JP7300794B2 - 光導波路パッケージおよび発光装置 - Google Patents
光導波路パッケージおよび発光装置 Download PDFInfo
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
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- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
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- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
- H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
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- Optical Couplings Of Light Guides (AREA)
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Description
第1面を有する基板と、
前記第1面上に位置し、前記第1面に対向する第2面と、該第2面の反対に位置する第3面と、を有するクラッドと、
該クラッド内に位置し、第1方向に延びているコアと、を備え、
前記クラッドは、前記第3面に開口しているとともに、前記第1面に向かう平面視で前記素子搭載部が位置する凹部を有し、
前記コアは、前記凹部に繋がっており、
前記凹部は、前記第3面と交わる壁面と、前記発光素子の角を支持する角部支持面と、を有し、
前記壁面は、第1壁面および第2壁面を有し、
前記角部支持面は、前記第1壁面および前記第2壁面と連続する第1角部支持面を有し、
前記第1壁面と同一平面に位置する面を第1仮想面とし、前記第2壁面と同一平面に位置する面を第2仮想面とし、前記平面視で前記第1仮想面と前記第2仮想面との交点を第1交点としたとき、
前記平面視において、前記第1角部支持面は、前記第1交点よりも前記凹部の中央側に位置している。
前記素子搭載部に位置する発光素子と、
前記コアから出射される光の光路上に位置するレンズと、を含んでいる。
2 第1面(上面)
3 クラッド
3a 第2面
3b 第3面
4 コア
4a,4b,4c 入射端面
5 光導波層
6 素子搭載部
7 内壁面
7a,7b,7c,7d 壁面
8 凹部
8a 第1辺
8b 第2辺
9ab,9bc,9cd,9ad 角部支持面
10 発光素子
11,11A 蓋体
15 電極(第1金属体)
17 シールリング(第2金属体)
18 仕切り
20 発光装置
41a,41b,41c 分割路
42 出射端面
43 合波部
44 統合路
45 レンズ
100,100A 光導波路パッケージ
200,200A 発光装置
Claims (13)
- 発光素子を搭載する素子搭載部を有する光導波路パッケージであって、
第1面を有する基板と、
前記第1面上に位置し、前記第1面に対向する第2面と、該第2面の反対に位置する第3面と、を有するクラッドと、
該クラッド内に位置し、第1方向に延びているコアと、を備え、
前記クラッドは、前記第3面に開口しているとともに、前記第1面に向かう平面視で前記素子搭載部が位置する凹部を有し、
前記コアは、前記凹部に繋がっており、
前記凹部は、前記第3面と交わる壁面と、前記発光素子の角を支持する角部支持面と、を有し、
前記壁面は、第1壁面および第2壁面を有し、
前記角部支持面は、前記第1壁面および前記第2壁面と連続する第1角部支持面を有し、
前記第1壁面と同一平面に位置する面を第1仮想面とし、前記第2壁面と同一平面に位置する面を第2仮想面とし、前記平面視で前記第1仮想面と前記第2仮想面との交点を第1交点としたとき、
前記平面視において、前記第1角部支持面は、前記第1交点よりも前記凹部の中央側に位置している、光導波路パッケージ。 - 前記壁面は、前記第3面と交わるとともに前記第1壁面と対向する第3壁面と、前記第3面と交わるとともに前記第2壁面と対向する第4壁面と、を有し、
前記角部支持面は、前記第3壁面と前記第4壁面と連続する第2角部支持面と、を有し、
前記第3壁面と同一平面に位置する面を第3仮想面とし、前記第4壁面と同一平面に位置する面を第4仮想面とし、前記平面視で前記第3仮想面と前記第4仮想面との交点を第2交点としたとき、
前記平面視において、前記第2角部支持面は、前記第1角部支持面と対向するとともに、前記第2交点よりも前記中央側に位置している、請求項1に記載の光導波路パッケージ。 - 前記角部支持面は、曲面である、請求項1または2に記載の光導波路パッケージ。
- 前記第1角部支持面の曲率半径は、前記発光素子に外接する円の直径の半分よりも小さい、請求項3に記載の光導波路パッケージ。
- 前記角部支持面は、平面である、請求項1または2に記載の光導波路パッケージ。
- 前記壁面は、前記中央に向かって突出している中間支持面を有する、請求項1~5のいずれか一つに記載の光導波路パッケージ。
- 前記凹部は、前記平面視で前記素子搭載部が位置する第1空間と、該第1空間に連なっている第2空間と、を有する、請求項1~6のいずれか一つに記載の光導波路パッケージ。
- 前記素子搭載部から前記第1面と前記第2面との間にかけて延びている第1金属体を有する、請求項1~7のいずれか一つに記載の光導波路パッケージ。
- 前記第3面に位置するとともに、前記凹部を囲んでいる第2金属体を有する、請求項1~8のいずれか一つに記載の光導波路パッケージ。
- 前記凹部の縁は、前記平面視で前記第2金属体と離れている、請求項9に記載の光導波路パッケージ。
- 前記凹部は、前記平面視で、前記コアに最も近い第1辺および該第1辺と反対に位置する第2辺を有し、
前記第1辺と前記第2金属体との距離は、前記第2辺と前記第2金属体との距離よりも大きい、請求項9または請求項10に記載の光導波路パッケージ。 - 前記凹部は、前記平面視で前記素子搭載部が複数位置するとともに、複数の前記素子搭載部を仕切っている仕切りを有し、
複数の前記素子搭載部は、前記平面視で前記第1方向に交わる第2方向に並んで位置し、隣接する素子搭載部は、前記平面視で段違いに位置する、請求項1~11のいずれか一つに記載の光導波路パッケージ。 - 請求項1~12のいずれか一つに記載の光導波路パッケージと、
前記素子搭載部に位置する前記発光素子と、
前記コアから出射される光の光路上に位置するレンズと、を含む発光装置。
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