JPWO2022019156A1 - - Google Patents

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Publication number
JPWO2022019156A1
JPWO2022019156A1 JP2022537928A JP2022537928A JPWO2022019156A1 JP WO2022019156 A1 JPWO2022019156 A1 JP WO2022019156A1 JP 2022537928 A JP2022537928 A JP 2022537928A JP 2022537928 A JP2022537928 A JP 2022537928A JP WO2022019156 A1 JPWO2022019156 A1 JP WO2022019156A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022537928A
Other languages
Japanese (ja)
Other versions
JP7456504B2 (ja
JPWO2022019156A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022019156A1 publication Critical patent/JPWO2022019156A1/ja
Publication of JPWO2022019156A5 publication Critical patent/JPWO2022019156A5/ja
Application granted granted Critical
Publication of JP7456504B2 publication Critical patent/JP7456504B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022537928A 2020-07-21 2021-07-12 樹脂多層基板および樹脂多層基板の製造方法 Active JP7456504B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020124365 2020-07-21
JP2020124365 2020-07-21
PCT/JP2021/026064 WO2022019156A1 (ja) 2020-07-21 2021-07-12 樹脂多層基板および樹脂多層基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022019156A1 true JPWO2022019156A1 (https=) 2022-01-27
JPWO2022019156A5 JPWO2022019156A5 (https=) 2023-03-20
JP7456504B2 JP7456504B2 (ja) 2024-03-27

Family

ID=79728749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022537928A Active JP7456504B2 (ja) 2020-07-21 2021-07-12 樹脂多層基板および樹脂多層基板の製造方法

Country Status (4)

Country Link
US (1) US12403673B2 (https=)
JP (1) JP7456504B2 (https=)
CN (1) CN219697975U (https=)
WO (1) WO2022019156A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223187A (ja) * 2004-02-06 2005-08-18 Toppan Printing Co Ltd 微細加工製品及びその製造方法
JP2006019321A (ja) * 2004-06-30 2006-01-19 Toray Eng Co Ltd 回路基板及びその製造方法
WO2011018979A1 (ja) * 2009-08-11 2011-02-17 株式会社村田製作所 多層基板
JP2013041858A (ja) * 2011-08-11 2013-02-28 Fujikura Ltd プリント配線板
WO2014092153A1 (ja) * 2012-12-12 2014-06-19 株式会社村田製作所 フレキシブル基板及び電子機器
JP2016004851A (ja) * 2014-06-16 2016-01-12 日本シイエムケイ株式会社 プリント配線板および、その製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法
WO2019107430A1 (ja) * 2017-11-29 2019-06-06 京セラ株式会社 回路基板およびこれを備える発光装置
JP2021077807A (ja) * 2019-11-12 2021-05-20 日東電工株式会社 配線回路基板およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482595A (en) * 1987-09-25 1989-03-28 Meiko Electronics Co Ltd Printed wiring board
JP3069476B2 (ja) 1993-01-26 2000-07-24 イビデン株式会社 多層プリント配線板およびその製造方法
JP2007317900A (ja) 2006-05-26 2007-12-06 Nitto Denko Corp 配線回路基板およびその製造方法
CN102474978B (zh) * 2009-07-13 2015-08-19 株式会社村田制作所 信号线路及其制造方法
JP5983523B2 (ja) 2013-05-06 2016-08-31 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法
DE112018000457T5 (de) 2017-02-23 2019-09-26 Ngk Insulators, Ltd. Isoliertes wärmeableitungssubstrat

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223187A (ja) * 2004-02-06 2005-08-18 Toppan Printing Co Ltd 微細加工製品及びその製造方法
JP2006019321A (ja) * 2004-06-30 2006-01-19 Toray Eng Co Ltd 回路基板及びその製造方法
WO2011018979A1 (ja) * 2009-08-11 2011-02-17 株式会社村田製作所 多層基板
JP2013041858A (ja) * 2011-08-11 2013-02-28 Fujikura Ltd プリント配線板
WO2014092153A1 (ja) * 2012-12-12 2014-06-19 株式会社村田製作所 フレキシブル基板及び電子機器
JP2016004851A (ja) * 2014-06-16 2016-01-12 日本シイエムケイ株式会社 プリント配線板および、その製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法
WO2019107430A1 (ja) * 2017-11-29 2019-06-06 京セラ株式会社 回路基板およびこれを備える発光装置
JP2021077807A (ja) * 2019-11-12 2021-05-20 日東電工株式会社 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
WO2022019156A1 (ja) 2022-01-27
CN219697975U (zh) 2023-09-15
US20230158775A1 (en) 2023-05-25
US12403673B2 (en) 2025-09-02
JP7456504B2 (ja) 2024-03-27

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