JP7282710B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 105
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000005530 etching Methods 0.000 claims description 84
- 239000000758 substrate Substances 0.000 claims description 71
- 235000020637 scallop Nutrition 0.000 claims description 35
- 241000237503 Pectinidae Species 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 8
- 241000237509 Patinopecten sp. Species 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 5
- 229910018503 SF6 Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
- H01L21/30655—Plasma etching; Reactive-ion etching comprising alternated and repeated etching and passivation steps, e.g. Bosch process
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Ceramic Engineering (AREA)
- Dicing (AREA)
- Drying Of Semiconductors (AREA)
- Die Bonding (AREA)
Description
実施形態の半導体装置は、基板と、基板の上に設けられた電極層と、電極層の上に設けられ、基板の基板面に対して第1角度を取る第1側面部と、第1側面部の下に設けられ、基板面に対して第1角度より小さな第2角度を取る第2側面部と、を有する半導体チップと、電極層及び半導体チップの周囲に設けられ、第1側面部及び第2側面部と接している樹脂と、を備える。
4 基板面
6 電極層
8 第2開口部
10 半導体チップ
12 第1側面部
14 第1スキャロップ
16 第2側面部
18 第2スキャロップ
20 樹脂
60 マスク
62 第1開口部
70 半導体基板
72 第1部分
74 第1間隙
76 第2部分
78 第2間隙
80 間隙
82 保護膜
90 ダイシングテープ
100 半導体装置
Claims (4)
- 電極層を下に有する半導体基板の上に設けられ、第1幅の第1開口部を有するマスクを用いて、前記第1開口部の下に設けられた、前記半導体基板の第1部分の第1エッチングを行うことにより、第1側面部を有する第1間隙を形成し、
前記第1間隙の下の前記半導体基板の第2部分の第2エッチングを行うことにより、第2側面部を有する、逆テーパー形状の第2間隙を形成し、
前記第2間隙を形成することにより前記半導体基板を分断して半導体チップを形成し、
前記電極層及び前記半導体チップを基板の上に配置し、
前記基板の上の前記半導体チップの周囲に樹脂を形成する、
半導体装置の製造方法であって、
前記第1エッチングは、異方性エッチングである第3エッチングと、前記第3エッチングの後に行われる、等方性エッチングである第4エッチングと、の繰り返しであり、
前記第2エッチングは、異方性エッチングである第5エッチングと、前記第5エッチングの後に行われる、等方性エッチングである第6エッチングと、の繰り返しであり、
前記第6エッチングの時間は、前記第4エッチングの時間より長く、
前記第6エッチングの時間は、前記繰り返しの度に所定時間追加されて長くなる、
半導体装置の製造方法。 - 前記第1エッチングを行うことにより、前記第1側面部に平行な方向において、第1ピッチで形成された複数の第1スキャロップを前記第1側面部に形成し、
前記第2エッチングを行うことにより、前記第2側面部に平行な方向において、第2ピッチで形成された複数の第2スキャロップを前記第2側面部に形成する、
請求項1記載の半導体装置の製造方法。 - 前記第2ピッチは前記第1ピッチより大きい、
請求項2記載の半導体装置の製造方法。 - 前記複数の第1スキャロップの第1ピッチは10μm以下であり、
前記複数の第2スキャロップの第2ピッチは10μm以下である、
請求項2又は請求項3記載の半導体装置の製造方法。
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JP2020050007A JP7282710B2 (ja) | 2020-03-19 | 2020-03-19 | 半導体装置の製造方法 |
CN202010787426.1A CN113496963A (zh) | 2020-03-19 | 2020-08-07 | 半导体装置及其制造方法 |
US17/012,563 US11587840B2 (en) | 2020-03-19 | 2020-09-04 | Semiconductor device and manufacturing method thereof |
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JP2020050007A JP7282710B2 (ja) | 2020-03-19 | 2020-03-19 | 半導体装置の製造方法 |
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JP7282710B2 true JP7282710B2 (ja) | 2023-05-29 |
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JP (1) | JP7282710B2 (ja) |
CN (1) | CN113496963A (ja) |
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JPH06177178A (ja) * | 1992-12-01 | 1994-06-24 | Nissan Motor Co Ltd | 半導体チップの構造 |
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