CN116601230B - 导电性液晶性树脂组合物 - Google Patents

导电性液晶性树脂组合物 Download PDF

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Publication number
CN116601230B
CN116601230B CN202180081329.3A CN202180081329A CN116601230B CN 116601230 B CN116601230 B CN 116601230B CN 202180081329 A CN202180081329 A CN 202180081329A CN 116601230 B CN116601230 B CN 116601230B
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CN
China
Prior art keywords
conductive filler
resin composition
liquid crystalline
conductive
crystalline resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180081329.3A
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English (en)
Chinese (zh)
Other versions
CN116601230A (zh
Inventor
中村真奈
望月光博
长永昭宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
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Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN116601230A publication Critical patent/CN116601230A/zh
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Publication of CN116601230B publication Critical patent/CN116601230B/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180081329.3A 2020-12-07 2021-12-02 导电性液晶性树脂组合物 Active CN116601230B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-202782 2020-12-07
JP2020202782 2020-12-07
PCT/JP2021/044205 WO2022124180A1 (ja) 2020-12-07 2021-12-02 導電性液晶性樹脂組成物

Publications (2)

Publication Number Publication Date
CN116601230A CN116601230A (zh) 2023-08-15
CN116601230B true CN116601230B (zh) 2025-04-18

Family

ID=81973181

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180081329.3A Active CN116601230B (zh) 2020-12-07 2021-12-02 导电性液晶性树脂组合物

Country Status (5)

Country Link
JP (1) JP7373080B2 (https=)
KR (1) KR102748762B1 (https=)
CN (1) CN116601230B (https=)
TW (1) TWI874733B (https=)
WO (1) WO2022124180A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04311758A (ja) * 1991-04-10 1992-11-04 Toray Ind Inc 液晶ポリマ樹脂組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739533B2 (ja) * 1986-12-10 1995-05-01 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
JP2550797Y2 (ja) * 1992-01-18 1997-10-15 太陽誘電株式会社 トンネル型乾燥炉
JP4161494B2 (ja) * 1998-12-11 2008-10-08 東レ株式会社 難燃性樹脂組成物、その長繊維ペレットおよびその成形品
JP4724900B2 (ja) * 1999-07-13 2011-07-13 東レ株式会社 難燃性ポリアミド樹脂組成物およびその成形品
JP2001067933A (ja) * 1999-08-24 2001-03-16 Toray Ind Inc 導電性樹脂組成物およびその成形品
JP2002194194A (ja) * 2000-12-25 2002-07-10 Polyplastics Co 半導電性樹脂組成物及び成形品
US20040113129A1 (en) 2002-07-25 2004-06-17 Waggoner Marion G. Static dissipative thermoplastic polymer composition
JP4302508B2 (ja) 2003-12-26 2009-07-29 ポリプラスチックス株式会社 導電性樹脂組成物
WO2014087842A1 (ja) * 2012-12-03 2014-06-12 ポリプラスチックス株式会社 カメラモジュール用液晶性樹脂組成物及びそれを用いたカメラモジュール
WO2018012371A1 (ja) * 2016-07-11 2018-01-18 ポリプラスチックス株式会社 液晶性樹脂組成物
JP6231243B1 (ja) * 2016-09-14 2017-11-15 住友化学株式会社 液晶性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04311758A (ja) * 1991-04-10 1992-11-04 Toray Ind Inc 液晶ポリマ樹脂組成物

Also Published As

Publication number Publication date
KR20230116010A (ko) 2023-08-03
CN116601230A (zh) 2023-08-15
WO2022124180A1 (ja) 2022-06-16
JPWO2022124180A1 (https=) 2022-06-16
TW202231763A (zh) 2022-08-16
TWI874733B (zh) 2025-03-01
JP7373080B2 (ja) 2023-11-01
KR102748762B1 (ko) 2025-01-03

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