TWI874733B - 導電性液晶性樹脂組合物 - Google Patents

導電性液晶性樹脂組合物 Download PDF

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Publication number
TWI874733B
TWI874733B TW110145222A TW110145222A TWI874733B TW I874733 B TWI874733 B TW I874733B TW 110145222 A TW110145222 A TW 110145222A TW 110145222 A TW110145222 A TW 110145222A TW I874733 B TWI874733 B TW I874733B
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TW
Taiwan
Prior art keywords
conductive filler
liquid crystal
crystal resin
conductive
resin composition
Prior art date
Application number
TW110145222A
Other languages
English (en)
Chinese (zh)
Other versions
TW202231763A (zh
Inventor
中村真奈
望月光博
長永昭宏
Original Assignee
日商寶理塑料股份有限公司
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Publication date
Application filed by 日商寶理塑料股份有限公司 filed Critical 日商寶理塑料股份有限公司
Publication of TW202231763A publication Critical patent/TW202231763A/zh
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Publication of TWI874733B publication Critical patent/TWI874733B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110145222A 2020-12-07 2021-12-03 導電性液晶性樹脂組合物 TWI874733B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-202782 2020-12-07
JP2020202782 2020-12-07

Publications (2)

Publication Number Publication Date
TW202231763A TW202231763A (zh) 2022-08-16
TWI874733B true TWI874733B (zh) 2025-03-01

Family

ID=81973181

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110145222A TWI874733B (zh) 2020-12-07 2021-12-03 導電性液晶性樹脂組合物

Country Status (5)

Country Link
JP (1) JP7373080B2 (https=)
KR (1) KR102748762B1 (https=)
CN (1) CN116601230B (https=)
TW (1) TWI874733B (https=)
WO (1) WO2022124180A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04311758A (ja) * 1991-04-10 1992-11-04 Toray Ind Inc 液晶ポリマ樹脂組成物
TW201434903A (zh) * 2012-12-03 2014-09-16 Polyplastics Co 相機模組用液晶性樹脂組成物及使用其之相機模組
CN109476922A (zh) * 2016-07-11 2019-03-15 宝理塑料株式会社 液晶性树脂组合物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739533B2 (ja) * 1986-12-10 1995-05-01 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
JP2550797Y2 (ja) * 1992-01-18 1997-10-15 太陽誘電株式会社 トンネル型乾燥炉
JP4161494B2 (ja) * 1998-12-11 2008-10-08 東レ株式会社 難燃性樹脂組成物、その長繊維ペレットおよびその成形品
JP4724900B2 (ja) * 1999-07-13 2011-07-13 東レ株式会社 難燃性ポリアミド樹脂組成物およびその成形品
JP2001067933A (ja) * 1999-08-24 2001-03-16 Toray Ind Inc 導電性樹脂組成物およびその成形品
JP2002194194A (ja) * 2000-12-25 2002-07-10 Polyplastics Co 半導電性樹脂組成物及び成形品
US20040113129A1 (en) 2002-07-25 2004-06-17 Waggoner Marion G. Static dissipative thermoplastic polymer composition
JP4302508B2 (ja) 2003-12-26 2009-07-29 ポリプラスチックス株式会社 導電性樹脂組成物
JP6231243B1 (ja) * 2016-09-14 2017-11-15 住友化学株式会社 液晶性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04311758A (ja) * 1991-04-10 1992-11-04 Toray Ind Inc 液晶ポリマ樹脂組成物
TW201434903A (zh) * 2012-12-03 2014-09-16 Polyplastics Co 相機模組用液晶性樹脂組成物及使用其之相機模組
CN109476922A (zh) * 2016-07-11 2019-03-15 宝理塑料株式会社 液晶性树脂组合物

Also Published As

Publication number Publication date
CN116601230B (zh) 2025-04-18
KR20230116010A (ko) 2023-08-03
CN116601230A (zh) 2023-08-15
WO2022124180A1 (ja) 2022-06-16
JPWO2022124180A1 (https=) 2022-06-16
TW202231763A (zh) 2022-08-16
JP7373080B2 (ja) 2023-11-01
KR102748762B1 (ko) 2025-01-03

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