JP7247177B2 - 集積回路パッケージのワークプレス検査システムの平衡適合力機構 - Google Patents

集積回路パッケージのワークプレス検査システムの平衡適合力機構 Download PDF

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Publication number
JP7247177B2
JP7247177B2 JP2020523353A JP2020523353A JP7247177B2 JP 7247177 B2 JP7247177 B2 JP 7247177B2 JP 2020523353 A JP2020523353 A JP 2020523353A JP 2020523353 A JP2020523353 A JP 2020523353A JP 7247177 B2 JP7247177 B2 JP 7247177B2
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Japan
Prior art keywords
chip package
pusher
pusher pin
pins
work press
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JP2020523353A
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English (en)
Japanese (ja)
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JP2021501317A5 (enExample
JP2021501317A (ja
Inventor
マルディ，モーセン・エイチ
マホニー，デイビッド・エム
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Xilinx Inc
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Xilinx Inc
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Publication date
Priority claimed from US15/794,479 external-priority patent/US10367279B2/en
Priority claimed from US15/802,251 external-priority patent/US10564212B2/en
Priority claimed from US15/802,253 external-priority patent/US10539610B2/en
Application filed by Xilinx Inc filed Critical Xilinx Inc
Publication of JP2021501317A publication Critical patent/JP2021501317A/ja
Publication of JP2021501317A5 publication Critical patent/JP2021501317A5/ja
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Publication of JP7247177B2 publication Critical patent/JP7247177B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2020523353A 2017-10-26 2018-10-25 集積回路パッケージのワークプレス検査システムの平衡適合力機構 Active JP7247177B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US15/794,479 2017-10-26
US15/794,479 US10367279B2 (en) 2017-10-26 2017-10-26 Pusher pin having a non-electrically conductive portion
US15/802,251 US10564212B2 (en) 2017-11-02 2017-11-02 Integrated circuit package testing system
US15/802,251 2017-11-02
US15/802,253 US10539610B2 (en) 2017-11-02 2017-11-02 Chip package test system
US15/802,253 2017-11-02
PCT/US2018/057586 WO2019084318A1 (en) 2017-10-26 2018-10-25 BALANCED CONFORMATION FORCE MECHANISM FOR INTEGRATED CIRCUIT BOX WORK PRESS SYSTEMS

Publications (3)

Publication Number Publication Date
JP2021501317A JP2021501317A (ja) 2021-01-14
JP2021501317A5 JP2021501317A5 (enExample) 2021-11-25
JP7247177B2 true JP7247177B2 (ja) 2023-03-28

Family

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Family Applications (1)

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JP2020523353A Active JP7247177B2 (ja) 2017-10-26 2018-10-25 集積回路パッケージのワークプレス検査システムの平衡適合力機構

Country Status (5)

Country Link
EP (1) EP3701273B1 (enExample)
JP (1) JP7247177B2 (enExample)
KR (1) KR102657145B1 (enExample)
CN (1) CN111316109B (enExample)
WO (1) WO2019084318A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113053774A (zh) * 2019-12-27 2021-06-29 迪科特测试科技(苏州)有限公司 探测装置
TWI817183B (zh) * 2021-08-23 2023-10-01 鴻勁精密股份有限公司 壓接機構、測試裝置及作業機
CN115754684B (zh) * 2023-01-06 2023-07-14 法特迪精密科技（苏州）有限公司 芯片老化测试台
CN116224037B (zh) * 2023-01-06 2023-10-03 法特迪精密科技（苏州）有限公司 一种芯片温度循环老化测试台上实现的芯片温度循环老化测试方法
KR20250171269A (ko) * 2024-05-28 2025-12-08 양쯔 메모리 테크놀로지스 씨오., 엘티디. 반도체 칩 패키지를 시험하기 위한 방법 및 시험 시스템

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001074815A (ja) 1999-09-07 2001-03-23 Hitachi Telecom Technol Ltd プリント基板検査治具
US20090015279A1 (en) 2007-07-10 2009-01-15 Samsung Electronics Co., Ltd. Socket, and test apparatus and method using the socket
JP2009121992A (ja) 2007-11-15 2009-06-04 Sharp Corp 電子回路基板およびテスト装置
JP2011257239A (ja) 2010-06-08 2011-12-22 Renesas Electronics Corp 電子装置の電気的特性検査装置及び電気的特性検査方法
JP2012088065A (ja) 2010-10-15 2012-05-10 Hioki Ee Corp ピンボードユニットおよび基板検査装置
DE102015215634A1 (de) 2015-08-17 2017-02-23 Atx Hardware Gmbh Halter zum Niederhalten einer zu prüfenden Platine auf einen Prüfadapter in einer Prüfanordnung
US20170059611A1 (en) 2015-09-02 2017-03-02 Oracle International Corporation Coaxial integrated circuit test socket

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025732A (en) * 1993-07-09 2000-02-15 Aehr Test Systems Reusable die carrier for burn-in and burn-in process
US5640303A (en) * 1995-10-30 1997-06-17 Precision Connector Designs, Inc. Interconnection apparatus for semiconductor/integrated circuit devices
JPH09159694A (ja) * 1995-12-08 1997-06-20 Nec Corp Ｌｓｉテストプローブ装置
JPH10221398A (ja) * 1997-01-31 1998-08-21 Aiwa Co Ltd プリント基板の検査装置
JPH11243271A (ja) * 1998-02-25 1999-09-07 Fuji Photo Film Co Ltd 基板矯正装置
JPH11242067A (ja) * 1998-02-25 1999-09-07 Fuji Photo Film Co Ltd 基板検査装置
JP3822539B2 (ja) * 2001-08-09 2006-09-20 山一電機株式会社 Ｉｃソケット
US7108517B2 (en) * 2004-09-27 2006-09-19 Wells-Cti, Llc Multi-site chip carrier and method
US7262615B2 (en) * 2005-10-31 2007-08-28 Freescale Semiconductor, Inc. Method and apparatus for testing a semiconductor structure having top-side and bottom-side connections
US7601009B2 (en) * 2006-05-18 2009-10-13 Centipede Systems, Inc. Socket for an electronic device
FR2983969B1 (fr) * 2011-12-07 2014-12-05 Larisys Ind Dispositif de controle de cartes electroniques.
US9082644B2 (en) * 2013-01-18 2015-07-14 Infineon Technologies Ag Method of manufacturing and testing a chip package
CN103399268A (zh) * 2013-07-19 2013-11-20 上海韬盛电子科技有限公司 顶针式的集成电路测试治具
KR101782600B1 (ko) * 2016-02-02 2017-10-23 (주)티에스이 반도체 패키지 테스트 장치
CN108170944B (zh) * 2017-12-26 2021-07-30 全球能源互联网研究院有限公司 一种半导体器件的压力均衡制作参数优化方法及制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001074815A (ja) 1999-09-07 2001-03-23 Hitachi Telecom Technol Ltd プリント基板検査治具
US20090015279A1 (en) 2007-07-10 2009-01-15 Samsung Electronics Co., Ltd. Socket, and test apparatus and method using the socket
JP2009121992A (ja) 2007-11-15 2009-06-04 Sharp Corp 電子回路基板およびテスト装置
JP2011257239A (ja) 2010-06-08 2011-12-22 Renesas Electronics Corp 電子装置の電気的特性検査装置及び電気的特性検査方法
JP2012088065A (ja) 2010-10-15 2012-05-10 Hioki Ee Corp ピンボードユニットおよび基板検査装置
DE102015215634A1 (de) 2015-08-17 2017-02-23 Atx Hardware Gmbh Halter zum Niederhalten einer zu prüfenden Platine auf einen Prüfadapter in einer Prüfanordnung
US20170059611A1 (en) 2015-09-02 2017-03-02 Oracle International Corporation Coaxial integrated circuit test socket

Also Published As

Publication number Publication date
WO2019084318A1 (en) 2019-05-02
EP3701273B1 (en) 2025-03-26
KR102657145B1 (ko) 2024-04-11
KR20200078560A (ko) 2020-07-01
CN111316109B (zh) 2023-04-07
JP2021501317A (ja) 2021-01-14
CN111316109A (zh) 2020-06-19
EP3701273A1 (en) 2020-09-02

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