JPWO2022009675A1 - - Google Patents

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Publication number
JPWO2022009675A1
JPWO2022009675A1 JP2022535005A JP2022535005A JPWO2022009675A1 JP WO2022009675 A1 JPWO2022009675 A1 JP WO2022009675A1 JP 2022535005 A JP2022535005 A JP 2022535005A JP 2022535005 A JP2022535005 A JP 2022535005A JP WO2022009675 A1 JPWO2022009675 A1 JP WO2022009675A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022535005A
Other languages
Japanese (ja)
Other versions
JP7304492B2 (ja
JPWO2022009675A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022009675A1 publication Critical patent/JPWO2022009675A1/ja
Publication of JPWO2022009675A5 publication Critical patent/JPWO2022009675A5/ja
Application granted granted Critical
Publication of JP7304492B2 publication Critical patent/JP7304492B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Structure Of Printed Boards (AREA)
JP2022535005A 2020-07-08 2021-06-23 フレキシブルプリント配線板及びその製造方法 Active JP7304492B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020117888 2020-07-08
JP2020117888 2020-07-08
PCT/JP2021/023701 WO2022009675A1 (ja) 2020-07-08 2021-06-23 フレキシブルプリント配線板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2022009675A1 true JPWO2022009675A1 (https=) 2022-01-13
JPWO2022009675A5 JPWO2022009675A5 (https=) 2022-11-14
JP7304492B2 JP7304492B2 (ja) 2023-07-06

Family

ID=79552950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022535005A Active JP7304492B2 (ja) 2020-07-08 2021-06-23 フレキシブルプリント配線板及びその製造方法

Country Status (4)

Country Link
US (1) US12267952B2 (https=)
JP (1) JP7304492B2 (https=)
CN (1) CN115024025A (https=)
WO (1) WO2022009675A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12016130B2 (en) * 2021-05-26 2024-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
CN119450910A (zh) * 2023-07-28 2025-02-14 鹏鼎控股(深圳)股份有限公司 高频传输电路板及其制作方法
JP7680647B1 (ja) * 2024-10-22 2025-05-20 住友電気工業株式会社 プリント配線板
JP7713613B1 (ja) * 2024-10-22 2025-07-25 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192523A (ja) * 2013-03-26 2014-10-06 Samsung Electro-Mechanics Co Ltd パワーインダクタおよびその製造方法
JP2016219559A (ja) * 2015-05-19 2016-12-22 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP2019186518A (ja) * 2018-04-06 2019-10-24 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル部品及びその製造方法
JP2019197851A (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4426900B2 (ja) 2004-05-10 2010-03-03 三井金属鉱業株式会社 プリント配線基板、その製造方法および半導体装置
JP4665531B2 (ja) * 2005-01-27 2011-04-06 日立電線株式会社 配線板の製造方法
WO2012101985A1 (ja) * 2011-01-26 2012-08-02 住友ベークライト株式会社 プリント配線板およびプリント配線板の製造方法
TWI610206B (zh) * 2015-06-22 2018-01-01 Fujikura Ltd 配線體、配線基板及觸控感測器
CN107924253B (zh) 2015-08-26 2022-07-01 住友金属矿山股份有限公司 导电性基板
JP6722291B2 (ja) * 2016-09-23 2020-07-15 富士フイルム株式会社 導電性フィルム、タッチパネル、フォトマスク、インプリントテンプレート、導電性フィルム形成用積層体、導電性フィルムの製造方法、および電子デバイスの製造方法
CN110612783B (zh) 2017-05-16 2022-11-01 住友电工印刷电路株式会社 印刷配线板及其制造方法
KR102698875B1 (ko) 2018-12-13 2024-08-27 엘지이노텍 주식회사 인쇄회로기판
JP7078016B2 (ja) * 2019-06-17 2022-05-31 株式会社村田製作所 インダクタ部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192523A (ja) * 2013-03-26 2014-10-06 Samsung Electro-Mechanics Co Ltd パワーインダクタおよびその製造方法
JP2016219559A (ja) * 2015-05-19 2016-12-22 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP2019186518A (ja) * 2018-04-06 2019-10-24 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル部品及びその製造方法
JP2019197851A (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Also Published As

Publication number Publication date
WO2022009675A1 (ja) 2022-01-13
JP7304492B2 (ja) 2023-07-06
CN115024025A (zh) 2022-09-06
US12267952B2 (en) 2025-04-01
US20230050814A1 (en) 2023-02-16

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