JP7372836B2 - 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法 - Google Patents
樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法 Download PDFInfo
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- JP7372836B2 JP7372836B2 JP2019550012A JP2019550012A JP7372836B2 JP 7372836 B2 JP7372836 B2 JP 7372836B2 JP 2019550012 A JP2019550012 A JP 2019550012A JP 2019550012 A JP2019550012 A JP 2019550012A JP 7372836 B2 JP7372836 B2 JP 7372836B2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
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Description
本実施形態に係る樹脂組成物は、注型用の樹脂組成物である。本実施形態に係る樹脂組成物を注型することにより成形体を得ることができる。本実施形態に係る硬化物は、本実施形態に係る樹脂組成物の硬化物であり、硬化性の樹脂組成物を硬化させることにより得ることができる。本実施形態に係る樹脂組成物及びその硬化物は、例えば、黒色を呈している。本実施形態に係る硬化物は、素子を封止する封止部として用いることができる。封止部によって素子を封止することにより、水分等によって素子が劣化することを抑制することができる。
硬化性成分は、例えば、硬化性樹脂及び硬化剤を含むことができる。硬化剤を用いることなく硬化性樹脂が硬化可能である場合には、硬化剤を用いなくてもよい。
本実施形態に係る樹脂組成物は、少なくとも2種のフィラー(硬化性成分に該当する化合物を除く)として、前記特定のアスペクト比(第1のフィラーの長径/第1のフィラーの厚さ)を有する第1のフィラーと、第1のフィラーとは異なる第2のフィラーと、を含有する。
本実施形態に係る樹脂組成物は、硬化性成分及びフィラーとは異なる添加剤を含有することができる。添加剤としては、消泡剤、難燃剤、カップリング剤、反応希釈剤、可撓性付与剤、顔料、着色剤、溶剤等が挙げられる。
B型粘度計を用いて40℃、60rpmの条件で測定した場合の樹脂組成物の粘度は、樹脂組成物を注型する際に樹脂組成物の充填作業性に更に優れる観点から、8.0Pa・s以下が好ましく、7.0Pa・s以下がより好ましく、5.0Pa・s以下が更に好ましく、3.0Pa・s以下が特に好ましく、2.0Pa・s以下が極めて好ましい。前記粘度は、例えば、1.0Pa・s以上であってもよい。
本実施形態に係る成形体は、素子と、素子を封止する封止部と、を備え、封止部が本実施形態に係る樹脂組成物又はその硬化物を含む。成形体としては、例えば、コンデンサ(フィルムコンデンサ等)、チップインダクタ、リアクトル、トランス、モールドコイル、LSIチップ、ICチップ、センサー(タイヤ空気圧センサー等)、エンジンコントロールユニット(ECU)などの電子部品が挙げられる。
本実施形態に係る成形体の製造方法においては、本実施形態に係る樹脂組成物を注型して成形体を得る。本実施形態に係る成形体の製造方法は、例えば、硬化性の封止材として、本実施形態に係る樹脂組成物を型部材(鋳型、枠体)に供給する樹脂供給工程と、樹脂組成物を硬化し成形体を得る硬化工程と、をこの順に備えている。成形方法としては、真空注型、インサート成形、射出成形、押出成形、トランスファ成形等が挙げられる。
表1~3に示す下記成分を混合することにより樹脂組成物を調製した。
ビスフェノールA型エポキシ樹脂、三井化学株式会社製、商品名:エポミックR-139S
ビスフェノールA型エポキシ樹脂、三菱ケミカル株式会社製、商品名:JER834
酸無水物、3or4-メチル-1,2,3,6-テトラヒドロ無水フタル酸、日立化成株式会社製、商品名:HN-2000
塩化ベンザルコニウム、日本油脂株式会社製、商品名:M2-100R
膨張黒鉛、株式会社鈴裕化学製、商品名:GREP-EG、平均アスペクト比:9.5、平均長径:600μm
膨張黒鉛、富士黒鉛工業株式会社製、商品名:EXP-100S、平均アスペクト比:10.5、平均長径:200μm
メラミンシアヌレート、日産化学工業株式会社製、商品名:MC-4000、平均アスペクト比:5、平均長径:14μm
メラミンシアヌレート、日産化学工業株式会社製、商品名:MC-6000、平均アスペクト比:5、平均長径:2μm
カーボンブラック、着色剤、三菱ケミカル株式会社製、商品名:MA-100
結晶シリカ、フミテック株式会社製、商品名:HC-15、平均粒径:12.8μm
結晶シリカ、シベルコ・ジャパン株式会社製、商品名:CA0040、平均粒径:3.65μm
水酸化アルミニウム、日本軽金属株式会社製、商品名:AL-B143、平均粒径:5μm
消泡剤、シリコーン系消泡剤、信越化学工業株式会社製、商品名:KS-603
カップリング剤、エポキシ基含有シランカップリング剤、ダウコーニング社製、商品名:OFS-6040
可塑剤、エポキシ系可塑剤、ジャパンケムテック株式会社製、商品名:カージュラE10P
難燃剤、芳香族環状ホスファゼン系難燃剤、大塚化学株式会社製、商品名:SPB-100
難燃剤、芳香族環状ホスファゼン系難燃剤、株式会社伏見製薬所製、商品名:ラビトルFP-110
界面活性剤、ポリエーテルエステル型界面活性剤、楠本化成株式会社製、商品名:ディスパロン3600N
前記樹脂組成物を用いて下記の物性測定を行った。物性測定は、上述の硬化剤と他成分とを混合した後、速やかに行った。物性測定の結果を表1~3に示す。
B型回転粘度計(TOKIMEC社製、商品名:BL)を用いて、温度40℃、回転数60rpm(60回転)の条件における前記樹脂組成物の粘度を測定した。温度は、恒温槽(ヤマト科学株式会社製、商品名:BF600)を用いて調整した。
前記樹脂組成物を内径18mm、長さ15cmのポリプロピレン製の試験管に注入した後、前記樹脂組成物を105℃で8時間熱硬化させて硬化物を得た。試験管から硬化物を取り出した後、前記硬化物の上部10%及び下部10%を切断して上部試験片及び下部試験片を得た。電子比重計(ミラージュ貿易株式会社製、商品名:SD200L)を用いて、試験片の比重を水中置換法にてそれぞれ測定した。フィラーの沈降性の指標として、下記式により比重差の割合を算出した。
比重差の割合(%)=(下部試験片の比重-上部試験片の比重)/(下部試験片の比重)×100
前記樹脂組成物を105℃で8時間熱硬化させて硬化物を得た後、縦125mm×横13.0mm、厚さ5mmの直方体形状に硬化物を加工して試験片を得た。前記試験片を用いて、UL94Vの試験方法に従い難燃性を評価した。UL94Vの判定基準に従い、上部接炎及び下部接炎について「V-0」、「V-1」、「V-2」、「V-NOT」(分類不可)の4段階で判定した。「V-0」が最も難燃性が高く、「V-1」、「V-2」及び「V-NOT」の順に難燃性が低下する。
Claims (10)
- 硬化性成分と、第1のフィラーと、前記第1のフィラーとは異なる第2のフィラーと、を含有する樹脂組成物であって、
前記硬化性成分が硬化性樹脂を含み、
前記硬化性樹脂がエポキシ樹脂を含み、
前記第1のフィラーが、膨張黒鉛及びメラミンシアヌレートからなる群より選ばれる少なくとも一種を含み、
前記第1のフィラーの厚さに対する前記第1のフィラーの長径の比率が3~25であり、
前記第1のフィラーの比重が前記第2のフィラーの比重よりも小さく、
前記第1のフィラーの含有量が、当該樹脂組成物の全質量(溶剤の質量を除く)を基準として1.5~4.7質量%である、注型用の樹脂組成物(但し、エポキシ樹脂、フェノール樹脂、硬化促進剤、無機充填材、平均粒径50μm以下、最大粒径200μm以下の熱膨張性黒鉛、及び、下記一般式(1)で示される化合物を必須成分とすることを特徴とする半導体封止用エポキシ樹脂組成物、並びに、エポキシ樹脂、硬化剤、金属水酸化物及び膨張性黒鉛を含み、前記エポキシ樹脂及び前記硬化剤のうち少なくとも一方が、フェノール類(A)から誘導される構成単位と、当該フェノール類(A)を除く芳香族類(B)から誘導される構成単位と、を分子中に有する化合物を含むことを特徴とする難燃性エポキシ樹脂組成物を除く)。
Bi6O6(OH)x(NO2)6-x・nH2O (1)
(3.5<x<5.5、nは0又は正の数) - B型粘度計を用いて40℃、60rpmの条件で測定した場合の粘度が8.0Pa・s以下である、請求項1に記載の樹脂組成物。
- 前記硬化性樹脂の含有量が、当該樹脂組成物の全質量(溶剤の質量を除く)を基準として18質量%以上である、請求項1又は2に記載の樹脂組成物。
- 前記第1のフィラーの含有量が、前記第1のフィラー及び前記第2のフィラーの総量を基準として9質量%以下である、請求項1~3のいずれか一項に記載の樹脂組成物。
- 前記第2のフィラーが、シリカと、カーボンブラック及び水酸化アルミニウムからなる群より選ばれる少なくとも一種と、を含む、請求項1~4のいずれか一項に記載の樹脂組成物。
- 請求項1~5のいずれか一項に記載の樹脂組成物の硬化物。
- 素子と、前記素子を封止する封止部と、を備え、
前記封止部が、請求項1~5のいずれか一項に記載の樹脂組成物又はその硬化物を含む、成形体。 - 請求項1~5のいずれか一項に記載の樹脂組成物を注型して成形体を得る、成形体の製造方法。
- フィルムコンデンサ素子と、前記フィルムコンデンサ素子を封止する封止部と、を備え、
前記封止部が、請求項1~5のいずれか一項に記載の樹脂組成物又はその硬化物を含む、フィルムコンデンサ。 - 請求項1~5のいずれか一項に記載の樹脂組成物を注型して、フィルムコンデンサ素子を封止する封止部を備えたフィルムコンデンサを得る、フィルムコンデンサの製造方法。
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JP2023091646A Withdrawn JP2023107833A (ja) | 2017-10-30 | 2023-06-02 | 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法 |
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US (1) | US11339284B2 (ja) |
JP (3) | JP7372836B2 (ja) |
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JP2001114990A (ja) | 1999-10-21 | 2001-04-24 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2003147052A (ja) | 2001-11-12 | 2003-05-21 | Nec Corp | 難燃性エポキシ樹脂組成物 |
JP2004283732A (ja) | 2003-03-24 | 2004-10-14 | Inoac Corp | 液体と粉体の混合方法及び混合装置 |
JP2012214777A (ja) | 2011-03-31 | 2012-11-08 | Momentive Performance Materials Inc | 電子部品封止用難燃性ポリオルガノシロキサン組成物 |
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JPH07161578A (ja) | 1993-12-06 | 1995-06-23 | Rubikon Denshi Kk | フィルムコンデンサの製造方法 |
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KR101715207B1 (ko) * | 2013-03-06 | 2017-03-10 | 디아이씨 가부시끼가이샤 | 에폭시 수지 조성물, 경화물, 방열 재료 및 전자 부재 |
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WO2019087258A1 (ja) * | 2017-10-30 | 2019-05-09 | 日立化成株式会社 | 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法 |
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- 2017-10-30 JP JP2019550012A patent/JP7372836B2/ja active Active
- 2017-10-30 US US16/759,601 patent/US11339284B2/en active Active
- 2017-10-30 CN CN201780098090.4A patent/CN111527143B/zh active Active
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JP2001114990A (ja) | 1999-10-21 | 2001-04-24 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2003147052A (ja) | 2001-11-12 | 2003-05-21 | Nec Corp | 難燃性エポキシ樹脂組成物 |
JP2004283732A (ja) | 2003-03-24 | 2004-10-14 | Inoac Corp | 液体と粉体の混合方法及び混合装置 |
JP2012214777A (ja) | 2011-03-31 | 2012-11-08 | Momentive Performance Materials Inc | 電子部品封止用難燃性ポリオルガノシロキサン組成物 |
JP2012234932A (ja) | 2011-04-28 | 2012-11-29 | Kyocera Chemical Corp | フィルムコンデンサの製造方法及びフィルムコンデンサ |
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JPWO2019087259A1 (ja) | 2020-11-12 |
US11339284B2 (en) | 2022-05-24 |
CN111527143A (zh) | 2020-08-11 |
WO2019087259A1 (ja) | 2019-05-09 |
US20200347221A1 (en) | 2020-11-05 |
JP2023107833A (ja) | 2023-08-03 |
CN111527143B (zh) | 2023-06-23 |
JP2022001652A (ja) | 2022-01-06 |
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