JP7383798B2 - 金被覆ボンディングワイヤとその製造方法、半導体ワイヤ接合構造、及び半導体装置 - Google Patents
金被覆ボンディングワイヤとその製造方法、半導体ワイヤ接合構造、及び半導体装置 Download PDFInfo
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- JP7383798B2 JP7383798B2 JP2022514302A JP2022514302A JP7383798B2 JP 7383798 B2 JP7383798 B2 JP 7383798B2 JP 2022514302 A JP2022514302 A JP 2022514302A JP 2022514302 A JP2022514302 A JP 2022514302A JP 7383798 B2 JP7383798 B2 JP 7383798B2
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Description
なお、圧縮応力は圧縮試験機において自動計算される値を用いてもよい。圧子直径とは圧縮試験機についている圧子の直径のことである。円周率は3.14を用いる。
実施形態の金被覆ボンディングワイヤ1は、図1及び図2に示すように、銀(Ag)又は銅(Cu)を主成分とする芯材2と、芯材2の表面に設けられ、金(Au)を主成分として含む被覆層3とを有する。実施形態の金被覆ボンディングワイヤ1は、図3及び図4に示すように、さらに芯材2と被覆層3との間に設けられた中間金属層4を有していてもよい。中間金属層4は、パラジウム(Pd)、白金(Pt)、及びニッケル(Ni)から選ばれる1つの金属を主成分とする。
する際のワイヤの変形量、電極への接合性等に影響を及ぼす。このような点に対して、290MPa以上590MPa以下の圧縮応力を有する金被覆ボンディングワイヤ1を用いることによって、ウェッジ接合時に半導体チップ等に損傷を与えることなく、安定なウェッジ接合性やウェッジ接合強度を得ることができる。これによって、特に多段に積層された半導体チップの電極間をCWBにより1本のボンディングワイヤで個々の接合箇所によって条件の異なる接続エネルギーで連続接続する際に、チップ損傷を生じさせることなく、十分なウェッジ接合強度を得ることが可能になる。
次に、実施形態の金被覆ボンディングワイヤ1を用いた半導体装置について、図6ないし図8、図11、及び図12を参照して説明する。なお、図6は実施形態の半導体装置の樹脂封止する前の段階を示す断面図、図7は実施形態の半導体装置の樹脂封止した断面図、図8は実施形態の半導体装置における半導体チップの電極に接合された金被覆ボンディングワイヤ1のウェッジ接合部を示す断面図である。図11及び図12はそれぞれ実施形態の半導体装置の変形例を示す断面図である。
表1に示す芯材を用意し、連続伸線にて中間線径0.2~0.5mmまで加工した後、金電解めっき浴中に芯材を連続的に送線しながら浸漬させ、電流密度0.15~2.00A/dm2の電流にて金被覆層を形成した。
比較例について説明する。圧縮応力が本発明の範囲外となるボンディングワイヤを比較例1~6、11~18に示し、金以外の被覆層を形成するボンディングワイヤを比較例10、19、20に示す。また、被覆層を形成しないボンディングワイヤを比較例7~9に示した。以上を変更した以外は、基本的に実施例と同様の製造方法で比較例1~20のボンディングワイヤを作製した。実施例と同様これらボンディングワイヤの圧縮応力及び芯材断面のビッカース硬さを前述した方法で測定し、結果を表1に示した。このようにして得たボンディングワイヤを後述する特性評価に供した。
上記にて作製した試料のウェッジ接合評価について説明する。ウェッジ接合する相手は回路基板上の電極とチップ電極の2種類がある。詳細は後述するが、評価項目として連続ボンディングしたときに不具合が発生しないかどうか(連続ボンディング性)、ボンディングがきちんと接合されているかどうか(接合強度)、チップが損傷していないかどうか、の3つの評価を行う。評価結果を表1及び表2に示す。ただし、チップ損傷評価に関してはデリケートで壊れやすいチップ電極のみとした。
前述した通り、特に多段積層したチップの電極にボンディングワイヤをウェッジ接合する時には、接合する位置やロケーション等によって、チップ割れを起こさずに、しっかりと接合させなければならないため、様々に異なる広範囲の接合条件が求められる。ワイヤの適応性をはかる指標として、接合エネルギーが評価方法として適しており、接合エネルギーの条件を広範囲に振っても、問題なく上記した3つの評価項目に合格できるかどうかを確認する。
基板電極上へのウェッジ接合性については、チップ電極と基板電極(リードフレーム)との連続ワイヤボンディングにて評価した。ウェッジ接合条件は、前述した高接合条件にて、Agめっきリードフレームに対し36サイクル×2セットの合計72箇所ウェッジ接合した。ここでの1サイクルとはチップ電極上のボールボンディングからフレーム上へのウェッジ接合およびワイヤの引きちぎりまでをいい、このサイクルを36回連続して2セット行った。合計72回接合したうち、ウェッジ接合部の不着やワイヤ切れ等の不具合によって装置が停止しなかった場合は、連続ボンディング性が良好であるため「◎」と表記した。ウェッジ接合部の不具合による装置の停止回数が2回未満の場合は、量産工程で改善可能であるとして「○」と表記した。前記装置の停止回数が2回以上の場合は不良とみなし「×」と表記した。
前記ワイヤボンディングでウェッジ接合した試料をボンドテスター(一例:デイジ社製、ボンドテスター4000型)を用いて、試料のウェッジ接合近傍にフックを掛けてプルテストを、前記の条件で行った試料の中から20ワイヤを無作為抽出にて実施し、リフト(破断モードの中のひとつ)の有無を確認した。ボンドテスターの設定条件はロードセルWP100、測定レンジ50%、テスト速度250μm/minとした。プルテストの破断モードにおいて、接合部のワイヤが基板から剥がれてしまうリフトの発生がない場合は良好ということで「◎」と表記した。リフトの発生数が3本未満の場合は量産工程で改善可能であるとし「○」と表記した。リフトの発生数が3本以上の場合は不良とし「×」と表記した。また、プル強度2gf未満が1本でも発生した場合においても不良とし「×」と表記した。
本評価はAgめっきリードフレームに前記チップを搭載したデバイスを用いた。前記チップ上にCWB方式を用いて、360本(10本/サイクル×36サイクル)の連続ウェッジボンディングを実施した。1サイクルには前記ウェッジ接合条件(低接合エネルギー、中接合エネルギー、高接合エネルギーの3水準)を設けており、1サイクルあたり3本/ウェッジ接合条件×3水準のウェッジ接合を有する(最初の1本目のボンディングはボールボンディングで行っているため、ウェッジボンディング箇所は1サイクルで9本となる。)。従って、1チップあたりに各水準で接合されたワイヤは108本(ウェッジ接合数108ボンド=3本×36サイクル)となる。ウェッジボンディグ用のキャピラリ形状はH径:ワイヤ線径の1.2~1.3倍、CD径:ワイヤ線径の1.5~1.8倍、T:ワイヤ線径の3.5~3.8倍、FA:0°、OR径:4~12μm、表面仕上げMatte仕様を使用した。ウェッジ接合部の不着、Al膜の剥がれ、ワイヤ切れ等の不具合によって装置が停止しなかった場合は、各接合エネルギーでのウェッジ接合の連続ボンディング性が良好であるとし「◎」と表記した。各接合エネルギーでウェッジ接合部の不具合による装置の停止回数が5回未満の場合は、量産工程で改善可能であるとし「○」と表記した。前記装置の停止回数は5回以上の場合は当該接合エネルギーでのウェッジ接合性が不良であるとし「×」と表記した。
前記チップ上のウェッジ接合で作製した試料をボンドテスター(一例:デイジ社製、ボンドテスター4000型)にて、試料にフックを掛けて引っ張るプルテストを、接合エネルギー条件毎に108本の中から無作為に抽出した20ワイヤを実施し、破断モードを確認した。ボンドテスターの設定条件はロードセルWP100、測定レンジ50%、テスト速度250μm/minとした。プルテストの破断モードにおいて、接合部のワイヤがチップ電極から剥がれてしまうリフトの発生がない場合は、当該接合エネルギーでのウェッジ接合強度が良好であるとし「◎」と表記した。リフトの発生数が3本未満の場合は、量産工程での改善可能であるため「○」と表記した。リフトの発生数が3本以上の場合は、当該接合エネルギーでのウェッジ接合強度が不良であるとし「×」と表記した。
本評価はAgめっきリードフレームに前記チップを搭載したデバイスを用い、前記チップ上にCWB方式にて、64本(16本/サイクル×4セット)の連続ボンディングを実施した。1サイクルには前記ウェッジ接合条件(低接合エネルギー、中接合エネルギー、高接合エネルギーの3水準)を設けており、1サイクルにつき5本単位で3つの接合エネルギー水準に振り分けた(前記と同様に最初の1本目はボールボンディングで行っているため、ウェッジボンディング箇所の合計は15本となる。)。1チップあたりに各水準で接合されたワイヤが20本(ウェッジ接合数20ボンド=5本×4セット)となる。ウェッジボンディグ用のキャピラリは段落[0095]と同じものを使用した。
Claims (15)
- 銀又は銅を主成分として含む芯材と、
前記芯材の表面に設けられ、金を主成分として含む被覆層とを有する金被覆ボンディングワイヤであって、
前記金被覆ボンディングワイヤは、前記被覆層の膜厚が5nm以上200nm以下であり、かつ線径に対して60%変形させたときの圧縮応力が290MPa以上590MPa以下である、金被覆ボンディングワイヤ。 - 前記芯材の断面におけるビッカース硬さ(Hv)が40以上80以下である、請求項1に記載の金被覆ボンディングワイヤ。
- 前記芯材は97質量%以上の銀を含む銀合金からなり、かつ前記ワイヤの全体量に対して、1質量ppm以上3質量%以下の範囲で銅、カルシウム、リン、金、パラジウム、白金、ニッケル、ロジウム、インジウム、及び鉄からなる群より選ばれる少なくとも1つの金属を含む、請求項1又は請求項2に記載の金被覆ボンディングワイヤ。
- 前記芯材は98質量%以上の銅を含む銅合金からなり、かつ前記ワイヤの全体量に対して、リン、金、パラジウム、白金、ニッケル、銀、ロジウム、インジウム、ガリウム、及び鉄からなる群より選ばれる少なくとも1つの金属を1質量ppm以上2質量%以下の範囲で含む、請求項1又は請求項2に記載の金被覆ボンディングワイヤ。
- 前記金被覆ボンディングワイヤの線径が13μm以上35μm以下である、請求項1ないし請求項4のいずれか1項に記載の金被覆ボンディングワイヤ。
- さらに、前記芯材と前記被覆層との間に設けられた中間金属層を有し、前記中間金属層はパラジウム、白金、及びニッケルからなる群より選ばれる1つの金属を主成分とする、請求項1ないし請求項5のいずれか1項に記載の金被覆ボンディングワイヤ。
- 前記中間金属層は60nm以下の厚さを有する、請求項6に記載の金被覆ボンディングワイヤ。
- 半導体メモリ用である、請求項1ないし請求項7のいずれか1項に記載の金被覆ボンディングワイヤ。
- 銀又は銅を主成分として含む芯材と、
前記芯材の表面に設けられ、金を主成分として含む被覆層とを有する金被覆ボンディングワイヤの製造方法であって、
前記金被覆ボンディングワイヤの前記被覆層の膜厚を5nm以上200nm以下とし、かつワイヤ線径に対して60%変形させたときの圧縮応力を290MPa以上590MPa以下とする、金被覆ボンディングワイヤの製造方法。 - 銀又は銅を主成分として含む芯材と金を主成分とする被覆層とを有する金被覆ボンディングワイヤと、半導体チップの電極と、前記ワイヤと前記電極とが接合されたウェッジ接合部と、を有する半導体ワイヤ接合構造であって、
前記金被覆ボンディングワイヤは、前記被覆層の膜厚が5nm以上200nm以下であり、かつワイヤ線径に対して60%変形させたときの圧縮応力が290MPa以上590MPa以下である、半導体ワイヤ接合構造。 - 2個以上の前記半導体チップと、前記2個以上の前記半導体チップの電極と前記ワイヤとが順に接続された2個以上の前記ウェッジ接合部とを有する、請求項10に記載の半導体ワイヤ接合構造。
- 半導体メモリ用である、請求項10又は請求項11に記載の半導体ワイヤ接合構造。
- 少なくとも1つの第1電極を有する1つ又は複数の半導体チップと、
少なくとも1つの第2電極を有するリードフレーム及び回路基板から選ばれる回路基材と、
前記半導体チップの第1電極と前記回路基材の第2電極との間、及び前記複数の半導体チップの第1電極間から選ばれる少なくとも1つを電気的に接続する金被覆ボンディングワイヤと、
前記第1電極又は前記第2電極と前記金被覆ボンディングワイヤとが接合されたウェッジ接合部とを具備する半導体装置であって、
前記金被覆ボンディングワイヤは、銀又は銅を主成分として含む芯材と、前記芯材の表面に設けられ、膜厚が5nm以上200nm以下であり、金を主成分として含む被覆層とを有し、
前記金被覆ボンディングワイヤのワイヤ線径に対して60%変形させたときの圧縮応力が290MPa以上590MPa以下である、半導体装置。 - 少なくとも1つの前記第1電極をそれぞれ有する複数の前記半導体チップを具備し、
前記複数の半導体チップは前記第1電極が露出するように積層されており、
前記金被覆ボンディングワイヤで前記複数の半導体チップの前記第1電極を順に接続する2個以上の前記ウェッジ接合部を有する、請求項13に記載の半導体装置。 - 半導体メモリ用である、請求項13又は請求項14に記載の半導体装置。
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