JP7432243B2 - 基板供給システムおよび基板加工装置 - Google Patents

基板供給システムおよび基板加工装置 Download PDF

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Publication number
JP7432243B2
JP7432243B2 JP2020553785A JP2020553785A JP7432243B2 JP 7432243 B2 JP7432243 B2 JP 7432243B2 JP 2020553785 A JP2020553785 A JP 2020553785A JP 2020553785 A JP2020553785 A JP 2020553785A JP 7432243 B2 JP7432243 B2 JP 7432243B2
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Prior art keywords
cassette
substrate
section
supply system
storage section
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JP2020553785A
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English (en)
Japanese (ja)
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JPWO2020090518A5 (https=
JPWO2020090518A1 (ja
Inventor
修 奥田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of JPWO2020090518A1 publication Critical patent/JPWO2020090518A1/ja
Publication of JPWO2020090518A5 publication Critical patent/JPWO2020090518A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
JP2020553785A 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置 Active JP7432243B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018205614 2018-10-31
JP2018205614 2018-10-31
PCT/JP2019/041058 WO2020090518A1 (ja) 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置

Publications (3)

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JPWO2020090518A1 JPWO2020090518A1 (ja) 2021-09-16
JPWO2020090518A5 JPWO2020090518A5 (https=) 2022-10-03
JP7432243B2 true JP7432243B2 (ja) 2024-02-16

Family

ID=70463152

Family Applications (1)

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JP2020553785A Active JP7432243B2 (ja) 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置

Country Status (4)

Country Link
JP (1) JP7432243B2 (https=)
CN (1) CN112912998A (https=)
TW (1) TWI805823B (https=)
WO (1) WO2020090518A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置
KR20250078502A (ko) * 2023-02-03 2025-06-02 야마하하쓰도키 가부시키가이샤 레이저 가공 장치, 반도체칩 및 반도체칩의 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082542A1 (fr) 2002-04-01 2003-10-09 Mitsuboshi Diamond Industrial Co., Ltd. Procede de sectionnement d'un substrat constitue d'un materiau fragile et dispositif de sectionnement faisant appel a ce procede
JP2012146872A (ja) 2011-01-13 2012-08-02 Disco Abrasive Syst Ltd 樹脂塗布装置
JP2012156413A (ja) 2011-01-28 2012-08-16 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2015138856A (ja) 2014-01-22 2015-07-30 株式会社ディスコ 切削装置
JP2016514376A (ja) 2013-03-14 2016-05-19 ブルックス オートメーション インコーポレイテッド ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
JP2017175029A (ja) 2016-03-25 2017-09-28 富士機械製造株式会社 ウエハ搬送装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347036A (ja) * 1986-08-15 1988-02-27 Toshiba Corp 物品の移載装置
JP3054480B2 (ja) * 1991-12-20 2000-06-19 株式会社日立製作所 ペレットボンディング装置
JPH0778794A (ja) * 1993-06-22 1995-03-20 Disco Abrasive Syst Ltd ダイシング装置のカセットテーブル
JPH09199575A (ja) * 1996-01-18 1997-07-31 Toshiba Mechatronics Kk 半導体ペレットボンディング装置
JP2005159295A (ja) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd 基板処理装置及び処理方法
JP4464993B2 (ja) * 2007-06-29 2010-05-19 東京エレクトロン株式会社 基板の処理システム
JP2012009519A (ja) * 2010-06-23 2012-01-12 Hitachi High-Technologies Corp 真空処理装置
JP6707291B2 (ja) * 2016-10-14 2020-06-10 株式会社ディスコ ウェーハの加工方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082542A1 (fr) 2002-04-01 2003-10-09 Mitsuboshi Diamond Industrial Co., Ltd. Procede de sectionnement d'un substrat constitue d'un materiau fragile et dispositif de sectionnement faisant appel a ce procede
JP2012146872A (ja) 2011-01-13 2012-08-02 Disco Abrasive Syst Ltd 樹脂塗布装置
JP2012156413A (ja) 2011-01-28 2012-08-16 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2016514376A (ja) 2013-03-14 2016-05-19 ブルックス オートメーション インコーポレイテッド ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
JP2015138856A (ja) 2014-01-22 2015-07-30 株式会社ディスコ 切削装置
JP2017175029A (ja) 2016-03-25 2017-09-28 富士機械製造株式会社 ウエハ搬送装置

Also Published As

Publication number Publication date
JPWO2020090518A1 (ja) 2021-09-16
TW202018846A (zh) 2020-05-16
TWI805823B (zh) 2023-06-21
WO2020090518A1 (ja) 2020-05-07
CN112912998A (zh) 2021-06-04

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