JP2021089984A5 - - Google Patents

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Publication number
JP2021089984A5
JP2021089984A5 JP2019219846A JP2019219846A JP2021089984A5 JP 2021089984 A5 JP2021089984 A5 JP 2021089984A5 JP 2019219846 A JP2019219846 A JP 2019219846A JP 2019219846 A JP2019219846 A JP 2019219846A JP 2021089984 A5 JP2021089984 A5 JP 2021089984A5
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JP
Japan
Prior art keywords
refrigerant
cooling
cooling component
bus bars
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2019219846A
Other languages
English (en)
Japanese (ja)
Other versions
JP7352830B2 (ja
JP2021089984A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2019219846A priority Critical patent/JP7352830B2/ja
Priority claimed from JP2019219846A external-priority patent/JP7352830B2/ja
Priority to PCT/JP2020/044063 priority patent/WO2021111984A1/ja
Priority to CN202080082065.9A priority patent/CN114762204B/zh
Priority to US17/779,074 priority patent/US20220400580A1/en
Publication of JP2021089984A publication Critical patent/JP2021089984A/ja
Publication of JP2021089984A5 publication Critical patent/JP2021089984A5/ja
Application granted granted Critical
Publication of JP7352830B2 publication Critical patent/JP7352830B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019219846A 2019-12-04 2019-12-04 回路構成体 Active JP7352830B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019219846A JP7352830B2 (ja) 2019-12-04 2019-12-04 回路構成体
PCT/JP2020/044063 WO2021111984A1 (ja) 2019-12-04 2020-11-26 回路構成体
CN202080082065.9A CN114762204B (zh) 2019-12-04 2020-11-26 电路结构体
US17/779,074 US20220400580A1 (en) 2019-12-04 2020-11-26 Circuit assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019219846A JP7352830B2 (ja) 2019-12-04 2019-12-04 回路構成体

Publications (3)

Publication Number Publication Date
JP2021089984A JP2021089984A (ja) 2021-06-10
JP2021089984A5 true JP2021089984A5 (enExample) 2022-03-29
JP7352830B2 JP7352830B2 (ja) 2023-09-29

Family

ID=76220458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019219846A Active JP7352830B2 (ja) 2019-12-04 2019-12-04 回路構成体

Country Status (4)

Country Link
US (1) US20220400580A1 (enExample)
JP (1) JP7352830B2 (enExample)
CN (1) CN114762204B (enExample)
WO (1) WO2021111984A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12402272B2 (en) * 2021-01-12 2025-08-26 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
US12238905B2 (en) * 2022-12-16 2025-02-25 Bae Systems Controls Inc. Cooling systems and methods for cooling contactors

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157449A (ja) * 1986-12-22 1988-06-30 Nec Corp 集積回路の冷却構造
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5168425A (en) * 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
JP2000058746A (ja) * 1998-08-10 2000-02-25 Toyota Motor Corp モジュール内冷却装置
US20020117291A1 (en) * 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
JP5714077B2 (ja) * 2013-10-25 2015-05-07 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
KR101653453B1 (ko) * 2014-11-03 2016-09-09 현대모비스 주식회사 전력반도체 양면 냉각방식 냉각장치
JP6521171B2 (ja) * 2016-03-10 2019-05-29 株式会社オートネットワーク技術研究所 回路構成体
JP2018018661A (ja) * 2016-07-27 2018-02-01 株式会社オートネットワーク技術研究所 冷却機能付き導電部材
JP6693480B2 (ja) * 2017-06-22 2020-05-13 株式会社デンソー 端子冷却装置
KR102411445B1 (ko) * 2017-07-20 2022-06-22 주식회사 아모그린텍 파워 릴레이 어셈블리
JP7139603B2 (ja) * 2017-12-28 2022-09-21 株式会社デンソー 電力変換装置
CN111937289A (zh) * 2018-03-30 2020-11-13 日本电产株式会社 电力转换装置
US10900412B2 (en) * 2018-05-31 2021-01-26 Borg Warner Inc. Electronics assembly having a heat sink and an electrical insulator directly bonded to the heat sink
US10920782B2 (en) * 2019-01-30 2021-02-16 Asia Vital Components (China) Co., Ltd. Low-profile, high-power pump for electronics fluid cooling system
JP6750809B1 (ja) * 2019-04-22 2020-09-02 三菱電機株式会社 冷却器

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