CN115024025A - 柔性印刷布线板及其制造方法 - Google Patents

柔性印刷布线板及其制造方法 Download PDF

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Publication number
CN115024025A
CN115024025A CN202180012005.4A CN202180012005A CN115024025A CN 115024025 A CN115024025 A CN 115024025A CN 202180012005 A CN202180012005 A CN 202180012005A CN 115024025 A CN115024025 A CN 115024025A
Authority
CN
China
Prior art keywords
layer
plating
wiring
flexible printed
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180012005.4A
Other languages
English (en)
Chinese (zh)
Inventor
池邉茉纪
新田耕司
酒井将一郎
永田真悟
本村隼一
伊藤雅広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN115024025A publication Critical patent/CN115024025A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Structure Of Printed Boards (AREA)
CN202180012005.4A 2020-07-08 2021-06-23 柔性印刷布线板及其制造方法 Pending CN115024025A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020117888 2020-07-08
JP2020-117888 2020-07-08
PCT/JP2021/023701 WO2022009675A1 (ja) 2020-07-08 2021-06-23 フレキシブルプリント配線板及びその製造方法

Publications (1)

Publication Number Publication Date
CN115024025A true CN115024025A (zh) 2022-09-06

Family

ID=79552950

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180012005.4A Pending CN115024025A (zh) 2020-07-08 2021-06-23 柔性印刷布线板及其制造方法

Country Status (4)

Country Link
US (1) US12267952B2 (https=)
JP (1) JP7304492B2 (https=)
CN (1) CN115024025A (https=)
WO (1) WO2022009675A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12016130B2 (en) * 2021-05-26 2024-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
CN119450910A (zh) * 2023-07-28 2025-02-14 鹏鼎控股(深圳)股份有限公司 高频传输电路板及其制作方法
JP7680647B1 (ja) * 2024-10-22 2025-05-20 住友電気工業株式会社 プリント配線板
JP7713613B1 (ja) * 2024-10-22 2025-07-25 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1697592A (zh) * 2004-05-10 2005-11-16 三井金属矿业株式会社 印刷线路板,其生产方法和半导体器件
US20060163725A1 (en) * 2005-01-27 2006-07-27 Toshio Haba Wiring board and production method thereof
TW201251533A (en) * 2011-01-26 2012-12-16 Sumitomo Bakelite Co Print circuit board and method of manufacturing the same
US20140292469A1 (en) * 2013-03-26 2014-10-02 Samsung Electro-Mechanics Co., Ltd. Power inductor and manufacturing method thereof
CN107533404A (zh) * 2015-06-22 2018-01-02 株式会社藤仓 布线体、布线基板以及触摸传感器
TW201814730A (zh) * 2016-09-23 2018-04-16 日商富士軟片股份有限公司 導電性薄膜、觸控面板、光罩、壓印模板、導電性薄膜形成用積層體、導電性薄膜的製造方法及電子裝置的製造方法
CN107924253A (zh) * 2015-08-26 2018-04-17 住友金属矿山股份有限公司 导电性基板
JP2019197851A (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
CN110612783A (zh) * 2017-05-16 2019-12-24 住友电工印刷电路株式会社 印刷配线板及其制造方法
TW202025430A (zh) * 2018-12-13 2020-07-01 韓商Ｌｇ伊諾特股份有限公司 印刷電路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6510884B2 (ja) 2015-05-19 2019-05-08 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
KR102016496B1 (ko) 2018-04-06 2019-09-02 삼성전기주식회사 코일 부품 및 이의 제조 방법
JP7078016B2 (ja) * 2019-06-17 2022-05-31 株式会社村田製作所 インダクタ部品

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1697592A (zh) * 2004-05-10 2005-11-16 三井金属矿业株式会社 印刷线路板,其生产方法和半导体器件
US20060163725A1 (en) * 2005-01-27 2006-07-27 Toshio Haba Wiring board and production method thereof
TW201251533A (en) * 2011-01-26 2012-12-16 Sumitomo Bakelite Co Print circuit board and method of manufacturing the same
US20140292469A1 (en) * 2013-03-26 2014-10-02 Samsung Electro-Mechanics Co., Ltd. Power inductor and manufacturing method thereof
CN107533404A (zh) * 2015-06-22 2018-01-02 株式会社藤仓 布线体、布线基板以及触摸传感器
CN107924253A (zh) * 2015-08-26 2018-04-17 住友金属矿山股份有限公司 导电性基板
TW201814730A (zh) * 2016-09-23 2018-04-16 日商富士軟片股份有限公司 導電性薄膜、觸控面板、光罩、壓印模板、導電性薄膜形成用積層體、導電性薄膜的製造方法及電子裝置的製造方法
CN110612783A (zh) * 2017-05-16 2019-12-24 住友电工印刷电路株式会社 印刷配线板及其制造方法
JP2019197851A (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
TW202025430A (zh) * 2018-12-13 2020-07-01 韓商Ｌｇ伊諾特股份有限公司 印刷電路板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
小西良弘: "《微波集成电路》", 30 September 1975, 国营安昌机械厂, pages: 104 - 107 *

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WO2022009675A1 (ja) 2022-01-13
JP7304492B2 (ja) 2023-07-06
JPWO2022009675A1 (https=) 2022-01-13
US12267952B2 (en) 2025-04-01
US20230050814A1 (en) 2023-02-16

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