JP7259113B2 - 異方導電性フィルム、これを含むディスプレイ装置及び/又はこれを含む半導体装置 - Google Patents
異方導電性フィルム、これを含むディスプレイ装置及び/又はこれを含む半導体装置 Download PDFInfo
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Description
さらに、バンプの大きさ又は高さは、150nm以上で、200nm以下であるというものである。
9’.前記1~9の具体例において、前記異方導電性フィルムを第1被接続部材と第2被接続部材との間に位置させ、50℃~70℃、1秒~2秒間及び1MPa~2MPaの圧力条件下の仮圧着;及び130℃~170℃、5秒~7秒間及び50MPa~90MPaの圧力条件下の本圧着を行った後、前記異方導電性フィルムを85℃及び相対湿度85%の条件下で100時間にわたって放置した後で測定した信頼性評価後の接続抵抗は約1Ω以下、例えば1Ωとするものであってもよい。
9”.異方導電性フィルムは、
導電層を含み、
前記導電層は、導電性粒子を含む導電層用組成物で形成され、
前記導電性粒子は、飽和磁化値及び比重がそれぞれ下記の式(1)及び式(2)
式(1)10emu/g≦飽和磁化値≦20emu/g
式(2)2.8≦比重≦3.2
を満足するものである、異方導電性フィルムであって:
前記異方導電性フィルムは、前記導電性粒子の単分散率が90%以上のものであり、
前記導電性粒子は、基材微粒子;前記基材微粒子の表面を取り囲む金属被覆層;及び前記金属被覆層の表面に形成されたバンプ;を含む第1導電性粒子、及び基材微粒子;前記基材微粒子の表面に形成されたバンプ;及び前記基材微粒子の表面及び前記バンプを取り囲む金属被覆層;を含む第2導電性粒子のうち1種以上を含むものであり、
前記金属被覆層の厚さは、1,500Å以上で、2,200Å以下のものであり、
前記バンプの密度は78%~95%であり、
前記バンプの大きさ又は高さは、150nm以上で、200nm以下であり、
前記金属被覆層は、ニッケルでのみ形成されたり;又はニッケルと、ボロン、タングステン、及びリンのうち一つ以上と、を含むものであり、
前記導電性粒子は、平均粒径(D50)が2.5μm以上で、6.0μm以下のものであり、
前記導電性粒子は、前記導電層のうち20重量%以上、60重量%以下で含まれるものであり、
前記異方導電性フィルムを第1被接続部材と第2被接続部材との間に位置させ、50℃~70℃、1秒~2秒間及び1MPa~2MPaの圧力条件下の仮圧着;及び130℃~170℃、5秒~7秒間及び50MPa~90MPaの圧力条件下の本圧着を行った後、前記異方導電性フィルムを85℃及び相対湿度85%の条件下で100時間にわたって放置した後で測定した信頼性評価後の接続抵抗は1Ω以下とする
ことを特徴とするというものである。
Claims (5)
- 導電層を含み、
前記導電層は、導電性粒子を含む導電層用組成物で形成され、
前記導電性粒子は、飽和磁化値及び比重がそれぞれ下記の式(1)及び式(2)
式(1)10×10 -3 A・m 2 /g≦飽和磁化値≦20×10 -3 A・m 2 /g
式(2)2.8≦比重≦3.2
を満足するものである、異方導電性フィルムであって:
前記異方導電性フィルムは、前記導電性粒子の単分散率が90%以上のものであり、
前記導電性粒子は、基材微粒子;前記基材微粒子の表面を取り囲む金属被覆層;及び前記金属被覆層の表面に形成されたバンプ;を含む第1導電性粒子、及び基材微粒子;前記基材微粒子の表面に形成されたバンプ;及び前記基材微粒子の表面及び前記バンプを取り囲む金属被覆層;を含む第2導電性粒子のうち1種以上を含むものであり、
前記金属被覆層の厚さは、1,500×10 -10 m以上で、2,200×10 -10 m以下のものであり、
前記バンプの密度は78%~95%であり、
前記バンプの大きさ又は高さは、150nm以上で、200nm以下であり、
前記金属被覆層は、ニッケルでのみ形成されたり;又はニッケルと、ボロン、タングステン、及びリンのうち一つ以上と、を含むものであり、
前記導電性粒子は、平均粒径(D50)が2.5μm以上で、6.0μm以下のものであり、
前記導電性粒子は、前記導電層のうち20重量%以上、60重量%以下で含まれるものであり、
前記異方導電性フィルムを第1被接続部材と第2被接続部材との間に位置させ、50℃~70℃、1秒~2秒間及び1MPa~2MPaの圧力条件下の仮圧着;及び130℃~170℃、5秒~7秒間及び50MPa~90MPaの圧力条件下の本圧着を行った後、前記異方導電性フィルムを85℃及び相対湿度85%の条件下で100時間にわたって放置した後で測定した信頼性評価後の接続抵抗は1Ω以下とする
ことを特徴とする異方導電性フィルム。 - 前記導電層用組成物は、バインダー樹脂、エポキシ樹脂、及び硬化剤をさらに含むものである、請求項1に記載の異方導電性フィルム。
- 前記異方導電性フィルムは、前記導電層の少なくとも一面に絶縁層がさらに形成されたものである、請求項1に記載の異方導電性フィルム。
- 請求項1から請求項3のいずれか1項の異方導電性フィルムを含むディスプレイ装置。
- 請求項1から請求項3のいずれか1項の異方導電性フィルムを含む半導体装置。
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KR1020170184883A KR102180143B1 (ko) | 2017-12-29 | 2017-12-29 | 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및/또는 이를 포함하는 반도체 장치 |
KR10-2017-0184883 | 2017-12-29 | ||
JP2020536688A JP2021509526A (ja) | 2017-12-29 | 2018-12-20 | 異方導電性フィルム、これを含むディスプレイ装置及び/又はこれを含む半導体装置 |
PCT/KR2018/016328 WO2019132414A1 (ko) | 2017-12-29 | 2018-12-20 | 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및/또는 이를 포함하는 반도체 장치 |
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JP2023131379A (ja) * | 2022-03-09 | 2023-09-22 | 株式会社レゾナック | 導電粒子、回路接続用接着フィルム及びその製造方法、並びに、接続構造体及びその製造方法 |
JP2023131554A (ja) * | 2022-03-09 | 2023-09-22 | 株式会社レゾナック | 導電粒子、回路接続用接着フィルム及びその製造方法、並びに、接続構造体及びその製造方法 |
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JP2015167106A (ja) | 2014-03-04 | 2015-09-24 | 日立化成株式会社 | 異方導電性フィルム及び接続構造体 |
JP2015167186A (ja) | 2014-03-04 | 2015-09-24 | 日立化成株式会社 | 接続構造体の製造方法及び接続構造体 |
JP2016076304A (ja) | 2014-10-02 | 2016-05-12 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
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WO2005101589A1 (ja) * | 2004-04-14 | 2005-10-27 | Jsr Corporation | 異方導電性シート製造用型および異方導電性シートの製造方法 |
JP2007091959A (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
CN101689410B (zh) * | 2007-08-02 | 2013-10-16 | 日立化成株式会社 | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 |
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JP2013077557A (ja) * | 2011-09-13 | 2013-04-25 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
JP6079425B2 (ja) * | 2012-05-16 | 2017-02-15 | 日立化成株式会社 | 導電粒子、異方性導電接着剤フィルム及び接続構造体 |
JP6119130B2 (ja) * | 2012-07-11 | 2017-04-26 | 日立化成株式会社 | 複合粒子及び異方導電性接着剤 |
JP5939063B2 (ja) * | 2012-07-11 | 2016-06-22 | 日立化成株式会社 | 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤 |
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