JPWO2022130991A1 - - Google Patents

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Publication number
JPWO2022130991A1
JPWO2022130991A1 JP2022552335A JP2022552335A JPWO2022130991A1 JP WO2022130991 A1 JPWO2022130991 A1 JP WO2022130991A1 JP 2022552335 A JP2022552335 A JP 2022552335A JP 2022552335 A JP2022552335 A JP 2022552335A JP WO2022130991 A1 JPWO2022130991 A1 JP WO2022130991A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022552335A
Other languages
Japanese (ja)
Other versions
JP7211571B2 (ja
JPWO2022130991A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022130991A1 publication Critical patent/JPWO2022130991A1/ja
Publication of JPWO2022130991A5 publication Critical patent/JPWO2022130991A5/ja
Application granted granted Critical
Publication of JP7211571B2 publication Critical patent/JP7211571B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022552335A 2020-12-15 2021-12-02 銀用エッチング液、及びそれを用いたプリント配線板の製造方法 Active JP7211571B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020207422 2020-12-15
JP2020207422 2020-12-15
PCT/JP2021/044185 WO2022130991A1 (ja) 2020-12-15 2021-12-02 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022130991A1 true JPWO2022130991A1 (https=) 2022-06-23
JPWO2022130991A5 JPWO2022130991A5 (https=) 2022-11-29
JP7211571B2 JP7211571B2 (ja) 2023-01-24

Family

ID=82057567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022552335A Active JP7211571B2 (ja) 2020-12-15 2021-12-02 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Country Status (5)

Country Link
JP (1) JP7211571B2 (https=)
KR (1) KR20230121047A (https=)
CN (1) CN116601332A (https=)
TW (1) TW202231926A (https=)
WO (1) WO2022130991A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117904634A (zh) * 2023-12-05 2024-04-19 浙江奥首材料科技有限公司 一种耐高温半导体铂蚀刻液、其制备方法及应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020080178A1 (ja) * 2018-10-17 2020-04-23 株式会社Adeka エッチング液組成物及びエッチング方法
WO2020171051A1 (ja) * 2019-02-19 2020-08-27 Dic株式会社 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100440343B1 (ko) * 2002-04-03 2004-07-15 동우 화인켐 주식회사 고 선택성 은 식각용액-1
JP5046963B2 (ja) 2008-01-10 2012-10-10 矢崎総業株式会社 銀めっき層の有害金属分析方法
KR101518055B1 (ko) * 2008-10-30 2015-05-06 동우 화인켐 주식회사 금속막 에칭액 조성물
JP2012194024A (ja) * 2011-03-16 2012-10-11 Sumiko Techno-Research Co Ltd 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法
JP6207248B2 (ja) * 2013-06-17 2017-10-04 株式会社Adeka エッチング液組成物及びエッチング方法
EP2916627B1 (en) * 2013-08-29 2019-04-03 Hitachi Metals, Ltd. Method for manufacturing ceramic circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020080178A1 (ja) * 2018-10-17 2020-04-23 株式会社Adeka エッチング液組成物及びエッチング方法
WO2020171051A1 (ja) * 2019-02-19 2020-08-27 Dic株式会社 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Also Published As

Publication number Publication date
CN116601332A (zh) 2023-08-15
WO2022130991A1 (ja) 2022-06-23
TW202231926A (zh) 2022-08-16
JP7211571B2 (ja) 2023-01-24
KR20230121047A (ko) 2023-08-17

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