JP7304492B2 - フレキシブルプリント配線板及びその製造方法 - Google Patents

フレキシブルプリント配線板及びその製造方法 Download PDF

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Publication number
JP7304492B2
JP7304492B2 JP2022535005A JP2022535005A JP7304492B2 JP 7304492 B2 JP7304492 B2 JP 7304492B2 JP 2022535005 A JP2022535005 A JP 2022535005A JP 2022535005 A JP2022535005 A JP 2022535005A JP 7304492 B2 JP7304492 B2 JP 7304492B2
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JP
Japan
Prior art keywords
wiring
plating layer
flexible printed
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022535005A
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English (en)
Japanese (ja)
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JPWO2022009675A1 (https=
JPWO2022009675A5 (https=
Inventor
茉紀 池邉
耕司 新田
将一郎 酒井
真悟 永田
隼一 本村
雅広 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of JPWO2022009675A1 publication Critical patent/JPWO2022009675A1/ja
Publication of JPWO2022009675A5 publication Critical patent/JPWO2022009675A5/ja
Application granted granted Critical
Publication of JP7304492B2 publication Critical patent/JP7304492B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Structure Of Printed Boards (AREA)
JP2022535005A 2020-07-08 2021-06-23 フレキシブルプリント配線板及びその製造方法 Active JP7304492B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020117888 2020-07-08
JP2020117888 2020-07-08
PCT/JP2021/023701 WO2022009675A1 (ja) 2020-07-08 2021-06-23 フレキシブルプリント配線板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2022009675A1 JPWO2022009675A1 (https=) 2022-01-13
JPWO2022009675A5 JPWO2022009675A5 (https=) 2022-11-14
JP7304492B2 true JP7304492B2 (ja) 2023-07-06

Family

ID=79552950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022535005A Active JP7304492B2 (ja) 2020-07-08 2021-06-23 フレキシブルプリント配線板及びその製造方法

Country Status (4)

Country Link
US (1) US12267952B2 (https=)
JP (1) JP7304492B2 (https=)
CN (1) CN115024025A (https=)
WO (1) WO2022009675A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12016130B2 (en) * 2021-05-26 2024-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
CN119450910A (zh) * 2023-07-28 2025-02-14 鹏鼎控股(深圳)股份有限公司 高频传输电路板及其制作方法
JP7680647B1 (ja) * 2024-10-22 2025-05-20 住友電気工業株式会社 プリント配線板
JP7713613B1 (ja) * 2024-10-22 2025-07-25 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192523A (ja) 2013-03-26 2014-10-06 Samsung Electro-Mechanics Co Ltd パワーインダクタおよびその製造方法
JP2016219559A (ja) 2015-05-19 2016-12-22 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP2019186518A (ja) 2018-04-06 2019-10-24 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル部品及びその製造方法
JP2019197851A (ja) 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4426900B2 (ja) 2004-05-10 2010-03-03 三井金属鉱業株式会社 プリント配線基板、その製造方法および半導体装置
JP4665531B2 (ja) * 2005-01-27 2011-04-06 日立電線株式会社 配線板の製造方法
WO2012101985A1 (ja) * 2011-01-26 2012-08-02 住友ベークライト株式会社 プリント配線板およびプリント配線板の製造方法
TWI610206B (zh) * 2015-06-22 2018-01-01 Fujikura Ltd 配線體、配線基板及觸控感測器
CN107924253B (zh) 2015-08-26 2022-07-01 住友金属矿山股份有限公司 导电性基板
JP6722291B2 (ja) * 2016-09-23 2020-07-15 富士フイルム株式会社 導電性フィルム、タッチパネル、フォトマスク、インプリントテンプレート、導電性フィルム形成用積層体、導電性フィルムの製造方法、および電子デバイスの製造方法
CN110612783B (zh) 2017-05-16 2022-11-01 住友电工印刷电路株式会社 印刷配线板及其制造方法
KR102698875B1 (ko) 2018-12-13 2024-08-27 엘지이노텍 주식회사 인쇄회로기판
JP7078016B2 (ja) * 2019-06-17 2022-05-31 株式会社村田製作所 インダクタ部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192523A (ja) 2013-03-26 2014-10-06 Samsung Electro-Mechanics Co Ltd パワーインダクタおよびその製造方法
JP2016219559A (ja) 2015-05-19 2016-12-22 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP2019186518A (ja) 2018-04-06 2019-10-24 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル部品及びその製造方法
JP2019197851A (ja) 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Also Published As

Publication number Publication date
WO2022009675A1 (ja) 2022-01-13
JPWO2022009675A1 (https=) 2022-01-13
CN115024025A (zh) 2022-09-06
US12267952B2 (en) 2025-04-01
US20230050814A1 (en) 2023-02-16

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