JP7290723B2 - パッケージ、および、パワー半導体モジュールの製造方法 - Google Patents

パッケージ、および、パワー半導体モジュールの製造方法 Download PDF

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Publication number
JP7290723B2
JP7290723B2 JP2021527413A JP2021527413A JP7290723B2 JP 7290723 B2 JP7290723 B2 JP 7290723B2 JP 2021527413 A JP2021527413 A JP 2021527413A JP 2021527413 A JP2021527413 A JP 2021527413A JP 7290723 B2 JP7290723 B2 JP 7290723B2
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Japan
Prior art keywords
frame
package
power semiconductor
heat sink
adhesive layer
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JP2021527413A
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English (en)
Japanese (ja)
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JPWO2020261730A1 (https=
JPWO2020261730A5 (https=
Inventor
良男 築山
哲平 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
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NGK Insulators Ltd
NGK Electronics Devices Inc
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Publication of JPWO2020261730A5 publication Critical patent/JPWO2020261730A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021527413A 2019-06-25 2020-04-20 パッケージ、および、パワー半導体モジュールの製造方法 Active JP7290723B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019117393 2019-06-25
JP2019117393 2019-06-25
PCT/JP2020/017028 WO2020261730A1 (ja) 2019-06-25 2020-04-20 パッケージ、および、パワー半導体モジュールの製造方法

Publications (3)

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JPWO2020261730A1 JPWO2020261730A1 (https=) 2020-12-30
JPWO2020261730A5 JPWO2020261730A5 (https=) 2022-01-21
JP7290723B2 true JP7290723B2 (ja) 2023-06-13

Family

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JP2021527413A Active JP7290723B2 (ja) 2019-06-25 2020-04-20 パッケージ、および、パワー半導体モジュールの製造方法

Country Status (3)

Country Link
US (1) US11901268B2 (https=)
JP (1) JP7290723B2 (https=)
WO (1) WO2020261730A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3796373B1 (de) * 2019-09-20 2023-06-28 BIOTRONIK SE & Co. KG Platinenanordnung eines implantierbaren medizinischen geräts
US12477704B2 (en) 2021-01-22 2025-11-18 Mitsubishi Electric Corporation Power semiconductor device and method of manufacturing the same, and power conversion device
JP7444814B2 (ja) * 2021-04-27 2024-03-06 Ｎｇｋエレクトロデバイス株式会社 パッケージ

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179584A (ja) 2002-11-29 2004-06-24 Toyo Jushi Kk トランジスタパッケージ及びその製造方法
JP2005322697A (ja) 2004-05-06 2005-11-17 Denso Corp 電子制御装置
US20070090514A1 (en) 2005-10-24 2007-04-26 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
JP2007165486A (ja) 2005-12-12 2007-06-28 Shinko Electric Ind Co Ltd 放熱板及び半導体装置
JP2009513026A (ja) 2005-10-24 2009-03-26 フリースケール セミコンダクター インコーポレイテッド 半導体構造及び組み立て方法
JP2018142617A (ja) 2017-02-28 2018-09-13 三菱電機株式会社 半導体装置およびその製造方法
WO2018225511A1 (ja) 2017-06-08 2018-12-13 Ｎｇｋエレクトロデバイス株式会社 蓋体、電子装置の製造方法および電子装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068919A (ja) * 2001-08-27 2003-03-07 Nec Yamagata Ltd 半導体装置
JP3816821B2 (ja) 2002-03-20 2006-08-30 株式会社住友金属エレクトロデバイス 高周波用パワーモジュール基板及びその製造方法
JP2005150133A (ja) 2003-11-11 2005-06-09 Sumitomo Metal Electronics Devices Inc 半導体素子収納用容器
JP2012049224A (ja) 2010-08-25 2012-03-08 Kyocera Corp 実装構造体および実装構造体の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179584A (ja) 2002-11-29 2004-06-24 Toyo Jushi Kk トランジスタパッケージ及びその製造方法
JP2005322697A (ja) 2004-05-06 2005-11-17 Denso Corp 電子制御装置
US20070090514A1 (en) 2005-10-24 2007-04-26 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
JP2009513026A (ja) 2005-10-24 2009-03-26 フリースケール セミコンダクター インコーポレイテッド 半導体構造及び組み立て方法
JP2007165486A (ja) 2005-12-12 2007-06-28 Shinko Electric Ind Co Ltd 放熱板及び半導体装置
JP2018142617A (ja) 2017-02-28 2018-09-13 三菱電機株式会社 半導体装置およびその製造方法
WO2018225511A1 (ja) 2017-06-08 2018-12-13 Ｎｇｋエレクトロデバイス株式会社 蓋体、電子装置の製造方法および電子装置

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JPWO2020261730A1 (https=) 2020-12-30
US20220077033A1 (en) 2022-03-10
US11901268B2 (en) 2024-02-13
WO2020261730A1 (ja) 2020-12-30

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