JP7373080B2 - 導電性液晶性樹脂組成物 - Google Patents

導電性液晶性樹脂組成物 Download PDF

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Publication number
JP7373080B2
JP7373080B2 JP2022568229A JP2022568229A JP7373080B2 JP 7373080 B2 JP7373080 B2 JP 7373080B2 JP 2022568229 A JP2022568229 A JP 2022568229A JP 2022568229 A JP2022568229 A JP 2022568229A JP 7373080 B2 JP7373080 B2 JP 7373080B2
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Japan
Prior art keywords
conductive filler
conductive
liquid crystal
resin composition
fibrous
Prior art date
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JP2022568229A
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English (en)
Japanese (ja)
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JPWO2022124180A5 (https=
JPWO2022124180A1 (https=
Inventor
真奈 中村
光博 望月
昭宏 長永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
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Filing date
Publication date
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Publication of JPWO2022124180A1 publication Critical patent/JPWO2022124180A1/ja
Publication of JPWO2022124180A5 publication Critical patent/JPWO2022124180A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022568229A 2020-12-07 2021-12-02 導電性液晶性樹脂組成物 Active JP7373080B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020202782 2020-12-07
JP2020202782 2020-12-07
PCT/JP2021/044205 WO2022124180A1 (ja) 2020-12-07 2021-12-02 導電性液晶性樹脂組成物

Publications (3)

Publication Number Publication Date
JPWO2022124180A1 JPWO2022124180A1 (https=) 2022-06-16
JPWO2022124180A5 JPWO2022124180A5 (https=) 2023-02-03
JP7373080B2 true JP7373080B2 (ja) 2023-11-01

Family

ID=81973181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022568229A Active JP7373080B2 (ja) 2020-12-07 2021-12-02 導電性液晶性樹脂組成物

Country Status (5)

Country Link
JP (1) JP7373080B2 (https=)
KR (1) KR102748762B1 (https=)
CN (1) CN116601230B (https=)
TW (1) TWI874733B (https=)
WO (1) WO2022124180A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194194A (ja) 2000-12-25 2002-07-10 Polyplastics Co 半導電性樹脂組成物及び成形品
JP2005533909A (ja) 2002-07-25 2005-11-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 静電気拡散性熱可塑性ポリマー組成物
JP2018048306A (ja) 2016-09-14 2018-03-29 住友化学株式会社 液晶性樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739533B2 (ja) * 1986-12-10 1995-05-01 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
JP2550797B2 (ja) 1991-04-10 1996-11-06 東レ株式会社 液晶ポリマ樹脂組成物
JP2550797Y2 (ja) * 1992-01-18 1997-10-15 太陽誘電株式会社 トンネル型乾燥炉
JP4161494B2 (ja) * 1998-12-11 2008-10-08 東レ株式会社 難燃性樹脂組成物、その長繊維ペレットおよびその成形品
JP4724900B2 (ja) * 1999-07-13 2011-07-13 東レ株式会社 難燃性ポリアミド樹脂組成物およびその成形品
JP2001067933A (ja) * 1999-08-24 2001-03-16 Toray Ind Inc 導電性樹脂組成物およびその成形品
JP4302508B2 (ja) 2003-12-26 2009-07-29 ポリプラスチックス株式会社 導電性樹脂組成物
WO2014087842A1 (ja) * 2012-12-03 2014-06-12 ポリプラスチックス株式会社 カメラモジュール用液晶性樹脂組成物及びそれを用いたカメラモジュール
WO2018012371A1 (ja) * 2016-07-11 2018-01-18 ポリプラスチックス株式会社 液晶性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194194A (ja) 2000-12-25 2002-07-10 Polyplastics Co 半導電性樹脂組成物及び成形品
JP2005533909A (ja) 2002-07-25 2005-11-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 静電気拡散性熱可塑性ポリマー組成物
JP2018048306A (ja) 2016-09-14 2018-03-29 住友化学株式会社 液晶性樹脂組成物

Also Published As

Publication number Publication date
CN116601230B (zh) 2025-04-18
KR20230116010A (ko) 2023-08-03
CN116601230A (zh) 2023-08-15
WO2022124180A1 (ja) 2022-06-16
JPWO2022124180A1 (https=) 2022-06-16
TW202231763A (zh) 2022-08-16
TWI874733B (zh) 2025-03-01
KR102748762B1 (ko) 2025-01-03

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