CN116601332A - 银用蚀刻液及使用其的印刷配线板的制造方法 - Google Patents

银用蚀刻液及使用其的印刷配线板的制造方法 Download PDF

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Publication number
CN116601332A
CN116601332A CN202180081296.2A CN202180081296A CN116601332A CN 116601332 A CN116601332 A CN 116601332A CN 202180081296 A CN202180081296 A CN 202180081296A CN 116601332 A CN116601332 A CN 116601332A
Authority
CN
China
Prior art keywords
silver
layer
mass
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180081296.2A
Other languages
English (en)
Chinese (zh)
Inventor
新林昭太
深泽宪正
村川昭
富士川亘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN116601332A publication Critical patent/CN116601332A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202180081296.2A 2020-12-15 2021-12-02 银用蚀刻液及使用其的印刷配线板的制造方法 Pending CN116601332A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020207422 2020-12-15
JP2020-207422 2020-12-15
PCT/JP2021/044185 WO2022130991A1 (ja) 2020-12-15 2021-12-02 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN116601332A true CN116601332A (zh) 2023-08-15

Family

ID=82057567

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180081296.2A Pending CN116601332A (zh) 2020-12-15 2021-12-02 银用蚀刻液及使用其的印刷配线板的制造方法

Country Status (5)

Country Link
JP (1) JP7211571B2 (https=)
KR (1) KR20230121047A (https=)
CN (1) CN116601332A (https=)
TW (1) TW202231926A (https=)
WO (1) WO2022130991A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117904634A (zh) * 2023-12-05 2024-04-19 浙江奥首材料科技有限公司 一种耐高温半导体铂蚀刻液、其制备方法及应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030079322A (ko) * 2002-04-03 2003-10-10 동우 화인켐 주식회사 고 선택성 은 식각용액-1
KR20100048144A (ko) * 2008-10-30 2010-05-11 동우 화인켐 주식회사 금속막 에칭액 조성물
JP2012194024A (ja) * 2011-03-16 2012-10-11 Sumiko Techno-Research Co Ltd 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法
CN104233299A (zh) * 2013-06-17 2014-12-24 株式会社Adeka 蚀刻液组合物和蚀刻方法
US20160192503A1 (en) * 2013-08-29 2016-06-30 Hitachi Metals, Ltd. Method for producing ceramic circuit board
WO2020080178A1 (ja) * 2018-10-17 2020-04-23 株式会社Adeka エッチング液組成物及びエッチング方法
WO2020171051A1 (ja) * 2019-02-19 2020-08-27 Dic株式会社 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5046963B2 (ja) 2008-01-10 2012-10-10 矢崎総業株式会社 銀めっき層の有害金属分析方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030079322A (ko) * 2002-04-03 2003-10-10 동우 화인켐 주식회사 고 선택성 은 식각용액-1
KR20100048144A (ko) * 2008-10-30 2010-05-11 동우 화인켐 주식회사 금속막 에칭액 조성물
JP2012194024A (ja) * 2011-03-16 2012-10-11 Sumiko Techno-Research Co Ltd 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法
CN104233299A (zh) * 2013-06-17 2014-12-24 株式会社Adeka 蚀刻液组合物和蚀刻方法
US20160192503A1 (en) * 2013-08-29 2016-06-30 Hitachi Metals, Ltd. Method for producing ceramic circuit board
WO2020080178A1 (ja) * 2018-10-17 2020-04-23 株式会社Adeka エッチング液組成物及びエッチング方法
WO2020171051A1 (ja) * 2019-02-19 2020-08-27 Dic株式会社 銀用エッチング液、及びそれを用いたプリント配線板の製造方法
TW202037760A (zh) * 2019-02-19 2020-10-16 日商Ｄｉｃ股份有限公司 銀用蝕刻液、及使用其之印刷配線板之製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117904634A (zh) * 2023-12-05 2024-04-19 浙江奥首材料科技有限公司 一种耐高温半导体铂蚀刻液、其制备方法及应用

Also Published As

Publication number Publication date
WO2022130991A1 (ja) 2022-06-23
TW202231926A (zh) 2022-08-16
JP7211571B2 (ja) 2023-01-24
KR20230121047A (ko) 2023-08-17
JPWO2022130991A1 (https=) 2022-06-23

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