JPWO2022130991A5 - - Google Patents
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- Publication number
- JPWO2022130991A5 JPWO2022130991A5 JP2022552335A JP2022552335A JPWO2022130991A5 JP WO2022130991 A5 JPWO2022130991 A5 JP WO2022130991A5 JP 2022552335 A JP2022552335 A JP 2022552335A JP 2022552335 A JP2022552335 A JP 2022552335A JP WO2022130991 A5 JPWO2022130991 A5 JP WO2022130991A5
- Authority
- JP
- Japan
- Prior art keywords
- etching solution
- mass
- silver layer
- solution according
- hydrogen peroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- 238000005530 etching Methods 0.000 claims 5
- 239000000243 solution Substances 0.000 claims 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 4
- 239000004332 silver Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020207422 | 2020-12-15 | ||
| JP2020207422 | 2020-12-15 | ||
| PCT/JP2021/044185 WO2022130991A1 (ja) | 2020-12-15 | 2021-12-02 | 銀用エッチング液、及びそれを用いたプリント配線板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022130991A1 JPWO2022130991A1 (https=) | 2022-06-23 |
| JPWO2022130991A5 true JPWO2022130991A5 (https=) | 2022-11-29 |
| JP7211571B2 JP7211571B2 (ja) | 2023-01-24 |
Family
ID=82057567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022552335A Active JP7211571B2 (ja) | 2020-12-15 | 2021-12-02 | 銀用エッチング液、及びそれを用いたプリント配線板の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7211571B2 (https=) |
| KR (1) | KR20230121047A (https=) |
| CN (1) | CN116601332A (https=) |
| TW (1) | TW202231926A (https=) |
| WO (1) | WO2022130991A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117904634A (zh) * | 2023-12-05 | 2024-04-19 | 浙江奥首材料科技有限公司 | 一种耐高温半导体铂蚀刻液、其制备方法及应用 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100440343B1 (ko) * | 2002-04-03 | 2004-07-15 | 동우 화인켐 주식회사 | 고 선택성 은 식각용액-1 |
| JP5046963B2 (ja) | 2008-01-10 | 2012-10-10 | 矢崎総業株式会社 | 銀めっき層の有害金属分析方法 |
| KR101518055B1 (ko) * | 2008-10-30 | 2015-05-06 | 동우 화인켐 주식회사 | 금속막 에칭액 조성물 |
| JP2012194024A (ja) * | 2011-03-16 | 2012-10-11 | Sumiko Techno-Research Co Ltd | 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法 |
| JP6207248B2 (ja) * | 2013-06-17 | 2017-10-04 | 株式会社Adeka | エッチング液組成物及びエッチング方法 |
| EP2916627B1 (en) * | 2013-08-29 | 2019-04-03 | Hitachi Metals, Ltd. | Method for manufacturing ceramic circuit board |
| JP7377212B2 (ja) * | 2018-10-17 | 2023-11-09 | 株式会社Adeka | エッチング液組成物及びエッチング方法 |
| KR102925602B1 (ko) * | 2019-02-19 | 2026-02-10 | 디아이씨 가부시끼가이샤 | 은용 에칭액, 및 그것을 이용한 프린트 배선판의 제조 방법 |
-
2021
- 2021-12-02 WO PCT/JP2021/044185 patent/WO2022130991A1/ja not_active Ceased
- 2021-12-02 KR KR1020237019066A patent/KR20230121047A/ko active Pending
- 2021-12-02 JP JP2022552335A patent/JP7211571B2/ja active Active
- 2021-12-02 CN CN202180081296.2A patent/CN116601332A/zh active Pending
- 2021-12-06 TW TW110145449A patent/TW202231926A/zh unknown
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