CN114762204B - 电路结构体 - Google Patents

电路结构体 Download PDF

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Publication number
CN114762204B
CN114762204B CN202080082065.9A CN202080082065A CN114762204B CN 114762204 B CN114762204 B CN 114762204B CN 202080082065 A CN202080082065 A CN 202080082065A CN 114762204 B CN114762204 B CN 114762204B
Authority
CN
China
Prior art keywords
circuit structure
relay
refrigerant
cooling member
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080082065.9A
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English (en)
Chinese (zh)
Other versions
CN114762204A (zh
Inventor
藤村勇贵
竹田仁司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of CN114762204A publication Critical patent/CN114762204A/zh
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Publication of CN114762204B publication Critical patent/CN114762204B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/03—Cooling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
CN202080082065.9A 2019-12-04 2020-11-26 电路结构体 Active CN114762204B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-219846 2019-12-04
JP2019219846A JP7352830B2 (ja) 2019-12-04 2019-12-04 回路構成体
PCT/JP2020/044063 WO2021111984A1 (ja) 2019-12-04 2020-11-26 回路構成体

Publications (2)

Publication Number Publication Date
CN114762204A CN114762204A (zh) 2022-07-15
CN114762204B true CN114762204B (zh) 2024-05-03

Family

ID=76220458

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080082065.9A Active CN114762204B (zh) 2019-12-04 2020-11-26 电路结构体

Country Status (4)

Country Link
US (1) US20220400580A1 (enExample)
JP (1) JP7352830B2 (enExample)
CN (1) CN114762204B (enExample)
WO (1) WO2021111984A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12402272B2 (en) * 2021-01-12 2025-08-26 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
US12238905B2 (en) * 2022-12-16 2025-02-25 Bae Systems Controls Inc. Cooling systems and methods for cooling contactors

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058746A (ja) * 1998-08-10 2000-02-25 Toyota Motor Corp モジュール内冷却装置
JP2015084609A (ja) * 2013-10-25 2015-04-30 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
CN106158791A (zh) * 2014-11-03 2016-11-23 现代摩比斯株式会社 电力半导体双面冷却方式冷却装置
WO2018021084A1 (ja) * 2016-07-27 2018-02-01 株式会社オートネットワーク技術研究所 冷却機能付き導電部材
CN108702856A (zh) * 2016-03-10 2018-10-23 株式会社自动网络技术研究所 电路构成体
WO2018235473A1 (ja) * 2017-06-22 2018-12-27 株式会社デンソー 端子冷却装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157449A (ja) * 1986-12-22 1988-06-30 Nec Corp 集積回路の冷却構造
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5168425A (en) * 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
US20020117291A1 (en) * 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
KR102411445B1 (ko) * 2017-07-20 2022-06-22 주식회사 아모그린텍 파워 릴레이 어셈블리
JP7139603B2 (ja) * 2017-12-28 2022-09-21 株式会社デンソー 電力変換装置
CN111937289A (zh) * 2018-03-30 2020-11-13 日本电产株式会社 电力转换装置
US10900412B2 (en) * 2018-05-31 2021-01-26 Borg Warner Inc. Electronics assembly having a heat sink and an electrical insulator directly bonded to the heat sink
US10920782B2 (en) * 2019-01-30 2021-02-16 Asia Vital Components (China) Co., Ltd. Low-profile, high-power pump for electronics fluid cooling system
JP6750809B1 (ja) * 2019-04-22 2020-09-02 三菱電機株式会社 冷却器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058746A (ja) * 1998-08-10 2000-02-25 Toyota Motor Corp モジュール内冷却装置
JP2015084609A (ja) * 2013-10-25 2015-04-30 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
CN106158791A (zh) * 2014-11-03 2016-11-23 现代摩比斯株式会社 电力半导体双面冷却方式冷却装置
CN108702856A (zh) * 2016-03-10 2018-10-23 株式会社自动网络技术研究所 电路构成体
WO2018021084A1 (ja) * 2016-07-27 2018-02-01 株式会社オートネットワーク技術研究所 冷却機能付き導電部材
WO2018235473A1 (ja) * 2017-06-22 2018-12-27 株式会社デンソー 端子冷却装置

Also Published As

Publication number Publication date
US20220400580A1 (en) 2022-12-15
CN114762204A (zh) 2022-07-15
WO2021111984A1 (ja) 2021-06-10
JP7352830B2 (ja) 2023-09-29
JP2021089984A (ja) 2021-06-10

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