JP7211571B2 - 銀用エッチング液、及びそれを用いたプリント配線板の製造方法 - Google Patents

銀用エッチング液、及びそれを用いたプリント配線板の製造方法 Download PDF

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Publication number
JP7211571B2
JP7211571B2 JP2022552335A JP2022552335A JP7211571B2 JP 7211571 B2 JP7211571 B2 JP 7211571B2 JP 2022552335 A JP2022552335 A JP 2022552335A JP 2022552335 A JP2022552335 A JP 2022552335A JP 7211571 B2 JP7211571 B2 JP 7211571B2
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JP
Japan
Prior art keywords
silver
layer
mass
etching
resin
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Active
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JP2022552335A
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English (en)
Japanese (ja)
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JPWO2022130991A5 (https=
JPWO2022130991A1 (https=
Inventor
昭太 新林
憲正 深澤
昭 村川
亘 冨士川
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DIC Corp
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DIC Corp
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Publication of JPWO2022130991A5 publication Critical patent/JPWO2022130991A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022552335A 2020-12-15 2021-12-02 銀用エッチング液、及びそれを用いたプリント配線板の製造方法 Active JP7211571B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020207422 2020-12-15
JP2020207422 2020-12-15
PCT/JP2021/044185 WO2022130991A1 (ja) 2020-12-15 2021-12-02 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022130991A1 JPWO2022130991A1 (https=) 2022-06-23
JPWO2022130991A5 JPWO2022130991A5 (https=) 2022-11-29
JP7211571B2 true JP7211571B2 (ja) 2023-01-24

Family

ID=82057567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022552335A Active JP7211571B2 (ja) 2020-12-15 2021-12-02 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Country Status (5)

Country Link
JP (1) JP7211571B2 (https=)
KR (1) KR20230121047A (https=)
CN (1) CN116601332A (https=)
TW (1) TW202231926A (https=)
WO (1) WO2022130991A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117904634A (zh) * 2023-12-05 2024-04-19 浙江奥首材料科技有限公司 一种耐高温半导体铂蚀刻液、其制备方法及应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020080178A1 (ja) 2018-10-17 2020-04-23 株式会社Adeka エッチング液組成物及びエッチング方法
WO2020171051A1 (ja) 2019-02-19 2020-08-27 Dic株式会社 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100440343B1 (ko) * 2002-04-03 2004-07-15 동우 화인켐 주식회사 고 선택성 은 식각용액-1
JP5046963B2 (ja) 2008-01-10 2012-10-10 矢崎総業株式会社 銀めっき層の有害金属分析方法
KR101518055B1 (ko) * 2008-10-30 2015-05-06 동우 화인켐 주식회사 금속막 에칭액 조성물
JP2012194024A (ja) * 2011-03-16 2012-10-11 Sumiko Techno-Research Co Ltd 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法
JP6207248B2 (ja) * 2013-06-17 2017-10-04 株式会社Adeka エッチング液組成物及びエッチング方法
EP2916627B1 (en) * 2013-08-29 2019-04-03 Hitachi Metals, Ltd. Method for manufacturing ceramic circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020080178A1 (ja) 2018-10-17 2020-04-23 株式会社Adeka エッチング液組成物及びエッチング方法
WO2020171051A1 (ja) 2019-02-19 2020-08-27 Dic株式会社 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Also Published As

Publication number Publication date
CN116601332A (zh) 2023-08-15
WO2022130991A1 (ja) 2022-06-23
TW202231926A (zh) 2022-08-16
KR20230121047A (ko) 2023-08-17
JPWO2022130991A1 (https=) 2022-06-23

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