JPWO2021070358A5 - - Google Patents
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- Publication number
- JPWO2021070358A5 JPWO2021070358A5 JP2021551071A JP2021551071A JPWO2021070358A5 JP WO2021070358 A5 JPWO2021070358 A5 JP WO2021070358A5 JP 2021551071 A JP2021551071 A JP 2021551071A JP 2021551071 A JP2021551071 A JP 2021551071A JP WO2021070358 A5 JPWO2021070358 A5 JP WO2021070358A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- connection portion
- semiconductor element
- bonding wire
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000003566 sealing material Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 239000008393 encapsulating agent Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/040224 WO2021070358A1 (ja) | 2019-10-11 | 2019-10-11 | 半導体装置、電力変換装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021070358A1 JPWO2021070358A1 (https=) | 2021-04-15 |
| JPWO2021070358A5 true JPWO2021070358A5 (https=) | 2022-01-14 |
| JP7229382B2 JP7229382B2 (ja) | 2023-02-27 |
Family
ID=75438129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021551071A Active JP7229382B2 (ja) | 2019-10-11 | 2019-10-11 | 半導体装置、電力変換装置および半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7229382B2 (https=) |
| WO (1) | WO2021070358A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06333970A (ja) * | 1993-05-21 | 1994-12-02 | Seiko Epson Corp | 半導体装置およびその製造方法 |
| JP2000100997A (ja) * | 1998-09-17 | 2000-04-07 | Mitsubishi Electric Corp | 樹脂封止型半導体装置およびその樹脂封止方法 |
| JP2013058606A (ja) * | 2011-09-08 | 2013-03-28 | Renesas Electronics Corp | 半導体装置の製造方法 |
| JP2017224778A (ja) * | 2016-06-17 | 2017-12-21 | 三菱電機株式会社 | 半導体装置 |
| WO2018211751A1 (ja) * | 2017-05-18 | 2018-11-22 | 三菱電機株式会社 | 半導体モジュールおよび電力変換装置 |
-
2019
- 2019-10-11 JP JP2021551071A patent/JP7229382B2/ja active Active
- 2019-10-11 WO PCT/JP2019/040224 patent/WO2021070358A1/ja not_active Ceased
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