WO2023038014A1 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- WO2023038014A1 WO2023038014A1 PCT/JP2022/033314 JP2022033314W WO2023038014A1 WO 2023038014 A1 WO2023038014 A1 WO 2023038014A1 JP 2022033314 W JP2022033314 W JP 2022033314W WO 2023038014 A1 WO2023038014 A1 WO 2023038014A1
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- Prior art keywords
- light
- emitting device
- clad
- core
- light emitting
- Prior art date
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- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
Definitions
- the present disclosure relates to a light emitting device.
- Patent Document 1 A conventional light-emitting device is described, for example, in Patent Document 1.
- a light emitting device of the present disclosure includes a substrate having a first surface; a device mounting region having a second surface located on the first surface and facing the first surface, and a third surface located opposite to the second surface, and opening to the third surface; a cladding having a core located within the cladding; a light emitting element positioned within the element mounting region; a lid covering the element mounting area,
- the cladding has a first portion inside which the core is located and a second portion facing the first portion across the element mounting region,
- the first portion includes a plurality of first protrusions located in a first region corresponding to the first portion of the third surface,
- the second portion includes a plurality of second protrusions positioned in a second area corresponding to the second portion of the third surface.
- FIG. 1 is an exploded perspective view showing a light emitting device according to a first embodiment; FIG. It is the perspective view which abbreviate
- FIG. 3 is a cross-sectional view of the light-emitting device seen from the cross-sectional line III-III in FIG. 2; FIG. 3 is a plan view of the light emitting device with the lid omitted. It is an enlarged plan view of the clad of the first embodiment. It is an enlarged side view of the clad of the first embodiment. It is an enlarged side view of the clad and lid of the first embodiment.
- FIG. 11 is an enlarged plan view of the clad of the third embodiment; It is an enlarged side view of the clad of the third embodiment. It is an enlarged side view of the clad and lid of the third embodiment. It is the top view which omitted the cover of the light-emitting device of 4th Embodiment.
- an optical element is mounted in a recessed notch provided in a clad on a substrate, and hermetically sealed with a sealing lid covering the notch.
- a surface flattening layer is provided on the surface and/or inside of the clad so as to surround the optical element mounting region. This minimizes the amount of adhesive that secures the sealing lid to the cladding surface.
- the light-emitting element is a heat source, and the heat generated by the light-emitting element is transferred to the clad. Since the light-emitting element is mounted near the core, a temperature difference occurs between the portion of the clad inside which the core is located and the other portion. Due to this temperature difference, the amounts of thermal expansion of the lid, the clad, and the bonding material are different, and there is a risk that the lid will partially separate from the clad, resulting in a decrease in airtightness.
- FIG. 1 is an exploded perspective view showing the light emitting device of the first embodiment
- FIG. 2 is a perspective view of the light emitting device with the lid omitted
- FIG. 3 is a cross-sectional view of the light-emitting device seen from the cross-sectional line III-III in FIG.
- FIG. 4 is a plan view of the light emitting device with the lid omitted.
- a light emitting device 200 of the first embodiment includes an optical waveguide package 100 , a light emitting element 10 positioned within an element mounting area 8 , and a lid 11 covering the element mounting area 8 .
- the light emitting device 200 of the first embodiment further includes a lens 45 located on the optical path of light emitted from the core 4 .
- the optical waveguide package 100 includes a substrate 1 having a first surface 2, a second surface 3a located on the first surface 2 and facing the first surface 2, and a third surface located opposite to the second surface 3a. 3b, and a clad 3 having an element mounting region 8 opening to the third surface 3b; and a core 4 located in the clad 3.
- the optical waveguide package 100 of the first embodiment further includes an external connection wiring 15 positioned on the first surface 2 of the substrate 1 .
- each light emitting element 10 is, for example, a light emitting diode (LED) that emits red (R) light, green (G) light, and blue (B) light.
- the optical waveguide layer 5 may be configured by integrally coupling the core 4 and the clad 3 .
- the substrate 1 may be a ceramic wiring substrate whose dielectric layer is made of a ceramic material.
- ceramic materials used in ceramic wiring boards include aluminum oxide sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, and glass ceramic sintered bodies.
- the substrate 1 may be, for example, an organic wiring substrate whose dielectric layer is made of an organic material.
- organic wiring boards include printed wiring boards, build-up wiring boards, and flexible wiring boards.
- organic materials used for organic wiring boards include epoxy resins, polyimide resins, polyester resins, acrylic resins, phenolic resins, and fluorine resins.
- the core 4 and clad 3 constitute an optical waveguide layer 5 .
- the optical waveguide layer 5 may be made of, for example, glass such as quartz, resin, or the like.
- the material constituting the optical waveguide layer 5 may be either glass or resin, or one of the core 4 and the clad 3 may be glass and the other resin.
- the core 4 and the clad 3 have different refractive indices, and the core 4 has a higher refractive index than the clad 3 . Using this difference in refractive index, the light is totally reflected at the interface between the core 4 and the clad 3 . That is, by forming a path with a material with a high refractive index and surrounding it with a material with a low refractive index, light can be confined within the core 4 with a high refractive index.
- the core 4 includes a plurality of dividing paths 41a, 41b, 41c having the incident end surfaces 4a to 4c as one end, and a plurality of dividing paths 41a, 41b, 41c between the plurality of incident end surfaces 4a, 4b, 4c and one output end surface 42. It has a multiplexing portion 43 where 41b and 41c meet, and an integration path 44 whose one end is the output end face 42 .
- Red (R) light, green (G) light, and blue (B) light emitted from each light-emitting element 10 enter split paths 41a, 41b, and 41c from incident end surfaces 4a, 4b, and 4c, and are combined. It is emitted from the emission end face 42 via the wave portion 43 and the integrated path 44 .
- the light emitting elements 10 are positioned within the element mounting area 8 so that the centers of the incident end faces 4a, 4b, 4c of the division paths 41a, 41b, 41c and the optical axes of the respective light emitting elements 10 are aligned.
- the element mounting region 8 may be a recess or a through hole that opens to the third surface 3 b of the clad 3 .
- the element mounting region 8 is a through-hole penetrating from the third surface 3b of the clad 3 to the second surface 3a.
- the bonding material 17 is positioned on the third surface 3 b of the clad 3 so as to surround the opening of the element mounting region 8 , and the bonding material 17 allows the cover 11 to adhere to the third surface 3 b of the clad 3 . spliced.
- the inside of the device mounting region 8 is hermetically sealed to protect the light emitting device 10 .
- the lid 11 is made of a glass material such as quartz, borosilicate, sapphire, or the like.
- the material of the bonding material 17 may be any material that can bond the clad 3 and the lid 11 and hermetically seal them. Metal-based nanoparticle paste, glass paste, or the like can be used.
- the lens 45 is positioned on the optical path of the light emitted from the core 4, and may collimate or converge the light emitted from the core 4.
- the lens 45 is, for example, a plano-convex lens having a plane entrance surface and a convex exit surface.
- the light emitting element 10 is connected to the external connection wiring 15 .
- the external connection wiring 15 is provided, for example, so as to extend from within the element mounting area 8 to outside the element mounting area 8 through between the second surface 3 a of the clad 3 and the first surface 2 of the substrate 1 .
- the electrode on the lower surface side is directly connected to the external connection wiring 15, and the electrode on the upper surface side is connected to the external connection wiring 15 via a bonding wire or the like.
- the light emitting element 10 has a single-sided electrode structure, two electrodes are directly connected to the external connection wiring 15 on the lower surface side.
- the light emitting element 10 is electrically connected to an external control circuit or the like via an external connection wiring 15, for example.
- FIG. 5A is an enlarged plan view of the clad 3 of the first embodiment
- FIG. 5B is an enlarged side view of the clad 3 of the first embodiment
- FIG. 5C is an enlarged side view of the clad 3 and lid 11 of the first embodiment.
- the clad 3 has a first portion 31 inside which the core 4 is located, and a second portion 32 facing the first portion 31 with the element mounting region 8 interposed therebetween.
- the first portion 31 includes a plurality of first projections 31a positioned in a first region corresponding to the first portion 31 of the third surface 3b.
- the second portion 32 includes a plurality of second protrusions 32a positioned in a second area corresponding to the second portion 32 of the third surface 3b.
- the core 4 of the light emitting element 10 is positioned inside the second portion 32 of the clad 3 in the element mounting region 8 so that the light emitted from the light emitting element 10 is incident on the incident end surfaces 4a, 4b, and 4c. It is mounted near the first portion 31 .
- the light-emitting element 10 is a heat source that generates heat during operation. That is, a temperature difference occurs between the first portion 31 and the second portion 32 . Since the clad 3 , the lid 11 , and the bonding material 17 are made of different materials, the amount of thermal expansion differs depending on the temperature difference between the first portion 31 and the second portion 32 , and the lid 11 partially separates from the clad 3 . may cause a decrease in airtightness.
- the first portion 31 has the first protrusions 31a and the second portion 32 has the second protrusions 32a. Since the bonding area between 17 and the clad 3 is increased, the bonding strength is improved and the decrease in airtightness can be reduced.
- the first convex portion 31a and the second convex portion 32a extend, for example, along the first direction in which the first portion 31 and the second portion 32 face each other, which is the direction in which the temperature difference occurs.
- the bonding material 17 can be deformed along the first protrusions 31a and the second protrusions 32a, and the stress caused by the thermal expansion can be relieved.
- the first direction is the horizontal direction in FIGS. 4 and 5A to 5C.
- the first protrusions 31a are positioned on the core 4 and are fewer in number than the second protrusions 32a, and the first protrusions 31a are narrower than the second protrusions 32a.
- 31a is higher than the second protrusion 32a. That is, the height h1 of the first protrusions 31a and the height h2 of the second protrusions 32a are the heights from the third surface 3b of the clad 3 .
- the width w1 of the first protrusion 31a and the width w2 of the second protrusion 32a are the lengths of the first protrusion 31a and the second protrusion 32a in the direction (second direction) orthogonal to the first direction.
- the first convex portion 31a and the second convex portion 32a may be formed by processing the third surface 3b of the clad 3 by, for example, a chemical method such as etching or a physical method such as cutting.
- a rod-shaped member, a strip-shaped member, or the like is arranged in the portions corresponding to the first portion 31 and the second portion 32 of the clad 3 to provide unevenness on the first surface 2. .
- unevenness following the unevenness of the first surface 2 of the substrate 1 is formed on the first portion 31 and the second portion 32 of the clad 3 .
- the convex portions of the unevenness become the first convex portion 31a and the second convex portion 32a.
- the first convex portion 31a and the second convex portion 32a can be similarly formed by arranging a rod-shaped member, a belt-shaped member, or the like inside the clad 3. As shown in FIG.
- the first convex portion 31 a can be formed so as to follow the core 4 arranged in the clad 3
- the second portion 32 the external core 4 arranged on the first surface 2 of the substrate 1 can be formed.
- the second protrusion 32 a can be formed so as to follow the connection wiring 15 .
- FIG. 6A is an enlarged plan view of the clad of the second embodiment.
- 6B and 6C are enlarged side views of the clad of the second embodiment.
- FIG. 6D is an enlarged side view of the clad and lid of the second embodiment; Since the second embodiment is the same as the first embodiment except that the structure of the clad 3 is different, description of other configurations will be omitted.
- the cladding 3 further has a third portion 33 located between the first portion 31 and the second portion 32 .
- the third portion 33 includes a third convex portion 33a located in a third area corresponding to the third portion 33 of the third surface 3b.
- the bonding area between the bonding material 17 and the clad 3 is further increased by having the third convex portion 33a, the bonding strength is improved and the decrease in airtightness can be reduced.
- the third convex portion 33a includes at least one of a convex portion 33a1 extending along a first direction in which the first portion 31 and the second portion 32 face each other and a convex portion 33a2 extending along a second direction orthogonal to the first direction. including In this embodiment, the third convex portion 33a includes a convex portion 33a1 extending along the first direction and a convex portion 33a2 extending along the second direction. The third convex portion 33a may include only the convex portion 33a1 or may include only the convex portion 33a2.
- the bonding material 17 can be deformed along two directions during thermal expansion, thereby further relaxing the stress caused by the thermal expansion. can be done.
- the third convex portion 33a includes the convex portion 33a1 extending along the first direction in which the first portion 31 and the second portion 32 face each other, and the convex portion 33a1 extending along the second direction orthogonal to the first direction.
- FIG. 7A is an enlarged plan view of the clad of the third embodiment.
- FIG. FIG. 7B is an enlarged side view of the clad of the third embodiment;
- FIG. 7C is an enlarged side view of the clad and lid of the third embodiment; Since the third embodiment is the same as the first embodiment except that the structure of the clad 3 is different, description of other configurations will be omitted.
- the clad 3 has a distance d1 from the second surface 3a to the first region of the third surface 3b shorter than a distance d2 from the second surface 3a to the second region of the third surface 3b. In other words, the thickness t1 of the first portion 31 is thinner than the thickness t2 of the second portion 32 .
- the thickness of the third portion 33 positioned between the first portion 31 and the second portion 32 may be the same as the first portion 31 or the second portion 32, for example.
- the portion of the third portion 33 on the second portion 32 side has the same thickness as the second portion 32
- the portion on the first portion 31 side has the same thickness as the first portion 31,
- the third portion 33 has a step.
- the thickness of the third portion 33 may be continuously reduced from the second portion 32 side toward the first portion 31 side. In this case, the third area of the third surface 3b becomes an inclined surface.
- FIG. 8 is a plan view showing the light emitting device of the fourth embodiment with the lid 11 omitted.
- the core 4 is composed of three split paths 41a, 41b, and 41c, and one integrated path 44 which joins at the multiplexing portion 43 and has one output end face 42. ing.
- the light-emitting device provided with the optical waveguide package of the fourth embodiment as shown in the plan view of FIG. good.
- the three incident end faces 4a, 44b, and 44c are aligned with the positions of the light emitting elements 10 so that the centers of the incident end faces 4a, 4b, and 4c of the three cores 44a, 44b, and 44c are aligned with the optical axes of the respective light emitting elements 10, respectively.
- 4b and 4c are the same in that they are located apart from each other.
- the output end faces 42a, 42b, 42c of the three cores 44a, 44b, 44c are positioned close to each other.
- Three cores 44a, 44b, and 44c are gathered so as to be close to each other between the incident end faces 4a, 4b, 4c and the emitting end faces 42a, 42b, 42c and extend parallel to the emitting end faces 42a, 42b, 42c.
- the emitted light from the emission end surfaces 42a, 42b, and 42c of each core may be emitted in parallel by one lens 45, for example.
- an external device may be used to synthesize an image or the like of the light emitted from the three emission end surfaces 42a, 42b, and 42c.
- the lid body 11 is joined so as to be parallel to the third surface 3b of the clad 3. Even if the third surface 3b of the clad 3 has steps or unevenness, these are absorbed by the bonding material 17, and the lid body 11 is kept parallel without tilting.
- the thickness of the first portion 31 of the clad 3 is thin and the thickness of the second portion 32 is thick. becomes thinner, and the lid body 11 is kept parallel without tilting. Since the amount of the bonding material 17 on the first portion 31 that becomes high temperature is larger than the amount of the bonding material 17 on the second portion 32 that becomes low temperature, the difference in the amount of thermal expansion of the bonding material 17 due to the temperature difference is reduced. be able to. As a result, peeling of the lid 11 can be reduced, and deterioration of airtightness can be reduced.
- the thickness of the bonding material 17 on the first portion 31 is increased, so that the light shielding property is improved, and light from between the lid 11 and the clad 3 is blocked. Light leakage can be reduced.
- the light emitting element 10 is not limited to a light emitting diode, and may be, for example, an LD (Laser Diode), a VCSEL (Vertical Cavity Surface Emitting Laser), or the like.
- LD Laser Diode
- VCSEL Vertical Cavity Surface Emitting Laser
- a substrate having a first surface; a device mounting region having a second surface located on the first surface and facing the first surface, and a third surface located opposite to the second surface, and opening to the third surface; a cladding having a core located within the cladding; a light emitting element positioned within the element mounting region; a lid covering the element mounting area,
- the cladding has a first portion inside which the core is located, and a second portion facing the first portion with the element mounting region interposed therebetween, The first portion includes a plurality of first protrusions located in a first region corresponding to the first portion of the third surface, The light-emitting device, wherein the second portion includes a plurality of second protrusions positioned in a second region corresponding to the second portion of the third surface.
- the first protrusion is located on the core;
- the number of the first convex portions is smaller than that of the second convex portions, the first convex portion is narrower than the second convex portion;
- the cladding further has a third portion positioned between the first portion and the second portion;
- the third convex portion includes a convex portion extending along a first direction in which the first portion and the second portion face each other, and a convex portion extending along a second direction orthogonal to the first direction.
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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Abstract
Description
前記第1面上に位置し、前記第1面に対向する第2面と、該第2面の反対に位置する第3面と、を有し、前記第3面に開口する素子搭載領域を有するクラッドと、
該クラッド内に位置するコアと、
前記素子搭載領域内に位置する発光素子と、
前記素子搭載領域を覆う蓋体と、を備え、
前記クラッドは、前記コアが内部に位置する第1部分と、前記素子搭載領域を挟んで前記第1部分と対向する第2部分と、を有し、
前記第1部分は、前記第3面の前記第1部分に相当する第1領域に位置する複数の第1凸部を含み、
前記第2部分は、前記第3面の前記第2部分に相当する第2領域に位置する複数の第2凸部を含む。
前記第1面上に位置し、前記第1面に対向する第2面と、該第2面の反対に位置する第3面と、を有し、前記第3面に開口する素子搭載領域を有するクラッドと、
該クラッド内に位置するコアと、
前記素子搭載領域内に位置する発光素子と、
前記素子搭載領域を覆う蓋体と、を備え、
前記クラッドは、前記コアが内部に位置する第1部分と、前記素子搭載領域を挟んで前記第1部分と対向する第2部分と、を有し、
前記第1部分は、前記第3面の前記第1部分に相当する第1領域に位置する複数の第1凸部を含み、
前記第2部分は、前記第3面の前記第2部分に相当する第2領域に位置する複数の第2凸部を含む、発光装置。
前記第1凸部は、前記第2凸部より数が少なく、
前記第1凸部は、前記第2凸部より幅が狭く、
前記第1凸部は、前記第2凸部より高さが高い、上記(1)に記載の発光装置。
前記第3部分は、前記第3面の前記第3部分に相当する第3領域に位置する第3凸部を含む、上記(1)または(2)に記載の発光装置。
2 第1面
3 クラッド
3a 第2面
3b 第3面
4;44a,44b,44c コア
4a,4b,4c 入射端面
5 光導波層
8 素子搭載領域
10 発光素子
11 蓋体
15 外部接続配線
17 接合材
31 第1部分
31a 第1凸部
32 第2部分
32a 第2凸部
33 第3部分
33a 第3凸部
33a1 凸部
33a2 凸部
41a 分割路
42;42a,42b,42c 出射端面
43 合波部
44 統合路
45 レンズ
100 光導波路パッケージ
200 発光装置
Claims (6)
- 第1面を有する基板と、
前記第1面上に位置し、前記第1面に対向する第2面と、該第2面の反対に位置する第3面と、を有し、前記第3面に開口する素子搭載領域を有するクラッドと、
該クラッド内に位置するコアと、
前記素子搭載領域内に位置する発光素子と、
前記素子搭載領域を覆う蓋体と、を備え、
前記クラッドは、前記コアが内部に位置する第1部分と、前記素子搭載領域を挟んで前記第1部分と対向する第2部分と、を有し、
前記第1部分は、前記第3面の前記第1部分に相当する第1領域に位置する複数の第1凸部を含み、
前記第2部分は、前記第3面の前記第2部分に相当する第2領域に位置する複数の第2凸部を含む、発光装置。 - 前記第1凸部は、前記コア上に位置し、
前記第1凸部は、前記第2凸部より数が少なく、
前記第1凸部は、前記第2凸部より幅が狭く、
前記第1凸部は、前記第2凸部より高さが高い、請求項1記載の発光装置。 - 前記クラッドは、前記第1部分と前記第2部分との間に位置する第3部分をさらに有し、
前記第3部分は、前記第3面の前記第3部分に相当する第3領域に位置する第3凸部を含む、請求項1または2記載の発光装置。 - 前記第3凸部は、前記第1部分と前記第2部分とが対向する第1方向に沿って延びる凸部および前記第1方向に直交する第2方向に沿って延びる凸部の少なくともいずれかを含む、請求項3記載の発光装置。
- 前記第2面から前記第3面の前記第1領域までの距離は、前記第2面から前記第3面の前記第2領域までの距離より短い、請求項1~4のいずれか1つに記載の発光装置。
- 前記コアから出射される光の光路上に位置するレンズ、を備える、請求項1~5のいずれか1つに記載の発光装置。
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Citations (6)
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JPH05341143A (ja) * | 1992-06-04 | 1993-12-24 | Hitachi Cable Ltd | 表面実装型双方向伝送用モジュール |
JPH10160976A (ja) * | 1996-11-29 | 1998-06-19 | Fujitsu Ltd | 光結合装置 |
JPH10308555A (ja) | 1997-05-01 | 1998-11-17 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリッド導波形光回路とその製造方法 |
JP2001108873A (ja) * | 1999-10-13 | 2001-04-20 | Fujitsu Ltd | 光伝送モジュール |
WO2021065078A1 (ja) * | 2019-09-30 | 2021-04-08 | 京セラ株式会社 | 光導波路パッケージおよび発光装置 |
US20210102860A1 (en) * | 2017-04-03 | 2021-04-08 | Indigo Diabetes N.V. | Hermeticity Testing of an Optical Assembly |
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KR20030094466A (ko) * | 2002-06-04 | 2003-12-12 | 주식회사일진 | 멀티포트형 광모듈 |
TWM617324U (zh) * | 2019-10-31 | 2021-09-21 | 佑勝光電股份有限公司 | 光學收發模組及光纖纜線模組 |
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- 2022-09-05 CN CN202280060624.5A patent/CN117980790A/zh active Pending
- 2022-09-07 TW TW111133888A patent/TWI836593B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05341143A (ja) * | 1992-06-04 | 1993-12-24 | Hitachi Cable Ltd | 表面実装型双方向伝送用モジュール |
JPH10160976A (ja) * | 1996-11-29 | 1998-06-19 | Fujitsu Ltd | 光結合装置 |
JPH10308555A (ja) | 1997-05-01 | 1998-11-17 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリッド導波形光回路とその製造方法 |
JP2001108873A (ja) * | 1999-10-13 | 2001-04-20 | Fujitsu Ltd | 光伝送モジュール |
US20210102860A1 (en) * | 2017-04-03 | 2021-04-08 | Indigo Diabetes N.V. | Hermeticity Testing of an Optical Assembly |
WO2021065078A1 (ja) * | 2019-09-30 | 2021-04-08 | 京セラ株式会社 | 光導波路パッケージおよび発光装置 |
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TWI836593B (zh) | 2024-03-21 |
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JPWO2023038014A1 (ja) | 2023-03-16 |
CN117980790A (zh) | 2024-05-03 |
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