JP7239791B1 - 半導体封止プロセス用熱可塑性離型フィルム、及びこれを用いた電子部品の製造方法 - Google Patents

半導体封止プロセス用熱可塑性離型フィルム、及びこれを用いた電子部品の製造方法 Download PDF

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Publication number
JP7239791B1
JP7239791B1 JP2022580210A JP2022580210A JP7239791B1 JP 7239791 B1 JP7239791 B1 JP 7239791B1 JP 2022580210 A JP2022580210 A JP 2022580210A JP 2022580210 A JP2022580210 A JP 2022580210A JP 7239791 B1 JP7239791 B1 JP 7239791B1
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JP
Japan
Prior art keywords
thermoplastic
release film
mold
encapsulation process
semiconductor encapsulation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2022580210A
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English (en)
Japanese (ja)
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JPWO2023027020A1 (ko
Inventor
奬 野々下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023027020A1 publication Critical patent/JPWO2023027020A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2021/00—Use of unspecified rubbers as moulding material
    • B29K2021/003—Thermoplastic elastomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/08—Copolymers of ethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/10—Polymers of propylene
    • B29K2023/14—Copolymers of polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/38—Polymers of cycloalkenes, e.g. norbornene or cyclopentene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2227/00—Use of polyvinylhalogenides or derivatives thereof as reinforcement
    • B29K2227/12—Use of polyvinylhalogenides or derivatives thereof as reinforcement containing fluorine

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2022580210A 2021-08-25 2022-08-22 半導体封止プロセス用熱可塑性離型フィルム、及びこれを用いた電子部品の製造方法 Active JP7239791B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021137160 2021-08-25
JP2021137160 2021-08-25
PCT/JP2022/031551 WO2023027020A1 (ja) 2021-08-25 2022-08-22 半導体封止プロセス用熱可塑性離型フィルム、及びこれを用いた電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023027020A1 JPWO2023027020A1 (ko) 2023-03-02
JP7239791B1 true JP7239791B1 (ja) 2023-03-14

Family

ID=85323190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022580210A Active JP7239791B1 (ja) 2021-08-25 2022-08-22 半導体封止プロセス用熱可塑性離型フィルム、及びこれを用いた電子部品の製造方法

Country Status (5)

Country Link
JP (1) JP7239791B1 (ko)
KR (1) KR20240022607A (ko)
CN (1) CN117480044A (ko)
TW (1) TW202313302A (ko)
WO (1) WO2023027020A1 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614509A (en) * 1979-07-06 1981-02-12 Naphtachimie Sa Elastomeric copolymer of ethylene and propyrene and its manufacture
JP2009513803A (ja) * 2005-10-31 2009-04-02 ダウ グローバル テクノロジーズ インコーポレイティド プロピレンをベースとするエラストマー組成物
JP2012184436A (ja) * 2005-12-22 2012-09-27 Dow Global Technologies Llc スチレンブロックコポリマーおよびプロピレン−αオレフィンコポリマーのブレンド
WO2016002584A1 (ja) * 2014-06-30 2016-01-07 東レ株式会社 積層体およびそれを用いた発光装置の製造方法
JP2019196005A (ja) * 2018-05-07 2019-11-14 積水化学工業株式会社 離型フィルム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4031881B2 (ja) 1998-12-08 2008-01-09 アピックヤマダ株式会社 樹脂封止装置
JP4443715B2 (ja) 1999-12-27 2010-03-31 日東電工株式会社 半導体の樹脂封止方法及び半導体樹脂封止用離型フィルム
JP2001253934A (ja) 2000-03-09 2001-09-18 Hitachi Chem Co Ltd 架橋樹脂フィルム
JP2001310336A (ja) 2000-04-28 2001-11-06 Asahi Glass Co Ltd 樹脂モールド成形用離型フィルム
JP5333293B2 (ja) 2010-03-03 2013-11-06 日本ゼオン株式会社 離型フィルムおよびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614509A (en) * 1979-07-06 1981-02-12 Naphtachimie Sa Elastomeric copolymer of ethylene and propyrene and its manufacture
JP2009513803A (ja) * 2005-10-31 2009-04-02 ダウ グローバル テクノロジーズ インコーポレイティド プロピレンをベースとするエラストマー組成物
JP2012184436A (ja) * 2005-12-22 2012-09-27 Dow Global Technologies Llc スチレンブロックコポリマーおよびプロピレン−αオレフィンコポリマーのブレンド
WO2016002584A1 (ja) * 2014-06-30 2016-01-07 東レ株式会社 積層体およびそれを用いた発光装置の製造方法
JP2019196005A (ja) * 2018-05-07 2019-11-14 積水化学工業株式会社 離型フィルム

Also Published As

Publication number Publication date
WO2023027020A1 (ja) 2023-03-02
TW202313302A (zh) 2023-04-01
JPWO2023027020A1 (ko) 2023-03-02
CN117480044A (zh) 2024-01-30
KR20240022607A (ko) 2024-02-20

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