JPWO2024241506A1 - - Google Patents
Info
- Publication number
- JPWO2024241506A1 JPWO2024241506A1 JP2023557457A JP2023557457A JPWO2024241506A1 JP WO2024241506 A1 JPWO2024241506 A1 JP WO2024241506A1 JP 2023557457 A JP2023557457 A JP 2023557457A JP 2023557457 A JP2023557457 A JP 2023557457A JP WO2024241506 A1 JPWO2024241506 A1 JP WO2024241506A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
- B23H7/08—Wire electrodes
- B23H7/10—Supporting, winding or electrical connection of wire-electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/019205 WO2024241506A1 (ja) | 2023-05-23 | 2023-05-23 | ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7391282B1 JP7391282B1 (ja) | 2023-12-04 |
| JPWO2024241506A1 true JPWO2024241506A1 (https=) | 2024-11-28 |
| JPWO2024241506A5 JPWO2024241506A5 (https=) | 2025-04-30 |
Family
ID=89023124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023557457A Active JP7391282B1 (ja) | 2023-05-23 | 2023-05-23 | ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7391282B1 (https=) |
| CN (1) | CN121152700A (https=) |
| DE (1) | DE112023006392T5 (https=) |
| TW (1) | TWI888115B (https=) |
| WO (1) | WO2024241506A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1055508A (ja) * | 1996-08-08 | 1998-02-24 | Yamaha Corp | 薄膜磁気ヘッド用ウェハの切断方法およびその装置 |
| JP5726471B2 (ja) * | 2010-09-15 | 2015-06-03 | 株式会社ディスコ | マルチワイヤ放電加工装置及びマルチワイヤ放電加工方法並びに炭化ケイ素板の製造方法 |
| WO2012070167A1 (ja) * | 2010-11-24 | 2012-05-31 | 三菱電機株式会社 | ワイヤ放電加工装置および半導体ウエハ製造方法 |
| JP5786917B2 (ja) * | 2013-01-29 | 2015-09-30 | キヤノンマーケティングジャパン株式会社 | ワイヤ放電加工装置およびワイヤ放電加工方法。 |
| JP2014168832A (ja) * | 2013-03-05 | 2014-09-18 | Canon Marketing Japan Inc | 加工装置、加工方法 |
| DE112014006901B4 (de) * | 2014-09-24 | 2019-12-19 | Mitsubishi Electric Corporation | Elektrische Drahterodiervorrichtung und Verfahren zur Herstellung eines Halbleiterwafers |
| JP6537440B2 (ja) | 2015-11-16 | 2019-07-03 | 株式会社ディスコ | マルチワイヤ放電加工装置 |
| DE112020007596T5 (de) * | 2020-09-10 | 2023-06-29 | Mitsubishi Electric Corporation | Drahtfunkenbearbeitungseinrichtung und verfahren zum herstellen von halbleiterwafern |
-
2023
- 2023-05-23 WO PCT/JP2023/019205 patent/WO2024241506A1/ja not_active Ceased
- 2023-05-23 DE DE112023006392.3T patent/DE112023006392T5/de active Pending
- 2023-05-23 JP JP2023557457A patent/JP7391282B1/ja active Active
- 2023-05-23 CN CN202380098426.2A patent/CN121152700A/zh active Pending
-
2024
- 2024-04-29 TW TW113115962A patent/TWI888115B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| DE112023006392T5 (de) | 2026-03-05 |
| JP7391282B1 (ja) | 2023-12-04 |
| CN121152700A (zh) | 2025-12-16 |
| TWI888115B (zh) | 2025-06-21 |
| WO2024241506A1 (ja) | 2024-11-28 |
| TW202446523A (zh) | 2024-12-01 |
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