JP7192674B2 - 樹脂シート - Google Patents

樹脂シート Download PDF

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Publication number
JP7192674B2
JP7192674B2 JP2019114937A JP2019114937A JP7192674B2 JP 7192674 B2 JP7192674 B2 JP 7192674B2 JP 2019114937 A JP2019114937 A JP 2019114937A JP 2019114937 A JP2019114937 A JP 2019114937A JP 7192674 B2 JP7192674 B2 JP 7192674B2
Authority
JP
Japan
Prior art keywords
resin
resin composition
support
composition layer
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019114937A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021000747A (ja
Inventor
啓之 阪内
千晴 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2019114937A priority Critical patent/JP7192674B2/ja
Priority to TW109119797A priority patent/TWI851739B/zh
Priority to KR1020200072327A priority patent/KR20200145709A/ko
Priority to CN202010558717.3A priority patent/CN112109402A/zh
Publication of JP2021000747A publication Critical patent/JP2021000747A/ja
Application granted granted Critical
Publication of JP7192674B2 publication Critical patent/JP7192674B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2019114937A 2019-06-20 2019-06-20 樹脂シート Active JP7192674B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019114937A JP7192674B2 (ja) 2019-06-20 2019-06-20 樹脂シート
TW109119797A TWI851739B (zh) 2019-06-20 2020-06-12 樹脂薄片、電路基板及半導體晶片封裝
KR1020200072327A KR20200145709A (ko) 2019-06-20 2020-06-15 수지 시트
CN202010558717.3A CN112109402A (zh) 2019-06-20 2020-06-18 树脂片材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019114937A JP7192674B2 (ja) 2019-06-20 2019-06-20 樹脂シート

Publications (2)

Publication Number Publication Date
JP2021000747A JP2021000747A (ja) 2021-01-07
JP7192674B2 true JP7192674B2 (ja) 2022-12-20

Family

ID=73799482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019114937A Active JP7192674B2 (ja) 2019-06-20 2019-06-20 樹脂シート

Country Status (3)

Country Link
JP (1) JP7192674B2 (zh)
KR (1) KR20200145709A (zh)
CN (1) CN112109402A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115135496A (zh) * 2020-03-31 2022-09-30 太阳油墨制造株式会社 结构体
JP2024000949A (ja) * 2022-06-17 2024-01-09 東洋インキＳｃホールディングス株式会社 導電性シート、電子部品及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014003044A1 (ja) 2012-06-29 2014-01-03 太陽ホールディングス株式会社 熱硬化型樹脂組成物および熱硬化型樹脂フィルム
JP2015061720A (ja) 2013-08-23 2015-04-02 味の素株式会社 部品封止用フィルムの製造方法
JP2016074788A (ja) 2014-10-03 2016-05-12 味の素株式会社 保護フィルム付き接着シートの製造方法
JP2019019231A (ja) 2017-07-18 2019-02-07 味の素株式会社 樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512850B2 (zh) * 1972-07-18 1976-01-29 Oji Yuka Synt Paper Co Ltd
US5772941A (en) * 1995-03-16 1998-06-30 Bando Chemical Industries, Ltd. Polyvinyl chloride resin sheets and production thereof
JP2001181411A (ja) * 1999-12-24 2001-07-03 Sumitomo Chem Co Ltd Ｐｔｐ包装用ポリプロピレン系樹脂シート
JP4900432B2 (ja) * 2009-07-21 2012-03-21 株式会社村田製作所 樹脂封止型電子部品の製造方法及び樹脂封止型電子部品の集合体
JP6492058B2 (ja) * 2014-03-31 2019-03-27 株式会社巴川製紙所 可撓性磁気吸着シート及びその製造方法
JP6903992B2 (ja) 2017-03-27 2021-07-14 味の素株式会社 封止用樹脂組成物および封止用シート
JP7279319B2 (ja) * 2017-09-04 2023-05-23 味の素株式会社 樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014003044A1 (ja) 2012-06-29 2014-01-03 太陽ホールディングス株式会社 熱硬化型樹脂組成物および熱硬化型樹脂フィルム
JP2015061720A (ja) 2013-08-23 2015-04-02 味の素株式会社 部品封止用フィルムの製造方法
JP2016074788A (ja) 2014-10-03 2016-05-12 味の素株式会社 保護フィルム付き接着シートの製造方法
JP2019019231A (ja) 2017-07-18 2019-02-07 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
TW202110633A (zh) 2021-03-16
CN112109402A (zh) 2020-12-22
JP2021000747A (ja) 2021-01-07
KR20200145709A (ko) 2020-12-30

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