JP7351016B2 - ラミネータ - Google Patents
ラミネータ Download PDFInfo
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- JP7351016B2 JP7351016B2 JP2022543742A JP2022543742A JP7351016B2 JP 7351016 B2 JP7351016 B2 JP 7351016B2 JP 2022543742 A JP2022543742 A JP 2022543742A JP 2022543742 A JP2022543742 A JP 2022543742A JP 7351016 B2 JP7351016 B2 JP 7351016B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
- B32B37/206—Laminating a continuous layer between two continuous plastic layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
- B65H23/1888—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web and controlling web tension
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/516—Securing handled material to another material
- B65H2301/5161—Binding processes
- B65H2301/51614—Binding processes involving heating element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2402/00—Constructional details of the handling apparatus
- B65H2402/30—Supports; Subassemblies; Mountings thereof
- B65H2402/32—Sliding support means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/10—Rollers
- B65H2404/15—Roller assembly, particular roller arrangement
- B65H2404/152—Arrangement of roller on a movable frame
- B65H2404/1522—Arrangement of roller on a movable frame moving linearly in feeding direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/10—Size; Dimensions
- B65H2511/11—Length
- B65H2511/112—Length of a loop, e.g. a free loop or a loop of dancer rollers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2555/00—Actuating means
- B65H2555/40—Powering means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
また、上述のラミネータは、前記フィルム除去部が前記基板に貼り合わせられた前記フィルムを除去した後、前記基板に形成された前記金属パターン及びこれを保護するカバーレイが不良であるか否かを判断するためのフィルム除去映像撮影部をさらに含むことができる。
また、位置可変支持装置550は、支持ボディ555の水平を維持するエアーバランサ558をさらに含むことができる。
Claims (17)
- 一定の単位領域毎に金属パターンが形成された基板を供給する基板供給部;
一定の大きさに打ち抜かれた複数のカバーレイが貼着されたフィルムを供給するカバーレイ供給部;
前記金属パターンを前記複数のカバーレイがそれぞれ保護するように前記基板と前記フィルムとを貼り合わせる熱ローラ部;
前記熱ローラ部に移送される前記基板の張力を調節する基板張力調節部;
前記熱ローラ部に移送される前記フィルムの張力を調節するフィルム張力調節部;
前記基板と前記フィルムとを前記熱ローラ部で貼り合わせた後、前記複数のカバーレイ同士の間隔を測定する接合状態映像撮影部;及び、
前記接合状態映像撮影部で測定した前記複数のカバーレイ同士の間隔が、予め設定された許容間隔を維持するように、前記基板張力調節部が調節する前記基板の張力及び前記フィルム張力調節部が調節する前記フィルムの張力のうちの一つ以上の張力を調整する調整部;
を含む、ラミネータ。 - 前記基板張力調節部及び前記フィルム張力調節部は、それぞれ、
一対の張力調節用固定ローラ;
一対の張力調節用可変ローラ;及び、
前記一対の張力調節用可変ローラの位置を移動させて前記一対の張力調節用固定ローラと前記一対の張力調節用可変ローラとの間の距離を調節する張力調節用シリンダ;
を含むことを特徴とする、請求項1に記載のラミネータ。 - 前記張力調節用シリンダは、空圧又は油圧で動作し、
前記調整部は、前記張力調節用シリンダに供給される空圧又は油圧を調整することを特徴とする、請求項2に記載のラミネータ。 - 前記金属パターンは、前記基板の両面にそれぞれ形成され、
前記カバーレイ供給部は、
前記基板の一面に貼り合わせるフィルムを供給する第1のカバーレイ供給部;及び、
前記基板の他面に貼り合わせるフィルムを供給する第2のカバーレイ供給部;
を含むことを特徴とする、請求項1に記載のラミネータ。 - 前記フィルム張力調節部は、
前記第1のカバーレイ供給部が供給するフィルムの張力を調節する第1のフィルム張力調節部;及び、
前記第2のカバーレイ供給部が供給するフィルムの張力を調節する第2のフィルム張力調節部;
を含むことを特徴とする、請求項4に記載のラミネータ。 - 前記基板供給部は、
前記基板が巻き取られた基板巻き取り機;及び、
前記基板巻き取り機に巻き取られた前記基板を前記熱ローラ部に移送させる基板供給機;
を含み、
前記カバーレイ供給部は、
前記フィルムが巻き取られたフィルム巻き取り機;及び、
前記フィルム巻き取り機に巻き取られた前記フィルムを前記熱ローラ部に移送させるフィルム供給機;
を含むことを特徴とする、請求項1に記載のラミネータ。 - 前記熱ローラ部は、
前記基板の両面にそれぞれ対向する一対の第1の熱ローラ;及び、
前記基板の両面にそれぞれ対向しかつ前記一対の第1の熱ローラより後方に位置し、前記一対の第1の熱ローラが一次加熱した前記基板及び前記フィルムを二次加熱する一対の第2の熱ローラ;
を含むことを特徴とする、請求項1に記載のラミネータ。 - 前記接合状態映像撮影部は、
前記一対の第1の熱ローラで貼り合わせた前記基板と前記フィルムとにおいて、前記複数のカバーレイ同士の間隔を測定する第1の接合状態映像撮影部;及び、
前記一対の第2の熱ローラで貼り合わせた前記基板と前記フィルムとにおいて、前記複数のカバーレイ同士の間隔を測定する第2の接合状態映像撮影部;
を含むことを特徴とする、請求項7に記載のラミネータ。 - 前記熱ローラ部は、
前記基板の両面にそれぞれ対向する一対の熱ローラ;及び、
前記一対の熱ローラのうちのいずれか1つの位置を移動させて前記一対の熱ローラ同士の間隔を調節する位置可変支持装置;
を含むことを特徴とする、請求項1に記載のラミネータ。 - 前記位置可変支持装置は、
ボールねじ軸;
前記ボールねじ軸に螺合されて前記一対の熱ローラのうちのいずれか1つを支持する支持ボディ;及び、
前記ボールねじ軸を回転させて前記支持ボディの位置を移動させるサーボモータ;
を含むことを特徴とする、請求項9に記載のラミネータ。 - 前記位置可変支持装置は、前記支持ボディに加えられる荷重を測定するロードセルをさらに含み、
前記サーボモータは、前記ロードセルで測定される荷重が、予め設定された荷重の範囲内に維持されるように、前記支持ボディの位置を移動させることを特徴とする、請求項10に記載のラミネータ。 - 前記位置可変支持装置は、前記支持ボディの水平を維持するエアーバランサをさらに含むことを特徴とする、請求項10に記載のラミネータ。
- 前記基板張力調節部と前記熱ローラ部との間に設けられ、前記熱ローラ部に移送される前記基板の端縁の位置を調節する基板エッジポジションコントローラ;及び、
前記フィルム張力調節部と前記熱ローラ部との間に設けられ、前記熱ローラ部に移送される前記フィルムの端縁の位置を調節するフィルムエッジポジションコントローラ;
をさらに含むことを特徴とする、請求項1に記載のラミネータ。 - 前記基板エッジポジションコントローラを通過した前記基板の端縁と、前記フィルムエッジポジションコントローラを通過した前記フィルムの端縁とを、それぞれ撮影するエッジ映像撮影部をさらに含むことを特徴とする、請求項13に記載のラミネータ。
- 前記エッジ映像撮影部が撮影した前記基板の端縁の位置又は前記フィルムの端縁の位置が、予め設定された許容位置から外れると、前記基板エッジポジションコントローラ又は前記フィルムエッジポジションコントローラが、前記基板の端縁の位置又は前記フィルムの端縁の位置を調節することを特徴とする、請求項14に記載のラミネータ。
- 前記熱ローラ部が、前記基板に形成された前記金属パターンを前記複数のカバーレイがそれぞれ保護するように前記基板と前記フィルムとを貼り合わせた後、前記複数のカバーレイがそれぞれ前記基板に貼り合わせられた状態で前記フィルムを前記基板から除去するフィルム除去部をさらに含むことを特徴とする、請求項1に記載のラミネータ。
- 前記フィルム除去部が、前記基板に貼り合わせられた前記フィルムを除去した後、前記基板に形成された前記金属パターン及びこれを保護するカバーレイが不良であるか否かを判断するためのフィルム除去映像撮影部をさらに含むことを特徴とする、請求項16記載のラミネータ。
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