JP7391282B1 - ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法 - Google Patents

ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法 Download PDF

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Publication number
JP7391282B1
JP7391282B1 JP2023557457A JP2023557457A JP7391282B1 JP 7391282 B1 JP7391282 B1 JP 7391282B1 JP 2023557457 A JP2023557457 A JP 2023557457A JP 2023557457 A JP2023557457 A JP 2023557457A JP 7391282 B1 JP7391282 B1 JP 7391282B1
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Prior art keywords
wire
cutting
parallel
workpiece
machining
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JP2023557457A
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English (en)
Japanese (ja)
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JPWO2024241506A1 (https=
JPWO2024241506A5 (https=
Inventor
英孝 三宅
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting
    • B23H7/08—Wire electrodes
    • B23H7/10—Supporting, winding or electrical connection of wire-electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2023557457A 2023-05-23 2023-05-23 ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法 Active JP7391282B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/019205 WO2024241506A1 (ja) 2023-05-23 2023-05-23 ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法

Publications (3)

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JP7391282B1 true JP7391282B1 (ja) 2023-12-04
JPWO2024241506A1 JPWO2024241506A1 (https=) 2024-11-28
JPWO2024241506A5 JPWO2024241506A5 (https=) 2025-04-30

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JP2023557457A Active JP7391282B1 (ja) 2023-05-23 2023-05-23 ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法

Country Status (5)

Country Link
JP (1) JP7391282B1 (https=)
CN (1) CN121152700A (https=)
DE (1) DE112023006392T5 (https=)
TW (1) TWI888115B (https=)
WO (1) WO2024241506A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1055508A (ja) * 1996-08-08 1998-02-24 Yamaha Corp 薄膜磁気ヘッド用ウェハの切断方法およびその装置
JP2012061550A (ja) * 2010-09-15 2012-03-29 Tokyo Cathode Laboratory Co Ltd マルチワイヤ放電加工装置及びマルチワイヤ放電加工方法並びに炭化ケイ素板の製造方法
WO2012070167A1 (ja) * 2010-11-24 2012-05-31 三菱電機株式会社 ワイヤ放電加工装置および半導体ウエハ製造方法
JP2014168832A (ja) * 2013-03-05 2014-09-18 Canon Marketing Japan Inc 加工装置、加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5786917B2 (ja) * 2013-01-29 2015-09-30 キヤノンマーケティングジャパン株式会社 ワイヤ放電加工装置およびワイヤ放電加工方法。
DE112014006901B4 (de) * 2014-09-24 2019-12-19 Mitsubishi Electric Corporation Elektrische Drahterodiervorrichtung und Verfahren zur Herstellung eines Halbleiterwafers
JP6537440B2 (ja) 2015-11-16 2019-07-03 株式会社ディスコ マルチワイヤ放電加工装置
DE112020007596T5 (de) * 2020-09-10 2023-06-29 Mitsubishi Electric Corporation Drahtfunkenbearbeitungseinrichtung und verfahren zum herstellen von halbleiterwafern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1055508A (ja) * 1996-08-08 1998-02-24 Yamaha Corp 薄膜磁気ヘッド用ウェハの切断方法およびその装置
JP2012061550A (ja) * 2010-09-15 2012-03-29 Tokyo Cathode Laboratory Co Ltd マルチワイヤ放電加工装置及びマルチワイヤ放電加工方法並びに炭化ケイ素板の製造方法
WO2012070167A1 (ja) * 2010-11-24 2012-05-31 三菱電機株式会社 ワイヤ放電加工装置および半導体ウエハ製造方法
JP2014168832A (ja) * 2013-03-05 2014-09-18 Canon Marketing Japan Inc 加工装置、加工方法

Also Published As

Publication number Publication date
DE112023006392T5 (de) 2026-03-05
JPWO2024241506A1 (https=) 2024-11-28
CN121152700A (zh) 2025-12-16
TWI888115B (zh) 2025-06-21
WO2024241506A1 (ja) 2024-11-28
TW202446523A (zh) 2024-12-01

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