JP7373778B2 - 樹脂付き金属箔、フレキシブルプリント配線板 - Google Patents
樹脂付き金属箔、フレキシブルプリント配線板 Download PDFInfo
- Publication number
- JP7373778B2 JP7373778B2 JP2022104362A JP2022104362A JP7373778B2 JP 7373778 B2 JP7373778 B2 JP 7373778B2 JP 2022104362 A JP2022104362 A JP 2022104362A JP 2022104362 A JP2022104362 A JP 2022104362A JP 7373778 B2 JP7373778 B2 JP 7373778B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal foil
- layer
- insulating layer
- coated metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005989 resin Polymers 0.000 title claims description 165
- 239000011347 resin Substances 0.000 title claims description 165
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- 239000002184 metal Substances 0.000 title claims description 97
- 229910052751 metal Inorganic materials 0.000 title claims description 97
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- 239000004962 Polyamide-imide Substances 0.000 claims description 27
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- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical group C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
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- ICMZFZGUTLNLAJ-UHFFFAOYSA-N 2,6-dimethyl-7-oxabicyclo[4.1.0]hepta-2,4-diene Chemical compound CC1=CC=CC2(C)OC12 ICMZFZGUTLNLAJ-UHFFFAOYSA-N 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
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- 230000005856 abnormality Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- 150000001408 amides Chemical class 0.000 description 1
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- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
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- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- 238000010992 reflux Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
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- 238000010792 warming Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/036—Multilayers with layers of different types
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/00—Printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/406—Bright, glossy, shiny surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
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- H05K2201/01—Dielectrics
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- H—ELECTRICITY
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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Description
金属箔に第1絶縁層及び第2絶縁層がこの順に形成された樹脂付き金属箔であって、
前記第1絶縁層は、ポリイミド樹脂層、ポリアミドイミド樹脂層、液晶ポリマー樹脂層、フッ素樹脂層又はポリフェニレンエーテル樹脂層で形成され、
前記第2絶縁層は、半硬化状態のポリオレフィン樹脂層で形成されていると共に、
前記ポリオレフィン樹脂層が、成分(A)ポリオレフィン系エラストマーと、成分(B)熱硬化性樹脂とを含み、
前記ポリオレフィン樹脂層全体に占める前記成分(A)ポリオレフィン系エラストマーの割合が50~95質量%である。
本実施形態の樹脂付き金属箔30について説明する。樹脂付き金属箔30は、後述のフレキシブルプリント配線板40の材料として用いることができる。図1A~図1Fに樹脂付き金属箔30の具体例を示す。樹脂付き金属箔30は、金属箔50に第1絶縁層21及び第2絶縁層22がこの順に形成されている。
本実施形態のフレキシブルプリント配線板40について説明する。フレキシブルプリント配線板40は、上述の樹脂付き金属箔30の第1絶縁層21の硬化物又は固化物と、第2絶縁層22の硬化物とを、絶縁層2として有している。図2にフレキシブルプリント配線板40の具体例を示す。図2に示すフレキシブルプリント配線板40は、絶縁フィルム7と、導体層1と、絶縁層2と、金属箔50と、非貫通孔13とを備えている。なお、フレキシブルプリント配線板40には、フレックスリジッドプリント配線板も含まれる。
実施例1は、実施例1-(1)~実施例1-(11)の11種類の実施例で構成される。これらの実施例は、第2絶縁層のみが異なるだけで、その他は同じである。
実施例2は、実施例2-(1)~実施例2-(11)の11種類の実施例で構成される。これらの実施例は、第2絶縁層のみが異なるだけで、その他は同じである。
実施例1において、ポリオレフィン樹脂層の代わりにエポキシ樹脂層を形成した。それ以外の内容は実施例1と同じにした。
4,4’-ジシクロヘキシルメタンジイソシアネート590g、シクロヘキシルイソシアネート62.6g及びカルボジイミド化触媒(3-メチル-1-フェニル-2-ホスホレン-1-オキシド)6.12gを180℃で48時間反応させることによって、カルボジイミド化合物として、4,4’-ジシクロヘキシルメタンカルボジイミド樹脂(重合度=10)を得た。
1リットルのセパラブルフラスコにエステル共重合アミド樹脂(商品名:「CM8000」、東レ株式会社製)50.0gとイソプロピルアルコールとトルエンとの混合溶媒(質量混合比4:6)450.0gとを加えて撹拌することにより溶解させた。こうして得られた溶液に上記カルボジイミド化合物(4,4’-ジシクロヘキシルメタンカルボジイミド樹脂)5.0gを加え、フラスコを120℃のオイルバスに浸漬させてリフラックス下で3時間加熱撹拌した後に、減圧乾燥して溶媒を除去することにより、カルボジイミド変性ポリアミドを得た。
実施例1において、ポリオレフィン樹脂層の代わりにエポキシ樹脂層を形成した。それ以外の内容は実施例1と同じにした。
厚み25μmのポリイミドフィルムの両面に、樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形することによってサンプルを作製した。このサンプルの金属箔(銅箔)をサンプルの表面に対して90°方向に引き剥がしたときの銅箔引き剥がし強度を測定した。測定結果を表1及び表2に示す。
厚み25μmのポリイミドフィルムの片面に、厚み18μmの電解銅箔でMITパターンの回路が形成されたフレキシブルプリント配線板を準備した。このフレキシブルプリント配線板の両面に、樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形した後、両面の樹脂付き金属箔の金属箔を全面エッチングにより除去することによってサンプルを作製した。このサンプルを用いてMIT試験を行った。測定条件は、折り曲げクランプのR=0.38mm、荷重500gf、毎分175回の割合で折り曲げるように設定した。回路の導通が取れなくなるまでの折り曲げ回数により屈曲性を評価した。具体的には100回以上を「合格」、100回未満を「不合格」とした。評価結果を表1及び表2に示す。
厚み25μmのポリイミドフィルムの両面に、樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形することによってサンプルを作製した。このサンプルを260℃と288℃に加熱した半田浴にそれぞれ60秒間浸漬した後、外観を観察することにより半田耐熱性を評価した。膨れやはがれ等の外観異常の発生がないものを「合格」とし、これ以外のものを「不合格」とした。評価結果を表1及び表2に示す。
厚み35μmの圧延銅箔で櫛形パターンの回路が形成されたフレキシブルプリント配線板を準備し、このフレキシブルプリント配線板の回路形成面に樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形することによってサンプルを作製した。このサンプルの断面を目視にて観察することにより回路充填性を評価した。回路間が全て樹脂で充填されているものを「合格」とし、これ以外のものを「不合格」とした。評価結果を表1及び表2に示す。
樹脂付き金属箔に直径10mmの孔をあけてから、この樹脂付き金属箔の第2絶縁層を電解銅箔の光沢面に重ねて貼り合わせ、170℃で30分間加熱加圧成形することによってサンプルを作製した。この際、樹脂が孔の内側に流れ出る長さを測定することにより樹脂流れ性を評価した。流れ出る量が1.0mm以下のものを「合格」とし、これ以外のものを「不合格」とした。評価結果を表1及び表2に示す。
5 フッ素樹脂層
6 ポリフェニレンエーテル樹脂層
8 ポリアミドイミド樹脂層
9 ポリイミド樹脂層
21 第1絶縁層
22 第2絶縁層
30 樹脂付き金属箔
40 フレキシブルプリント配線板
50 金属箔
Claims (6)
- 金属箔に第1絶縁層及び第2絶縁層がこの順に形成された樹脂付き金属箔であって、
前記第1絶縁層は、ポリイミド樹脂層、ポリアミドイミド樹脂層、液晶ポリマー樹脂層、フッ素樹脂層又はポリフェニレンエーテル樹脂層で形成され、
前記第2絶縁層は、半硬化状態のポリオレフィン樹脂層で形成されていると共に、
前記ポリオレフィン樹脂層が、成分(A)ポリオレフィン系エラストマーと、成分(B)熱硬化性樹脂とを含み、
前記ポリオレフィン樹脂層全体に占める前記成分(A)ポリオレフィン系エラストマーの割合が10000/130.3質量%以上95質量%以下である、
樹脂付き金属箔。 - 前記成分(B)熱硬化性樹脂が、エポキシ樹脂、フェノール樹脂、ビスマレイミド樹脂及び両末端ビニル基のポリフェニレンエーテルオリゴマーからなる群より選択される1種又は2種以上である、
請求項1に記載の樹脂付き金属箔。 - 前記ポリオレフィン樹脂層が、成分(C)硬化促進剤をさらに含む、
請求項1又は2に記載の樹脂付き金属箔。 - 前記ポリオレフィン樹脂層が、成分(D)充填材をさらに含む、
請求項1乃至3のいずれか一項に記載の樹脂付き金属箔。 - 前記ポリオレフィン樹脂層が、180℃で60分間処理した後の貯蔵弾性率が25℃~150℃において105~108Paである、
請求項1乃至4のいずれか一項に記載の樹脂付き金属箔。 - 請求項1乃至5のいずれか一項に記載の樹脂付き金属箔の前記第1絶縁層及び前記第2絶縁層の硬化物を絶縁層として有している、
フレキシブルプリント配線板。
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PCT/JP2017/002297 WO2017130947A1 (ja) | 2016-01-26 | 2017-01-24 | 樹脂付き金属箔、フレキシブルプリント配線板 |
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WO2002040611A1 (fr) | 2000-11-20 | 2002-05-23 | Kuraray Co., Ltd. | Adhesif autocollant ou colle et copolymere bloc convenant a cet effet |
JP2004315595A (ja) | 2003-04-14 | 2004-11-11 | Dainippon Ink & Chem Inc | 接着剤組成物、フレキシブル配線基板、及びカバーレイフィルム |
WO2013027284A1 (ja) | 2011-08-24 | 2013-02-28 | 旭化成イーマテリアルズ株式会社 | 樹脂封止シート及び太陽電池モジュール |
WO2014046014A1 (ja) | 2012-09-20 | 2014-03-27 | 株式会社クラレ | 回路基板およびその製造方法 |
JP5404959B1 (ja) | 2013-07-05 | 2014-02-05 | 積水フーラー株式会社 | ホットメルト接着剤組成物及びこれを用いてなる吸水性物品 |
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TW201741132A (zh) | 2017-12-01 |
CN108702840A (zh) | 2018-10-23 |
TWI712489B (zh) | 2020-12-11 |
JPWO2017130947A1 (ja) | 2018-11-15 |
KR20180111809A (ko) | 2018-10-11 |
CN108702840B (zh) | 2021-05-07 |
WO2017130947A1 (ja) | 2017-08-03 |
JP2022133347A (ja) | 2022-09-13 |
US10751976B2 (en) | 2020-08-25 |
US20190061320A1 (en) | 2019-02-28 |
JP7320768B2 (ja) | 2023-08-04 |
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