JP7229382B2 - 半導体装置、電力変換装置および半導体装置の製造方法 - Google Patents

半導体装置、電力変換装置および半導体装置の製造方法 Download PDF

Info

Publication number
JP7229382B2
JP7229382B2 JP2021551071A JP2021551071A JP7229382B2 JP 7229382 B2 JP7229382 B2 JP 7229382B2 JP 2021551071 A JP2021551071 A JP 2021551071A JP 2021551071 A JP2021551071 A JP 2021551071A JP 7229382 B2 JP7229382 B2 JP 7229382B2
Authority
JP
Japan
Prior art keywords
sealing material
semiconductor element
circuit board
bent portion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021551071A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021070358A1 (https=
JPWO2021070358A5 (https=
Inventor
悠策 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2021070358A1 publication Critical patent/JPWO2021070358A1/ja
Publication of JPWO2021070358A5 publication Critical patent/JPWO2021070358A5/ja
Application granted granted Critical
Publication of JP7229382B2 publication Critical patent/JP7229382B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021551071A 2019-10-11 2019-10-11 半導体装置、電力変換装置および半導体装置の製造方法 Active JP7229382B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/040224 WO2021070358A1 (ja) 2019-10-11 2019-10-11 半導体装置、電力変換装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021070358A1 JPWO2021070358A1 (https=) 2021-04-15
JPWO2021070358A5 JPWO2021070358A5 (https=) 2022-01-14
JP7229382B2 true JP7229382B2 (ja) 2023-02-27

Family

ID=75438129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551071A Active JP7229382B2 (ja) 2019-10-11 2019-10-11 半導体装置、電力変換装置および半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP7229382B2 (https=)
WO (1) WO2021070358A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000100997A (ja) 1998-09-17 2000-04-07 Mitsubishi Electric Corp 樹脂封止型半導体装置およびその樹脂封止方法
JP2013058606A (ja) 2011-09-08 2013-03-28 Renesas Electronics Corp 半導体装置の製造方法
JP2017224778A (ja) 2016-06-17 2017-12-21 三菱電機株式会社 半導体装置
WO2018211751A1 (ja) 2017-05-18 2018-11-22 三菱電機株式会社 半導体モジュールおよび電力変換装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06333970A (ja) * 1993-05-21 1994-12-02 Seiko Epson Corp 半導体装置およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000100997A (ja) 1998-09-17 2000-04-07 Mitsubishi Electric Corp 樹脂封止型半導体装置およびその樹脂封止方法
JP2013058606A (ja) 2011-09-08 2013-03-28 Renesas Electronics Corp 半導体装置の製造方法
JP2017224778A (ja) 2016-06-17 2017-12-21 三菱電機株式会社 半導体装置
WO2018211751A1 (ja) 2017-05-18 2018-11-22 三菱電機株式会社 半導体モジュールおよび電力変換装置

Also Published As

Publication number Publication date
WO2021070358A1 (ja) 2021-04-15
JPWO2021070358A1 (https=) 2021-04-15

Similar Documents

Publication Publication Date Title
JP6399272B1 (ja) パワーモジュール及びその製造方法並びに電力変換装置
JP6826665B2 (ja) 半導体装置、半導体装置の製造方法及び電力変換装置
CN112204729B (zh) 半导体装置以及电力变换装置
US12136582B2 (en) Power module and power conversion device
JP7561677B2 (ja) 電力半導体装置、電力半導体装置の製造方法及び電力変換装置
JP7126609B2 (ja) パワー半導体モジュール及び電力変換装置
JP7101882B2 (ja) 半導体装置、電力変換装置および半導体装置の製造方法
JP2024013570A (ja) 半導体装置、半導体装置の製造方法および電力変換装置
JP7267468B2 (ja) 半導体モジュール及び電力変換装置
US11450594B2 (en) Semiconductor device and power converter
JP7132340B2 (ja) 半導体装置および電力変換装置
JP7229382B2 (ja) 半導体装置、電力変換装置および半導体装置の製造方法
JP7287164B2 (ja) 電力用半導体装置及び電力変換装置
US11855033B2 (en) Power semiconductor module and power converter
JP7176662B1 (ja) 半導体装置および電力変換装置
JP6851559B1 (ja) 半導体装置および電力変換装置
JP7270772B2 (ja) 半導体装置、電力変換装置および半導体装置の製造方法
JP7334369B1 (ja) パワーモジュール及び電力変換装置
JP7150183B2 (ja) 半導体装置、電力変換装置及び移動体
JP2022064644A (ja) 半導体装置および電力変換装置
WO2025009015A1 (ja) パワーモジュール及びその製造方法並びに電力変換装置
WO2024090278A1 (ja) 半導体装置、電力変換装置および半導体装置の製造方法
WO2025099830A1 (ja) パワー半導体装置、パワーモジュール及び電力変換装置
WO2022239154A1 (ja) パワーモジュールおよび電力変換装置
WO2022264215A1 (ja) 半導体装置および電力変換装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211008

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211008

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220726

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220920

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230117

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230214

R150 Certificate of patent or registration of utility model

Ref document number: 7229382

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250