JP7320768B2 - 樹脂付き金属箔、フレキシブルプリント配線板 - Google Patents
樹脂付き金属箔、フレキシブルプリント配線板 Download PDFInfo
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- JP7320768B2 JP7320768B2 JP2017564260A JP2017564260A JP7320768B2 JP 7320768 B2 JP7320768 B2 JP 7320768B2 JP 2017564260 A JP2017564260 A JP 2017564260A JP 2017564260 A JP2017564260 A JP 2017564260A JP 7320768 B2 JP7320768 B2 JP 7320768B2
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
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Description
金属箔に第1絶縁層及び第2絶縁層がこの順に形成された樹脂付き金属箔であって、
前記第1絶縁層は、ポリイミド樹脂層、ポリアミドイミド樹脂層、液晶ポリマー樹脂層、フッ素樹脂層又はポリフェニレンエーテル樹脂層で形成され、
前記第2絶縁層は、半硬化状態のポリオレフィン樹脂層で形成されていると共に、
前記ポリオレフィン樹脂層が、成分(A)ポリオレフィン系エラストマーと、成分(B)熱硬化性樹脂とを含み、
前記ポリオレフィン樹脂層全体に占める前記成分(A)ポリオレフィン系エラストマーの割合が10000/130.3質量%以上95質量%以下であり、
前記成分(A)ポリオレフィン系エラストマーが、ポリスチレン-ポリ(エチレン/プロピレン)ブロック-ポリスチレン共重合体、ポリスチレン-ポリ(エチレン-エチレン/プロピレン)ブロック-ポリスチレン共重合体、ポリスチレン-ポリ(エチレン/ブチレン)ブロック-ポリスチレン共重合体、ポリスチレン-ポリイソプレンブロック共重合体、水添ポリスチレン-ポリイソプレン-ポリブタジエンブロック共重合体、ポリスチレン-ポリ(ブタジエン/ブチレン)ブロック-ポリスチレン共重合体、エチレン-グリシジルメタクリレート-アクリル酸メチル共重合体及びエチレン-グリシジルメタクリレート-酢酸ビニル共重合体からなる群より選択される1種又は2種以上である。
本実施形態の樹脂付き金属箔30について説明する。樹脂付き金属箔30は、後述のフレキシブルプリント配線板40の材料として用いることができる。図1A~図1Fに樹脂付き金属箔30の具体例を示す。樹脂付き金属箔30は、金属箔50に第1絶縁層21及び第2絶縁層22がこの順に形成されている。
本実施形態のフレキシブルプリント配線板40について説明する。フレキシブルプリント配線板40は、上述の樹脂付き金属箔30の第1絶縁層21の硬化物又は固化物と、第2絶縁層22の硬化物とを、絶縁層2として有している。図2にフレキシブルプリント配線板40の具体例を示す。図2に示すフレキシブルプリント配線板40は、絶縁フィルム7と、導体層1と、絶縁層2と、金属箔50と、非貫通孔13とを備えている。なお、フレキシブルプリント配線板40には、フレックスリジッドプリント配線板も含まれる。
実施例1は、実施例1-(1)~実施例1-(11)の11種類の実施例で構成される。これらの実施例は、第2絶縁層のみが異なるだけで、その他は同じである。
実施例2は、実施例2-(1)~実施例2-(11)の11種類の実施例で構成される。これらの実施例は、第2絶縁層のみが異なるだけで、その他は同じである。
実施例1において、ポリオレフィン樹脂層の代わりにエポキシ樹脂層を形成した。それ以外の内容は実施例1と同じにした。
4,4’-ジシクロヘキシルメタンジイソシアネート590g、シクロヘキシルイソシアネート62.6g及びカルボジイミド化触媒(3-メチル-1-フェニル-2-ホスホレン-1-オキシド)6.12gを180℃で48時間反応させることによって、カルボジイミド化合物として、4,4’-ジシクロヘキシルメタンカルボジイミド樹脂(重合度=10)を得た。
1リットルのセパラブルフラスコにエステル共重合アミド樹脂(商品名:「CM8000」、東レ株式会社製)50.0gとイソプロピルアルコールとトルエンとの混合溶媒(質量混合比4:6)450.0gとを加えて撹拌することにより溶解させた。こうして得られた溶液に上記カルボジイミド化合物(4,4’-ジシクロヘキシルメタンカルボジイミド樹脂)5.0gを加え、フラスコを120℃のオイルバスに浸漬させてリフラックス下で3時間加熱撹拌した後に、減圧乾燥して溶媒を除去することにより、カルボジイミド変性ポリアミドを得た。
実施例1において、ポリオレフィン樹脂層の代わりにエポキシ樹脂層を形成した。それ以外の内容は実施例1と同じにした。
厚み25μmのポリイミドフィルムの両面に、樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形することによってサンプルを作製した。このサンプルの金属箔(銅箔)をサンプルの表面に対して90°方向に引き剥がしたときの銅箔引き剥がし強度を測定した。測定結果を表1及び表2に示す。
厚み25μmのポリイミドフィルムの片面に、厚み18μmの電解銅箔でMITパターンの回路が形成されたフレキシブルプリント配線板を準備した。このフレキシブルプリント配線板の両面に、樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形した後、両面の樹脂付き金属箔の金属箔を全面エッチングにより除去することによってサンプルを作製した。このサンプルを用いてMIT試験を行った。測定条件は、折り曲げクランプのR=0.38mm、荷重500gf、毎分175回の割合で折り曲げるように設定した。回路の導通が取れなくなるまでの折り曲げ回数により屈曲性を評価した。具体的には100回以上を「合格」、100回未満を「不合格」とした。評価結果を表1及び表2に示す。
厚み25μmのポリイミドフィルムの両面に、樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形することによってサンプルを作製した。このサンプルを260℃と288℃に加熱した半田浴にそれぞれ60秒間浸漬した後、外観を観察することにより半田耐熱性を評価した。膨れやはがれ等の外観異常の発生がないものを「合格」とし、これ以外のものを「不合格」とした。評価結果を表1及び表2に示す。
厚み35μmの圧延銅箔で櫛形パターンの回路が形成されたフレキシブルプリント配線板を準備し、このフレキシブルプリント配線板の回路形成面に樹脂付き金属箔の第2絶縁層を重ねて貼り合わせ、180℃で1時間加熱加圧成形することによってサンプルを作製した。このサンプルの断面を目視にて観察することにより回路充填性を評価した。回路間が全て樹脂で充填されているものを「合格」とし、これ以外のものを「不合格」とした。評価結果を表1及び表2に示す。
樹脂付き金属箔に直径10mmの孔をあけてから、この樹脂付き金属箔の第2絶縁層を電解銅箔の光沢面に重ねて貼り合わせ、170℃で30分間加熱加圧成形することによってサンプルを作製した。この際、樹脂が孔の内側に流れ出る長さを測定することにより樹脂流れ性を評価した。流れ出る量が1.0mm以下のものを「合格」とし、これ以外のものを「不合格」とした。評価結果を表1及び表2に示す。
5 フッ素樹脂層
6 ポリフェニレンエーテル樹脂層
8 ポリアミドイミド樹脂層
9 ポリイミド樹脂層
21 第1絶縁層
22 第2絶縁層
30 樹脂付き金属箔
40 フレキシブルプリント配線板
50 金属箔
Claims (6)
- 金属箔に第1絶縁層及び第2絶縁層がこの順に形成された樹脂付き金属箔であって、
前記第1絶縁層は、ポリイミド樹脂層、ポリアミドイミド樹脂層、液晶ポリマー樹脂層、フッ素樹脂層又はポリフェニレンエーテル樹脂層で形成され、
前記第2絶縁層は、半硬化状態のポリオレフィン樹脂層で形成されていると共に、
前記ポリオレフィン樹脂層が、成分(A)ポリオレフィン系エラストマーと、成分(B)熱硬化性樹脂とを含み、
前記ポリオレフィン樹脂層全体に占める前記成分(A)ポリオレフィン系エラストマーの割合が10000/130.3質量%以上95質量%以下であり、
前記成分(A)ポリオレフィン系エラストマーが、ポリスチレン-ポリ(エチレン/プロピレン)ブロック-ポリスチレン共重合体、ポリスチレン-ポリ(エチレン-エチレン/プロピレン)ブロック-ポリスチレン共重合体、ポリスチレン-ポリ(エチレン/ブチレン)ブロック-ポリスチレン共重合体、ポリスチレン-ポリイソプレンブロック共重合体、水添ポリスチレン-ポリイソプレン-ポリブタジエンブロック共重合体、ポリスチレン-ポリ(ブタジエン/ブチレン)ブロック-ポリスチレン共重合体、エチレン-グリシジルメタクリレート-アクリル酸メチル共重合体及びエチレン-グリシジルメタクリレート-酢酸ビニル共重合体からなる群より選択される1種又は2種以上である、
樹脂付き金属箔。 - 前記成分(B)熱硬化性樹脂が、エポキシ樹脂、フェノール樹脂、ビスマレイミド樹脂及び両末端ビニル基のポリフェニレンエーテルオリゴマーからなる群より選択される1種又は2種以上である、
請求項1に記載の樹脂付き金属箔。 - 前記ポリオレフィン樹脂層が、成分(C)硬化促進剤をさらに含む、
請求項1又は2に記載の樹脂付き金属箔。 - 前記ポリオレフィン樹脂層が、成分(D)充填材をさらに含む、
請求項1乃至3のいずれか一項に記載の樹脂付き金属箔。 - 前記ポリオレフィン樹脂層が、180℃で60分間処理した後の貯蔵弾性率が25℃~150℃において105~108Paである、
請求項1乃至4のいずれか一項に記載の樹脂付き金属箔。 - 請求項1乃至5のいずれか一項に記載の樹脂付き金属箔の前記第1絶縁層及び前記第2絶縁層の硬化物を絶縁層として有している、
フレキシブルプリント配線板。
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