JP7352830B2 - 回路構成体 - Google Patents

回路構成体 Download PDF

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Publication number
JP7352830B2
JP7352830B2 JP2019219846A JP2019219846A JP7352830B2 JP 7352830 B2 JP7352830 B2 JP 7352830B2 JP 2019219846 A JP2019219846 A JP 2019219846A JP 2019219846 A JP2019219846 A JP 2019219846A JP 7352830 B2 JP7352830 B2 JP 7352830B2
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JP
Japan
Prior art keywords
component
refrigerant
cooling
cooling component
relay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019219846A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021089984A5 (enExample
JP2021089984A (ja
Inventor
勇貴 藤村
仁司 竹田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2019219846A priority Critical patent/JP7352830B2/ja
Priority to PCT/JP2020/044063 priority patent/WO2021111984A1/ja
Priority to CN202080082065.9A priority patent/CN114762204B/zh
Priority to US17/779,074 priority patent/US20220400580A1/en
Publication of JP2021089984A publication Critical patent/JP2021089984A/ja
Publication of JP2021089984A5 publication Critical patent/JP2021089984A5/ja
Application granted granted Critical
Publication of JP7352830B2 publication Critical patent/JP7352830B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/03—Cooling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
JP2019219846A 2019-12-04 2019-12-04 回路構成体 Active JP7352830B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019219846A JP7352830B2 (ja) 2019-12-04 2019-12-04 回路構成体
PCT/JP2020/044063 WO2021111984A1 (ja) 2019-12-04 2020-11-26 回路構成体
CN202080082065.9A CN114762204B (zh) 2019-12-04 2020-11-26 电路结构体
US17/779,074 US20220400580A1 (en) 2019-12-04 2020-11-26 Circuit assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019219846A JP7352830B2 (ja) 2019-12-04 2019-12-04 回路構成体

Publications (3)

Publication Number Publication Date
JP2021089984A JP2021089984A (ja) 2021-06-10
JP2021089984A5 JP2021089984A5 (enExample) 2022-03-29
JP7352830B2 true JP7352830B2 (ja) 2023-09-29

Family

ID=76220458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019219846A Active JP7352830B2 (ja) 2019-12-04 2019-12-04 回路構成体

Country Status (4)

Country Link
US (1) US20220400580A1 (enExample)
JP (1) JP7352830B2 (enExample)
CN (1) CN114762204B (enExample)
WO (1) WO2021111984A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12402272B2 (en) * 2021-01-12 2025-08-26 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
US12238905B2 (en) * 2022-12-16 2025-02-25 Bae Systems Controls Inc. Cooling systems and methods for cooling contactors

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019122064A (ja) 2017-12-28 2019-07-22 株式会社デンソー 電力変換装置
WO2019189450A1 (ja) 2018-03-30 2019-10-03 日本電産株式会社 電力変換装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157449A (ja) * 1986-12-22 1988-06-30 Nec Corp 集積回路の冷却構造
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5168425A (en) * 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
JP2000058746A (ja) * 1998-08-10 2000-02-25 Toyota Motor Corp モジュール内冷却装置
US20020117291A1 (en) * 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
JP5714077B2 (ja) * 2013-10-25 2015-05-07 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
KR101653453B1 (ko) * 2014-11-03 2016-09-09 현대모비스 주식회사 전력반도체 양면 냉각방식 냉각장치
JP6521171B2 (ja) * 2016-03-10 2019-05-29 株式会社オートネットワーク技術研究所 回路構成体
JP2018018661A (ja) * 2016-07-27 2018-02-01 株式会社オートネットワーク技術研究所 冷却機能付き導電部材
JP6693480B2 (ja) * 2017-06-22 2020-05-13 株式会社デンソー 端子冷却装置
KR102411445B1 (ko) * 2017-07-20 2022-06-22 주식회사 아모그린텍 파워 릴레이 어셈블리
US10900412B2 (en) * 2018-05-31 2021-01-26 Borg Warner Inc. Electronics assembly having a heat sink and an electrical insulator directly bonded to the heat sink
US10920782B2 (en) * 2019-01-30 2021-02-16 Asia Vital Components (China) Co., Ltd. Low-profile, high-power pump for electronics fluid cooling system
JP6750809B1 (ja) * 2019-04-22 2020-09-02 三菱電機株式会社 冷却器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019122064A (ja) 2017-12-28 2019-07-22 株式会社デンソー 電力変換装置
WO2019189450A1 (ja) 2018-03-30 2019-10-03 日本電産株式会社 電力変換装置

Also Published As

Publication number Publication date
US20220400580A1 (en) 2022-12-15
CN114762204A (zh) 2022-07-15
WO2021111984A1 (ja) 2021-06-10
JP2021089984A (ja) 2021-06-10
CN114762204B (zh) 2024-05-03

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