JP7194306B1 - アルミナ焼結体及び静電チャック - Google Patents

アルミナ焼結体及び静電チャック Download PDF

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JP7194306B1
JP7194306B1 JP2022119883A JP2022119883A JP7194306B1 JP 7194306 B1 JP7194306 B1 JP 7194306B1 JP 2022119883 A JP2022119883 A JP 2022119883A JP 2022119883 A JP2022119883 A JP 2022119883A JP 7194306 B1 JP7194306 B1 JP 7194306B1
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mass
sintered body
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alumina sintered
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JP2024017328A (ja
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希一郎 中村
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Krosaki Harima Corp
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Krosaki Harima Corp
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Priority to TW112121965A priority patent/TW202408968A/zh
Priority to KR1020230086351A priority patent/KR20240015570A/ko
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    • CCHEMISTRY; METALLURGY
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    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3225Yttrium oxide or oxide-forming salts thereof
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3232Titanium oxides or titanates, e.g. rutile or anatase
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    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
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    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3244Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3262Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3272Iron oxides or oxide forming salts thereof, e.g. hematite, magnetite
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3418Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint

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  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP2022119883A 2022-07-27 2022-07-27 アルミナ焼結体及び静電チャック Active JP7194306B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022119883A JP7194306B1 (ja) 2022-07-27 2022-07-27 アルミナ焼結体及び静電チャック
TW112121965A TW202408968A (zh) 2022-07-27 2023-06-13 氧化鋁燒結體及靜電吸盤
KR1020230086351A KR20240015570A (ko) 2022-07-27 2023-07-04 알루미나 소결체 및 정전 척

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JP2022119883A JP7194306B1 (ja) 2022-07-27 2022-07-27 アルミナ焼結体及び静電チャック

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JP2024017328A JP2024017328A (ja) 2024-02-08

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KR (1) KR20240015570A (ko)
TW (1) TW202408968A (ko)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099413A (ja) 2002-09-12 2004-04-02 Sodick Co Ltd セラミックスおよびその製造方法
JP2008024583A (ja) 2006-06-23 2008-02-07 Nippon Soken Inc アルミナ複合焼結体、その評価方法、及びスパークプラグ
JP2008260645A (ja) 2007-04-10 2008-10-30 Nitsukatoo:Kk 黒色アルミナ焼結体とその製造方法
JP2014220408A (ja) 2013-05-09 2014-11-20 新光電気工業株式会社 静電チャック及び半導体製造装置
JP2015104746A (ja) 2013-11-29 2015-06-08 日立金属株式会社 はんだ接合材料及びその製造方法
JP6738505B1 (ja) 2020-05-28 2020-08-12 黒崎播磨株式会社 静電チャック用誘電体
JP2020180020A (ja) 2019-04-25 2020-11-05 京セラ株式会社 黒色セラミックス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176966A (ja) * 1984-02-20 1985-09-11 日本特殊陶業株式会社 着色アルミナ磁器組成物
JPS6442359A (en) * 1987-08-11 1989-02-14 Narumi China Corp Black alumina ceramic composition
JP2772174B2 (ja) 1991-09-06 1998-07-02 茨城日本電気株式会社 磁気ディスク装置の磁気ヘッド固定機構
JPH05194024A (ja) * 1992-01-22 1993-08-03 Sumitomo Cement Co Ltd アルミナ基複合焼結体
JPH05238810A (ja) * 1992-02-27 1993-09-17 Onoda Cement Co Ltd 黒色アルミナ焼結体
JP3051603B2 (ja) * 1993-06-30 2000-06-12 京セラ株式会社 チタン化合物焼結体
JP3287149B2 (ja) * 1994-02-14 2002-05-27 松下電器産業株式会社 アルミナ質のセラミックス

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099413A (ja) 2002-09-12 2004-04-02 Sodick Co Ltd セラミックスおよびその製造方法
JP2008024583A (ja) 2006-06-23 2008-02-07 Nippon Soken Inc アルミナ複合焼結体、その評価方法、及びスパークプラグ
JP2008260645A (ja) 2007-04-10 2008-10-30 Nitsukatoo:Kk 黒色アルミナ焼結体とその製造方法
JP2014220408A (ja) 2013-05-09 2014-11-20 新光電気工業株式会社 静電チャック及び半導体製造装置
JP2015104746A (ja) 2013-11-29 2015-06-08 日立金属株式会社 はんだ接合材料及びその製造方法
JP2020180020A (ja) 2019-04-25 2020-11-05 京セラ株式会社 黒色セラミックス
JP6738505B1 (ja) 2020-05-28 2020-08-12 黒崎播磨株式会社 静電チャック用誘電体

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TW202408968A (zh) 2024-03-01
KR20240015570A (ko) 2024-02-05

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