CN121152700A - 线放电加工装置、线放电加工方法及晶片的制造方法 - Google Patents

线放电加工装置、线放电加工方法及晶片的制造方法

Info

Publication number
CN121152700A
CN121152700A CN202380098426.2A CN202380098426A CN121152700A CN 121152700 A CN121152700 A CN 121152700A CN 202380098426 A CN202380098426 A CN 202380098426A CN 121152700 A CN121152700 A CN 121152700A
Authority
CN
China
Prior art keywords
wire
cutting
parallel
electric discharge
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380098426.2A
Other languages
English (en)
Chinese (zh)
Inventor
三宅英孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN121152700A publication Critical patent/CN121152700A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting
    • B23H7/08—Wire electrodes
    • B23H7/10—Supporting, winding or electrical connection of wire-electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
CN202380098426.2A 2023-05-23 2023-05-23 线放电加工装置、线放电加工方法及晶片的制造方法 Pending CN121152700A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/019205 WO2024241506A1 (ja) 2023-05-23 2023-05-23 ワイヤ放電加工装置、ワイヤ放電加工方法およびウエハの製造方法

Publications (1)

Publication Number Publication Date
CN121152700A true CN121152700A (zh) 2025-12-16

Family

ID=89023124

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380098426.2A Pending CN121152700A (zh) 2023-05-23 2023-05-23 线放电加工装置、线放电加工方法及晶片的制造方法

Country Status (5)

Country Link
JP (1) JP7391282B1 (https=)
CN (1) CN121152700A (https=)
DE (1) DE112023006392T5 (https=)
TW (1) TWI888115B (https=)
WO (1) WO2024241506A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1055508A (ja) * 1996-08-08 1998-02-24 Yamaha Corp 薄膜磁気ヘッド用ウェハの切断方法およびその装置
JP5726471B2 (ja) * 2010-09-15 2015-06-03 株式会社ディスコ マルチワイヤ放電加工装置及びマルチワイヤ放電加工方法並びに炭化ケイ素板の製造方法
WO2012070167A1 (ja) * 2010-11-24 2012-05-31 三菱電機株式会社 ワイヤ放電加工装置および半導体ウエハ製造方法
JP5786917B2 (ja) * 2013-01-29 2015-09-30 キヤノンマーケティングジャパン株式会社 ワイヤ放電加工装置およびワイヤ放電加工方法。
JP2014168832A (ja) * 2013-03-05 2014-09-18 Canon Marketing Japan Inc 加工装置、加工方法
DE112014006901B4 (de) * 2014-09-24 2019-12-19 Mitsubishi Electric Corporation Elektrische Drahterodiervorrichtung und Verfahren zur Herstellung eines Halbleiterwafers
JP6537440B2 (ja) 2015-11-16 2019-07-03 株式会社ディスコ マルチワイヤ放電加工装置
DE112020007596T5 (de) * 2020-09-10 2023-06-29 Mitsubishi Electric Corporation Drahtfunkenbearbeitungseinrichtung und verfahren zum herstellen von halbleiterwafern

Also Published As

Publication number Publication date
DE112023006392T5 (de) 2026-03-05
JP7391282B1 (ja) 2023-12-04
JPWO2024241506A1 (https=) 2024-11-28
TWI888115B (zh) 2025-06-21
WO2024241506A1 (ja) 2024-11-28
TW202446523A (zh) 2024-12-01

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