JPWO2023027020A1 - - Google Patents
Info
- Publication number
- JPWO2023027020A1 JPWO2023027020A1 JP2022580210A JP2022580210A JPWO2023027020A1 JP WO2023027020 A1 JPWO2023027020 A1 JP WO2023027020A1 JP 2022580210 A JP2022580210 A JP 2022580210A JP 2022580210 A JP2022580210 A JP 2022580210A JP WO2023027020 A1 JPWO2023027020 A1 JP WO2023027020A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2021/00—Use of unspecified rubbers as moulding material
- B29K2021/003—Thermoplastic elastomers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/04—Polymers of ethylene
- B29K2023/08—Copolymers of ethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/10—Polymers of propylene
- B29K2023/14—Copolymers of polypropylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/38—Polymers of cycloalkenes, e.g. norbornene or cyclopentene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2227/00—Use of polyvinylhalogenides or derivatives thereof as reinforcement
- B29K2227/12—Use of polyvinylhalogenides or derivatives thereof as reinforcement containing fluorine
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021137160 | 2021-08-25 | ||
JP2021137160 | 2021-08-25 | ||
PCT/JP2022/031551 WO2023027020A1 (ja) | 2021-08-25 | 2022-08-22 | 半導体封止プロセス用熱可塑性離型フィルム、及びこれを用いた電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023027020A1 true JPWO2023027020A1 (ko) | 2023-03-02 |
JP7239791B1 JP7239791B1 (ja) | 2023-03-14 |
Family
ID=85323190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022580210A Active JP7239791B1 (ja) | 2021-08-25 | 2022-08-22 | 半導体封止プロセス用熱可塑性離型フィルム、及びこれを用いた電子部品の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7239791B1 (ko) |
KR (1) | KR20240022607A (ko) |
CN (1) | CN117480044A (ko) |
TW (1) | TW202313302A (ko) |
WO (1) | WO2023027020A1 (ko) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2460964A1 (fr) * | 1979-07-06 | 1981-01-30 | Naphtachimie Sa | Copolymeres elastomeres d'ethylene et de propylene, leur fabrication et leurs applications |
JP4031881B2 (ja) | 1998-12-08 | 2008-01-09 | アピックヤマダ株式会社 | 樹脂封止装置 |
JP4443715B2 (ja) | 1999-12-27 | 2010-03-31 | 日東電工株式会社 | 半導体の樹脂封止方法及び半導体樹脂封止用離型フィルム |
JP2001253934A (ja) | 2000-03-09 | 2001-09-18 | Hitachi Chem Co Ltd | 架橋樹脂フィルム |
JP2001310336A (ja) | 2000-04-28 | 2001-11-06 | Asahi Glass Co Ltd | 樹脂モールド成形用離型フィルム |
CN101296987B (zh) * | 2005-10-31 | 2010-12-15 | 陶氏环球技术公司 | 丙烯基弹性体组合物 |
JP5108784B2 (ja) * | 2005-12-22 | 2012-12-26 | ダウ グローバル テクノロジーズ エルエルシー | スチレンブロックコポリマーおよびプロピレン−αオレフィンコポリマーのブレンド |
JP5333293B2 (ja) | 2010-03-03 | 2013-11-06 | 日本ゼオン株式会社 | 離型フィルムおよびその製造方法 |
CN106537618B (zh) * | 2014-06-30 | 2020-04-21 | 东丽株式会社 | 层叠体及使用其的发光装置的制造方法 |
JP7356256B2 (ja) * | 2018-05-07 | 2023-10-04 | 積水化学工業株式会社 | 離型フィルム |
-
2022
- 2022-08-22 JP JP2022580210A patent/JP7239791B1/ja active Active
- 2022-08-22 CN CN202280042374.2A patent/CN117480044A/zh active Pending
- 2022-08-22 WO PCT/JP2022/031551 patent/WO2023027020A1/ja active Application Filing
- 2022-08-22 KR KR1020247001670A patent/KR20240022607A/ko unknown
- 2022-08-25 TW TW111132023A patent/TW202313302A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2023027020A1 (ja) | 2023-03-02 |
TW202313302A (zh) | 2023-04-01 |
JP7239791B1 (ja) | 2023-03-14 |
CN117480044A (zh) | 2024-01-30 |
KR20240022607A (ko) | 2024-02-20 |
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