) 2012-12-12 2014-06-19 株式会社村田製作所 フレキシブル基板及び電子機器
WO2019107430A1 (ja) 2017-11-29 2019-06-06 京セラ株式会社 回路基板およびこれを備える発光装置

Also Published As

Publication number Publication date
WO2022019156A1 (ja) 2022-01-27
CN219697975U (zh) 2023-09-15
US20230158775A1 (en) 2023-05-25
US12403673B2 (en) 2025-09-02
JPWO2022019156A1 (https=) 2022-01-27

Similar Documents

Publication Publication Date Title
CN100574558C (zh) 印刷布线板的连接装置
US8810340B2 (en) Signal line disposed in a flexible insulating main body, where the main body includes a connector portion which is wider than a signal portion
US7286370B2 (en) Wired circuit board and connection structure of wired circuit board
US11558958B2 (en) Laminated body and method for manufacturing the same
JP2004335549A (ja) 多層プリント配線板の接続構造
JP6260748B2 (ja) 多層基板及びその製造方法
US9673501B2 (en) Laminated flat cable and method for producing same
US9130251B2 (en) Flat cable
US8091218B2 (en) Method of manufacturing a rigid printed wiring board
JP5704286B2 (ja) 高周波信号線路
US6545227B2 (en) Pocket mounted chip having microstrip line
JP7456504B2 (ja) 樹脂多層基板および樹脂多層基板の製造方法
JP7147885B2 (ja) 樹脂多層基板および樹脂多層基板の製造方法
US9583809B2 (en) High-frequency signal line
US12431603B2 (en) Multilayer substrate and manufacturing method therefor
JP7544137B2 (ja) 回路基板及び回路基板の製造方法
US9019048B1 (en) High-frequency signal transmission line and electronic device
JP7205667B2 (ja) 信号伝送線路
JP7790633B2 (ja) 多層回路基板
JP7409493B2 (ja) 信号伝送線路及び信号伝送線路の製造方法
US20220346231A1 (en) Printed wiring board
CN112752390B (zh) 多层电路板及其制作方法
JP2008166496A (ja) フレキシブル配線基板
JP4388168B2 (ja) 樹脂成形基板
JP2016096132A (ja) フラットケーブル接続構造体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230106

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231212

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240213

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240226

R150 Certificate of patent or registration of utility model

Ref document number: 7456504

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150