JP7238058B2 - 光導波路パッケージおよび発光装置 - Google Patents
光導波路パッケージおよび発光装置 Download PDFInfo
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- JP7238058B2 JP7238058B2 JP2021147118A JP2021147118A JP7238058B2 JP 7238058 B2 JP7238058 B2 JP 7238058B2 JP 2021147118 A JP2021147118 A JP 2021147118A JP 2021147118 A JP2021147118 A JP 2021147118A JP 7238058 B2 JP7238058 B2 JP 7238058B2
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- 150000002739 metals Chemical class 0.000 description 6
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- 238000005520 cutting process Methods 0.000 description 4
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- 229910052802 copper Inorganic materials 0.000 description 3
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- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
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- 230000008094 contradictory effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
- H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
Description
該基板上に位置するクラッドと、
該クラッド内に位置するコアと、
蓋体と、
金属体と、を備え、
前記クラッドは、前記基板に対向する第1面と、該第1面の反対に位置する第2面と、該第2面に開口した素子搭載領域と、を有し、
前記コアは、前記素子搭載領域から延びており、
前記蓋体は、前記素子搭載領域を覆っており、
前記金属体は、前記クラッドと前記蓋体との間に、前記素子搭載領域を周回して位置してもよい。
前記蓋体は、前記第1領域のみに位置してもよい。
前記蓋体が、前記段部に嵌合されてもよい。
前記素子搭載領域に位置する発光素子と、
前記コアから出射される光の光路上に位置するレンズと、を含んでもよい。
前記発光素子は、前記素子搭載領域から前記凹部に亘って位置してもよい。
2 上面
3 クラッド
3a 第1面
3b 第2面
4 コア
4a,4b,4c 入射端面
5 光導波層
8 素子搭載部
9 素子搭載領域
10 発光素子
11,11A 蓋体
11a 凹部
11b 当接部
12 金属体
15 外部接続配線
30 貫通孔
31 収容部
32 隔壁
33 突出部
34 段部
34a 段差面
3b1 第1領域
3b2 第2領域
41a,41b,41c 分割路
42 出射端面
43 合波部
44 統合路
45 レンズ
100,100A 光導波路パッケージ
200,200A 発光装置
Claims (6)
- 基板と、
該基板上に位置し、発光素子が収容される収容部を有するクラッドと、
該クラッド内に位置するコアと、
蓋体と、
接合材と、
外部接続配線と、を備え、
前記クラッドは、前記基板に対向する第1面と、該第1面の反対に位置する第2面と、該第2面に開口した複数の素子搭載領域と、前記コア上に位置する突出部と、前記複数の素子搭載領域間に設けられ、前記収容部内を前記複数の素子搭載領域ごとの空間に仕切る隔壁と、前記第2面の、平面視における前記複数の素子搭載領域の周囲に位置し、段部を有する第1領域と、該第1領域以外の第2領域と、を有し、
前記コアは、前記複数の素子搭載領域から延びており、
前記蓋体は、前記第1領域のみに位置して、前記複数の素子搭載領域を覆っており、前記段部に嵌合されており、
前記接合材は、前記クラッドと前記蓋体との間で、前記突出部を含む前記クラッド上において前記複数の素子搭載領域を周回して位置し、
前記外部接続配線は、前記蓋体と前記クラッドとの間以外において、搭載される素子と外部回路とを電気的に接続する、光導波路パッケージ。 - 前記段部は、前記第1領域の前記素子搭載領域に臨む内側部分が低い段差面を有し、前記蓋体は、前記段差面に対応した内側部分が突出して前記段部に嵌合している、請求項1に記載の光導波路パッケージ。
- 前記接合材は、前記蓋体と前記第2面における前記段差面より外側の前記第1領域との間に位置する、請求項2に記載の光導波路パッケージ。
- 前記蓋体は、発光素子との当接部を有する、請求項1~請求項3のいずれか一つに記載の光導波路パッケージ。
- 請求項1~請求項4のいずれか一つに記載の光導波路パッケージと、
前記素子搭載領域に位置する発光素子と、
前記コアから出射される光の光路上に位置するレンズと、を含む発光装置。 - 前記蓋体は、凹部を有し、
前記発光素子は、前記素子搭載領域から前記凹部に亘って位置している、請求項5記載の発光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2019180925 | 2019-09-30 | ||
JP2019180925 | 2019-09-30 | ||
JP2021501350A JP6944085B2 (ja) | 2019-09-30 | 2020-05-28 | 光導波路パッケージおよび発光装置 |
Related Parent Applications (1)
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JP2021501350A Division JP6944085B2 (ja) | 2019-09-30 | 2020-05-28 | 光導波路パッケージおよび発光装置 |
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JP2022001947A JP2022001947A (ja) | 2022-01-06 |
JP7238058B2 true JP7238058B2 (ja) | 2023-03-13 |
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JP2021501350A Active JP6944085B2 (ja) | 2019-09-30 | 2020-05-28 | 光導波路パッケージおよび発光装置 |
JP2021147118A Active JP7238058B2 (ja) | 2019-09-30 | 2021-09-09 | 光導波路パッケージおよび発光装置 |
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JP2021501350A Active JP6944085B2 (ja) | 2019-09-30 | 2020-05-28 | 光導波路パッケージおよび発光装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220350097A1 (ja) |
EP (1) | EP4040517A4 (ja) |
JP (2) | JP6944085B2 (ja) |
CN (1) | CN114375501A (ja) |
WO (1) | WO2021065078A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220342140A1 (en) * | 2019-09-30 | 2022-10-27 | Kyocera Corporation | Optical waveguide package and light-emitting device |
WO2023014647A1 (en) * | 2021-08-03 | 2023-02-09 | Meta Platforms Technologies, Llc | Laser die packaging for an rgb light source |
CN117980790A (zh) * | 2021-09-08 | 2024-05-03 | 京瓷株式会社 | 发光装置 |
JP2023057367A (ja) * | 2021-10-11 | 2023-04-21 | イビデン株式会社 | 配線基板 |
WO2023153419A1 (ja) * | 2022-02-10 | 2023-08-17 | 京セラ株式会社 | 光導波路基板、光導波路パッケージおよび光源モジュール |
WO2023162846A1 (ja) * | 2022-02-25 | 2023-08-31 | 京セラ株式会社 | 光導波路基板、光導波路パッケージおよび光源モジュール |
Citations (4)
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US20030215194A1 (en) | 2002-05-15 | 2003-11-20 | Kuhmann Jochen Friedrich | Optical device receiving substrate and optical device holding carrier |
JP2007328201A (ja) | 2006-06-08 | 2007-12-20 | Nippon Telegr & Teleph Corp <Ntt> | 光集積回路 |
JP2014238491A (ja) | 2013-06-07 | 2014-12-18 | 日東電工株式会社 | 光電気混載モジュール |
JP2015029043A (ja) | 2013-06-26 | 2015-02-12 | 京セラ株式会社 | 電子装置および光モジュール |
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JPH05341143A (ja) * | 1992-06-04 | 1993-12-24 | Hitachi Cable Ltd | 表面実装型双方向伝送用モジュール |
JPH08110446A (ja) * | 1994-10-12 | 1996-04-30 | Hitachi Ltd | 光伝送モジュール |
JPH0961651A (ja) * | 1995-06-14 | 1997-03-07 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリッド光集積回路 |
JP3147141B2 (ja) * | 1995-08-30 | 2001-03-19 | 株式会社日立製作所 | 光アセンブリ |
JP3758258B2 (ja) * | 1996-11-29 | 2006-03-22 | 富士通株式会社 | 光結合装置 |
JPH10308555A (ja) * | 1997-05-01 | 1998-11-17 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリッド導波形光回路とその製造方法 |
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US10551561B2 (en) * | 2018-01-25 | 2020-02-04 | Poet Technologies, Inc. | Optical dielectric waveguide structures |
-
2020
- 2020-05-28 CN CN202080063975.2A patent/CN114375501A/zh active Pending
- 2020-05-28 US US17/760,780 patent/US20220350097A1/en active Pending
- 2020-05-28 WO PCT/JP2020/021247 patent/WO2021065078A1/ja unknown
- 2020-05-28 EP EP20872805.5A patent/EP4040517A4/en active Pending
- 2020-05-28 JP JP2021501350A patent/JP6944085B2/ja active Active
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2021
- 2021-09-09 JP JP2021147118A patent/JP7238058B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030215194A1 (en) | 2002-05-15 | 2003-11-20 | Kuhmann Jochen Friedrich | Optical device receiving substrate and optical device holding carrier |
JP2007328201A (ja) | 2006-06-08 | 2007-12-20 | Nippon Telegr & Teleph Corp <Ntt> | 光集積回路 |
JP2014238491A (ja) | 2013-06-07 | 2014-12-18 | 日東電工株式会社 | 光電気混載モジュール |
JP2015029043A (ja) | 2013-06-26 | 2015-02-12 | 京セラ株式会社 | 電子装置および光モジュール |
Also Published As
Publication number | Publication date |
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US20220350097A1 (en) | 2022-11-03 |
WO2021065078A1 (ja) | 2021-04-08 |
EP4040517A4 (en) | 2023-10-25 |
JP6944085B2 (ja) | 2021-10-06 |
JP2022001947A (ja) | 2022-01-06 |
EP4040517A1 (en) | 2022-08-10 |
JPWO2021065078A1 (ja) | 2021-10-28 |
CN114375501A (zh) | 2022-04-19 |
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