JP7243750B2 - 半導体装置および半導体モジュール - Google Patents

半導体装置および半導体モジュール Download PDF

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JP7243750B2
JP7243750B2 JP2021028963A JP2021028963A JP7243750B2 JP 7243750 B2 JP7243750 B2 JP 7243750B2 JP 2021028963 A JP2021028963 A JP 2021028963A JP 2021028963 A JP2021028963 A JP 2021028963A JP 7243750 B2 JP7243750 B2 JP 7243750B2
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Prior art keywords
semiconductor element
electrode
conductive material
layer
semiconductor
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JP2021028963A
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Japanese (ja)
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JP2021174982A5 (https=
JP2021174982A (ja
Inventor
貴博 中野
青吾 大澤
康嗣 大倉
直仁 水野
仁浩 犬塚
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Denso Corp
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Denso Corp
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Priority to PCT/JP2021/011411 priority Critical patent/WO2021210344A1/ja
Priority to CN202511421302.0A priority patent/CN121240508A/zh
Priority to CN202180028696.7A priority patent/CN115428145B/zh
Publication of JP2021174982A publication Critical patent/JP2021174982A/ja
Publication of JP2021174982A5 publication Critical patent/JP2021174982A5/ja
Priority to US17/964,381 priority patent/US12476163B2/en
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Publication of JP7243750B2 publication Critical patent/JP7243750B2/ja
Priority to US19/326,046 priority patent/US20260011618A1/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021028963A 2020-04-17 2021-02-25 半導体装置および半導体モジュール Active JP7243750B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2021/011411 WO2021210344A1 (ja) 2020-04-17 2021-03-19 半導体装置および半導体モジュール
CN202511421302.0A CN121240508A (zh) 2020-04-17 2021-03-19 半导体装置及半导体模组
CN202180028696.7A CN115428145B (zh) 2020-04-17 2021-03-19 半导体装置及半导体模组
US17/964,381 US12476163B2 (en) 2020-04-17 2022-10-12 Semiconductor device and semiconductor module
US19/326,046 US20260011618A1 (en) 2020-04-17 2025-09-11 Semiconductor device and semiconductor module

Applications Claiming Priority (2)

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JP2020074422 2020-04-17
JP2020074422 2020-04-17

Publications (3)

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JP2021174982A JP2021174982A (ja) 2021-11-01
JP2021174982A5 JP2021174982A5 (https=) 2022-02-22
JP7243750B2 true JP7243750B2 (ja) 2023-03-22

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023079124A (ja) * 2021-11-26 2023-06-07 国立大学法人東北大学 パワー半導体素子及びパワー半導体モジュール
JP7542811B2 (ja) * 2023-02-09 2024-09-02 株式会社Flosfia モジュールユニット

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016196A (ja) 2000-04-24 2002-01-18 Fuji Electric Co Ltd リードフレーム、およびそれを用いた樹脂封止形半導体装置
JP2003110064A (ja) 2001-07-26 2003-04-11 Denso Corp 半導体装置
JP2012243890A (ja) 2011-05-18 2012-12-10 Denso Corp 半導体装置およびその製造方法
JP2015126119A (ja) 2013-12-26 2015-07-06 トヨタ自動車株式会社 半導体装置及び半導体装置の製造方法
JP2020047696A (ja) 2018-09-18 2020-03-26 日立化成株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302727A (ja) * 1993-04-15 1994-10-28 Hitachi Ltd 半導体集積回路装置
US5604376A (en) * 1994-06-30 1997-02-18 Digital Equipment Corporation Paddleless molded plastic semiconductor chip package
US6271469B1 (en) * 1999-11-12 2001-08-07 Intel Corporation Direct build-up layer on an encapsulated die package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016196A (ja) 2000-04-24 2002-01-18 Fuji Electric Co Ltd リードフレーム、およびそれを用いた樹脂封止形半導体装置
JP2003110064A (ja) 2001-07-26 2003-04-11 Denso Corp 半導体装置
JP2012243890A (ja) 2011-05-18 2012-12-10 Denso Corp 半導体装置およびその製造方法
JP2015126119A (ja) 2013-12-26 2015-07-06 トヨタ自動車株式会社 半導体装置及び半導体装置の製造方法
JP2020047696A (ja) 2018-09-18 2020-03-26 日立化成株式会社 半導体装置

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