CN219697975U - 树脂多层基板 - Google Patents

树脂多层基板 Download PDF

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Publication number
CN219697975U
CN219697975U CN202190000713.1U CN202190000713U CN219697975U CN 219697975 U CN219697975 U CN 219697975U CN 202190000713 U CN202190000713 U CN 202190000713U CN 219697975 U CN219697975 U CN 219697975U
Authority
CN
China
Prior art keywords
layer
metal foil
foil layer
resin
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202190000713.1U
Other languages
English (en)
Chinese (zh)
Inventor
藤本麻人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN219697975U publication Critical patent/CN219697975U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202190000713.1U 2020-07-21 2021-07-12 树脂多层基板 Active CN219697975U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020124365 2020-07-21
JP2020-124365 2020-07-21
PCT/JP2021/026064 WO2022019156A1 (ja) 2020-07-21 2021-07-12 樹脂多層基板および樹脂多層基板の製造方法

Publications (1)

Publication Number Publication Date
CN219697975U true CN219697975U (zh) 2023-09-15

Family

ID=79728749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202190000713.1U Active CN219697975U (zh) 2020-07-21 2021-07-12 树脂多层基板

Country Status (4)

Country Link
US (1) US12403673B2 (https=)
JP (1) JP7456504B2 (https=)
CN (1) CN219697975U (https=)
WO (1) WO2022019156A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482595A (en) * 1987-09-25 1989-03-28 Meiko Electronics Co Ltd Printed wiring board
JP3069476B2 (ja) 1993-01-26 2000-07-24 イビデン株式会社 多層プリント配線板およびその製造方法
JP4433814B2 (ja) * 2004-02-06 2010-03-17 凸版印刷株式会社 微細加工製品及びその製造方法
JP2006019321A (ja) * 2004-06-30 2006-01-19 Toray Eng Co Ltd 回路基板及びその製造方法
JP2007317900A (ja) 2006-05-26 2007-12-06 Nitto Denko Corp 配線回路基板およびその製造方法
CN102474978B (zh) * 2009-07-13 2015-08-19 株式会社村田制作所 信号线路及其制造方法
JP5354018B2 (ja) 2009-08-11 2013-11-27 株式会社村田製作所 多層基板
JP2013041858A (ja) * 2011-08-11 2013-02-28 Fujikura Ltd プリント配線板
CN204559998U (zh) * 2012-12-12 2015-08-12 株式会社村田制作所 柔性基板及电子设备
JP5983523B2 (ja) 2013-05-06 2016-08-31 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法
JP6322492B2 (ja) * 2014-06-16 2018-05-09 日本シイエムケイ株式会社 プリント配線板および、その製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法
DE112018000457T5 (de) 2017-02-23 2019-09-26 Ngk Insulators, Ltd. Isoliertes wärmeableitungssubstrat
WO2019107430A1 (ja) * 2017-11-29 2019-06-06 京セラ株式会社 回路基板およびこれを備える発光装置
JP7424802B2 (ja) * 2019-11-12 2024-01-30 日東電工株式会社 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
WO2022019156A1 (ja) 2022-01-27
US20230158775A1 (en) 2023-05-25
US12403673B2 (en) 2025-09-02
JP7456504B2 (ja) 2024-03-27
JPWO2022019156A1 (https=) 2022-01-27

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